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SEMI G37-88 © SEMI 198 6, 1988 3 Figure 1 Cavity to Fram e Offset Figure 2 Cavity Mism atch Figure 3 Parting Lin e Protrusions

SEMI G37-88 © SEMI 1986, 1988 2

8. The type of molding press to be used, including

power requirements.

9. Applicable leadframe drawing, including all

dimensions.

5 Dimensions

5.1 Drawing must show dimension for the following

items, if applicable:

1. Package length

2. Package width

3. Top cavity thickness

4. Bottom cavity thickness

5. Frame thickness

6. Ejector top locations from cavity centerline

7. Ejector bottom locations from cavity centerline

8. Ejector size (top and bottom)

9. Ejector depth (top and bottom, draft angle top side,

bottom side, and end)

10. End notch shape, depth, width, length

11. Pin 1 ID location from package center

12. Pin 1 ID shape and size

13. Corner radius or sides

14. Corner radius or ends

15. Lead spread (nominal)

16. Shoulder bend location

17. Shoulder width

6 Product Criteria — Dimen sional Tolerance

Limits for S.O. Packages

6.1 In recognizing that every manufacturing process is

subject to variation, the following list details the

acceptable limit of this variation:

CAVITY MISMATCH

(See Figure 2) 0.05 mm (0.002")

PACKAGE/FRAME OFFSET

(See Figure 1), (excluding leadframe

tolerances)

0.05 mm (0.002")

MOLDED PROTRUSIONS

(See Figure 3) Parting line 0.15 mm (0.006")

Top or bottom 0.025 mm (0.001")

VARIATION IN LEAD LOCATION

(See Figure 3) 0.101 mm (0.004")

SHOULDER INTRUSIONS AND

PROTRUSIONS

Intrusions 0.025 mm (0.001")

Protrusions* 0.004"

PACKAGE WARPAGE

Warp factor: 2.5

LEAD CO-PLANARITY

0.003" (maximum)

EJECTOR PIN DEPTH

0.003"

* Assumes 0.002" design protrusion.

7 Sampling

Samples used to determine compliance to Section 6

shall be determined between user and supplier.

8 Packaging

Tooling must be packed in containers designed and

constructed to prevent damage and/or contamination.

Specific protection must be provided if tooling is to be

shipped any great distance.

SEMI G37-88 © SEMI 1986, 19883

Figure 1

Cavity to Frame Offset

Figure 2

Cavity Mismatch

Figure 3

Parting Line Protrusions

Figure 4

Package Warpage Warp in mils/Length in Inches = Warp Factor

Figure 5

Shoulder Bend Location

Figure 6

Lead Co-planarity

NOTICE: These standards do not purport to address safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish appropriate safety and health practices and determine the

applicability of regulatory limitations prior to use. SEMI makes no warranties or representations as to the suitability

of the standards set forth herein for any particular application. The determination of the suitability of the standard is

solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are

subject to change without notice.

The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted

material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights and

the risk of infringement of such rights, are entirely their own responsibility.

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