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SEMI P4-92 © SEMI 1983, 1999 1 SEMI P4-92 (Reapproved 0299) SPECIFICATION FOR ROUND QUAR TZ PHOTOMASK SUBSTRATES This specificati on was technically r eapproved by the Mask & Mask Equipm ent Committee and is the di r…

SEMI P3-0298 © SEMI 1982, 19983

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer's

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user's attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International),

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the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI P4-92 © SEMI 1983, 1999 1

SEMI P4-92 (Reapproved 0299)

SPECIFICATION FOR ROUND QUARTZ PHOTOMASK SUBSTRATES

This specification was technically reapproved by the Mask & Mask Equipment Committee and is the direct

responsibility of the North American Microlithography Committee. Current edition approved by the North American

Regional Standards Committee in October 1998. Initially available at www.semi.org February 1999; to be published

February 1999. Originally published in 1983; previously published in 1996.

Editorial changes were made to the following: Sections: 2.2, 6.2, and 13.1, Tables 3, 4 and 5, and Figure 5.

General Requirements

1. Preface

This specification covers the general requirements of

the quartz round substrate for hard surface photomasks.

2. Applicable Documents

2.1 ASTM Standards

ASTM E 122  Recommended Practice for Choice of

Sample Size to Estimate the Average Quality of a Lot

or Process

ASTM E 228  Standard Test Method for Linear

Thermal Expansion of Rigid Solids with a Vatreous

Silical Dilatometer

2.2 ISO Standard

ISO 14644-1  Cleanrooms and Associated Controlled

Environments Part 1: Classification of Air Cleanliness

2.3 Military Specifications

MIL-STD-105  Sampling Procedure and Tables for

Inspection and Attributes

3. Terminology

None.

4. Ordering Information

Purchase orders for hard surface photomask substrates

furnished to this specification shall include the

following:

Dimensions (See Section 5)

1 American Society for Testing and Materials, 100 Barr Harbor

Drive, West Conshohoken, PA 19428-2959

2 ISO Central Secretariat, 1, rue de Varembé, C.P. 56, CH-1211

Genève 20, Switzerland

3 Military Standards, Naval Publications and Form Center, 5801

Tabor Avenue, Philadelphia, PA 19120

Material (See Section 6)

Flatness Criteria (See Section 7)

Visual Criteria (See Section 8)

Lot Acceptance (See Section 9)

5. Dimensions and Permissible Variations

The material shall conform to the dimensions and

dimensional tolerances as specified in Tables 1 and 5,

Dimensions for Round Quartz Photomask Substrates.

6. Material Specifications (ULTE glass only)

6.1 Thermal Characteristics 0

−

300

6.1.1 100% Quartz Material  Coefficient of

expansion 5.5 × 10

-7

/°C.

6.1.2 Less Pure Quartz  Coefficient of expansion

less than 7.5 × 10

-7

/°C.

6.2 Transmission Characteristics

Wave Lengths

Minimum % @ 1.5 mm

Thickness

200 nm To be agreed upon between

user and supplier.

230 nm To be agreed upon between

user and supplier.

254 nm To be agreed upon between

user and supplier.

365 nm To be agreed upon between

user and supplier.

405 nm To be agreed upon between

user and supplier.

4 After correction for surface reflection

SEMI P4-92 © SEMI 1983, 1999 2

6.3 Physical Properties  Information on the

following properties is provided for information only.

(See Appendix 1.)

6.3.1 Poisson' s Ratio

6.3.2 Density

6.3.3 Young' s Modulus

6.3.4 Modulus of Elasticity

6.3.5 Index of Refraction

6.3.6 Volume Restivity

7. Flatness Area (for one side only)

7.1 Flatness Quality Area

7.1.1 Circular Flatness Quality Area  (See Tables 2

and 5.)

8. Visual Criteria (one side only)

8.1 Quality Area  (See Tables 2 and 5.)

Plate Diameter Quality Area (Diameter)

125 mm 113 mm

150 mm 138 mm

8.2 Defect Limits  Defects and allowable number of

each type are listed in Table 4.

8.2.1 Terminology for SEMI P4  Unless otherwise

noted, the SEMI Terms and Definitions Relating to the

Microlithography Industry shall be used.

8.2.2 Minimal Conditions or Dimensions  Mini-mal

conditions or dimensions for defects are listed in Table

4 and shall be used for determining substrate

acceptability unless other minimal limiters are agreed

upon by the interested parties.

8.2.3 Photomask Substrate Edge Criteria  (See

Table 3.)

8.3 Identification  To be agreed upon between the

user and supplier.

9. Sampling

Unless otherwise specified, ASTM E 122 shall be used.

When so specified, appropriate samples sizes shall be

selected from each lot in accordance with MIL-STD-

105D. Each quality characteristic shall be assigned an

acceptable quality level (AQL) and lot total percent

defective (LTPD) value in accordance with MIL-STD-

105D. Definitions for critical, major and minor

classifications may alternatively be assigned cumulative

AQL and LTPD values. Inspection levels shall be

agreed upon between the user and supplier.

10. Test Methods

10.1 Thermal Expansion  Determine in accordance

with ASTM E 228.

10.2 Transmission  (To be agreed upon between the

user and supplier).

10.3 Flatness  (To be agreed upon between the user

and supplier).

10.4 Visual  (To be agreed upon between the user

and supplier.)

10.5 Roundness  2 readings at 90° with appropriate

tool such as Vernier Caliper or equivalent. Roundness

values not specified at this time.

11. Handling

Substrates are to be handled on the edges only.

Substrates are to be handled only with clean room

approved gloves.

12. Certification

Upon request of the purchaser in the contract or order, a

manufacturer' s or supplier' s certification that the

material was manufactured and tested in accordance

with this specification together with a report of the test

results shall be furnished at the time of shipment.

13. Packing and Marking

13.1 Substrates shall be packed in a class 100

environment as defined by ISO 14644-1. Containers

shall be designed to prevent glass-to-glass contact and

to protect the substrates from contamination in handling

and transit. Substrates shall be shipped with the

acceptable flatness side toward the front of the box.

This orientation shall be indicated on each container.

Packaging shall comply with the applicable

international, national, state, and local laws and

regulations required for shipping.

13.2 Containers shall be labeled " Warning: Open and

Handle Under Clean Room Conditions Only." Each

shipment shall be identified by user purchase order

number, drawing number (if applicable), quantity,

vendor lot number and material identification.