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SEMI E79-0304 © SEMI 1999, 2004 1 SEMI E79-0304 SPECIFICATION FOR DEFINI TI ON AND MEAS UREMENT OF EQUIPMENT PRODUCTIVITY This specification was technically approved b y the Gl obal Metrics Committee and is the direct re…
SEMI E78-1102 © SEMI 1998, 2002 24
NOTE 3: Grounding methods to prevent the generation and
accumulation of static charge are not necessarily sufficient for
conduction at high frequencies, or to provide electrical safety.
R3-4.2 Static Dissipative Materials
R3-4.2.1 Insulators shall be replaced with grounded
static dissipative materials when feasible.
R3-4.3 Ionizers
R3-4.3.1 Charge on insulators or isolated conductors in
the product handling path, product, or reticles (if used
by the equipment to produce product) shall be
controlled with ionizers.
R3-4.3.2 Ionizer performance shall be measured using
ESD Association standard ANSI ESD STM3.1
Ionization. (Other national or international [IEC]
standards may be used.)
R3-4.4 Cleanroom Compatibility
If equipment or materials are to be installed in a
cleanroom, all static control system components shall
demonstrate compatibility with cleanroom class
requirements.
NOTE 4: The user may need to define cleanroom
compatibility requirements for static control materials here
(such as, particle shedding, outgassing, and chemical
compatibility) if such requirements are not defined elsewhere
in the purchasing document. (Reference ESD TR11-01 −
Electrostatic Guidelines and Considerations for Cleanrooms
and Clean Manufacturing)
R3-5 Compliance Testing
R3-5.1 Compliance testing shall be done by:
a) a capable independent third party, or
b) the equipment manufacturer, or
c) the end user
to demonstrate that the equipment meets the
recommendations for Level 2 (or 1, 3, or 4 as agreed
upon) contained in SEMI standard E78.
R3-5.2 Acceptance testing of the static control system
performance shall be performed at the actual
equipment use location.
R3-6 Referenced Standards
(The following ESD Association Standards and
Advisories
4
are referenced above. The may be other
equivalent national or international standards covering
these areas.)
ESD ADV1.0 — Glossary of Terms
4 ESD Association, 7900 Turin Road, Rome, NY 13440 USA.
ANSI ESD STM3.1 — Ionization
ANSI/ESD S6.1 — Grounding – Recommended
Practice
ESD SP10.1 — Automated Handling Equipment
ESD STM11.11 — Surface Resistance Measurement of
Static Dissipative Planar Materials
ANSI/ESD STM11.12 — Volume Resistance
Measurement of Static Dissipative Planar Materials
ESD TR11-01 — Electrostatic Guidelines and
Considerations for Cleanrooms and Clean
Manufacturing
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E79-0304 © SEMI 1999, 2004 1
SEMI E79-0304
SPECIFICATION FOR DEFINITION AND MEASUREMENT OF
EQUIPMENT PRODUCTIVITY
This specification was technically approved by the Global Metrics Committee and is the direct responsibility
of the North American Metrics Committee. Current edition approved by the North American Regional
Standards Committee on October 15, 2003 and December 4, 2003. Initially available at www.semi.org
February 2004; to be published March 2004. Originally published February 1999; last published February
2000.
1 Purpose
1.1 The document provides metrics for measuring
equipment productivity.
2 Scope
2.1 The document defines metrics and calculations for
measurement of equipment productivity.
2.2 In the context of this document, it is important to
note that “equipment productivity” is impacted greatly
by factors far beyond the equipment itself, including
operator, recipe, facilities, material availability,
scheduling requirements, etc.
2.3 Effective application of this specification requires
that equipment performance is tracked using the metrics
for Equipment Reliability, Availability, and
Maintainability (RAM) established in SEMI E10.
Additionally, the Automated Reliability, Availability,
and Maintainability Standard (ARAMS) SEMI E58 can
be used for equipment with ARAMS capability.
Productivity metrics for flexible-sequence cluster tools
require tracking of SEMI E10 equipment states and
recipes at the level of individual processing modules.
The Equipment Performance Tracking (EPT) Standard
SEMI E116 assists SEMI E79 by providing the status
of the major modules of the equipment allowing
performance metrics to be tracked at the module level.
SEMI E116 also assists SEMI E79 by providing task-
level detail of the equipment or module’s current
activity, allowing performance metrics to be tracked at
the task level. Productivity performance of a flexible-
sequence cluster tool is then calculated as the aggregate
productivity performance of its individual processing
modules.
2.4 This document is currently limited to measuring
equipment productivity using Overall Equipment
Efficiency (OEE) as the metric, and does not address
the impact of productivity changes on cost, cycle time,
or other measures. This document does not address any
RAM issues over and above those in SEMI E10.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E10 — Specification for Definition and
Measurement of Equipment Reliability, Availability,
and Maintainability (RAM)
SEMI E38 — Cluster Tool Module Communications
(CTMC)
SEMI E58 — Automated Reliability, Availability, and
Maintainability Standard (ARAMS): Concepts,
Behavior, and Services
SEMI E116 — Provisional Specification for Equipment
Performance Tracking
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Terminology Applicable to Computation of the
OEE Metric
4.1.1 actual unit output (units) — the number of units
processed by the equipment during production time.
4.1.2 availability efficiency (time divided by time) —
the fraction of total time that the equipment is in a
condition to perform its intended function.
4.1.3 cluster tool — a manufacturing system made up
of integrated processing modules mechanically linked
together (the modules may or may not come from the
same supplier) (SEMI E10).
4.1.4 downtime (equipment downtime) (time) — the
time when the equipment is not in a condition, or is not
available, to perform its intended function. It does not
include any portion of non-scheduled time (SEMI E10).
4.1.5 effective unit output (units) — the number of
units processed by the equipment during production
time that were of acceptable quality, i.e., actual unit
output less equipment assignable rework and equipment
assignable scrap.
SEMI E79-0304 © SEMI 1999, 2004 2
4.1.6 equipment-assignable rework (units) — any units
being reworked due to a fault or defect assignable to the
subject equipment. The units may be reworked at the
equipment where the fault or defect occurred, or at
other equipment.
4.1.7 equipment-assignable scrap (units) — any units
that are permanently removed from production due to a
fault or defect assignable to the subject equipment. The
units may be removed from production at the operation
where the fault or defect occurred, or at a subsequent
operation.
4.1.8 equipment module — an indivisible entity within
a system.
4.1.9 fixed-sequence cluster tool — a cluster tool in
which all units of production visit all processing
modules making up the tool in a fixed sequence.
1
4.1.10 flexible-sequence cluster tool — a cluster tool in
which the units of production visit a subset of the
processing modules of the tool in sequences that may
vary from unit to unit. In such tools, the processing
modules that are engaged in processing activity vary
from unit to unit according to dispatching decisions
made by software internal to the tool (CSM 42).
4.1.11 non-processing module — an equipment entity
that supports the movement or conditioning of units
through the system, such as,
• robotic handler
• load/unload lock
• pre-aligner
4.1.12 non-scheduled time (time) — time when the
equipment is not scheduled to be used in production
(SEMI E10).
4.1.13 operational efficiency (time divided by time) —
the fraction of equipment uptime that the equipment is
processing actual units.
4.1.14 operations time (time) — total time minus non-
scheduled time (SEMI E10).
4.1.15 overall equipment efficiency (OEE) (time
divided by time) — a metric of equipment performance,
expressing the theoretical production time for the
effective unit output divided by the total time.
2
.
NOTE 1: The overall equipment efficiency metric accounts
for all losses that reduce equipment performance from its
1 CSM 42: Productivity Metrics for Flexible-Sequence Cluster
Tools,
Engineering Systems Research Center, University of
California, Berkeley, 1998
2 CSM 21: Closed-Loop Measurement of Equipment Efficiency and
Equipment Capacity, Engineering Systems Research Center,
University of California, Berkeley, 1997.
maximum potential performance taking the existing
equipment design and recipe specifications as given.
4.1.16 performance efficiency (time divided by time)
— the fraction of equipment uptime that the equipment
is processing actual units at theoretically efficient rates.
4.1.17 processing module — an indivisible production
entity within an equipment system, e.g., a processing
chamber or station within a cluster tool.
4.1.18 processing module recipe — all processing
steps of a recipe performed within a single processing
module without requiring reloading of that processing
module (CSM 42).
4.1.19 production time (time) — sum of all periods of
time in which a processing module is performing its
intended function.
• For a non-cluster tool, a fixed-sequence cluster
tool, or an individual processing module within a
flexible-sequence cluster tool, production time is
equivalent to the SEMI E10 productive time for
that entity.
• For a flexible-sequence cluster tool, production
time is the sum of the productive times of all
processing modules encompassed by the cluster
tool (CSM 42).
4.1.20 productive state — a period of time (productive
time) when the equipment is performing its intended
function (SEMI E10).
4.1.21 quality efficiency (time divided by time) — the
theoretical production time for Effective Units divided
by the theoretical production time for Actual Units.
4.1.22 rate efficiency (time divided by time) — the
fraction of production time that equipment is
processing actual units at theoretically efficient rates.
4.1.23 recipe — the pre-planned and reusable portion
of the set of instructions, settings, and parameters under
control of a processing agent that determines the
processing environment seen by the material. Recipes
may be subject to change between runs or processing
cycles (SEMI E38).
4.1.24 system — an integrated structure of components
and subsystems capable of performing, in aggregate,
one or more specific functions. For the purpose of this
specification, a system consists of one or more
processing or non-processing modules.