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SEMI E43-0301 © SEMI 1995 , 2001 10 A P PENDIX 1 MEA SUREMENT SELECTION M A TRIX NOT E: T h is appe ndix offe rs inf o rma tion relate d to selecting t he appropriate measurem ent methods f rom those c ontained in this d…

SEMI E43-0301 © SEMI 1995, 20019

items susceptible to discharges equal to or greater than

100 V HBM.

ESD SP10.1 — Automated Handling Equipment. This

document covers test methods for evaluating the ESD

ground integrity of automated handling equipment as

well as charge generation, and charge accumulation on

devices in automated handling equipment.

12.2 ESD Association Advisory Documents

ESD ADV1.0 — Glossary of Terms. Definitions and

explanations of various terms used in Association

Standards and documents are covered in this advisory.

It also includes other terms commonly used in the ESD

industry.

ESD ADV2.0 — ESD Handbook. The ESD Handbook is

a complete guide to static control in the work place.

Nineteen chapters cover ESD basics, control

procedures, auditing, symbols, device testing, and

standards.

ESD ADV11.2 — Triboelectric Charge Accumulation

Testing. The complex phenomenon of triboelectric

charging is discussed in this Advisory. It covers the

theory and effects of tribocharging. It reviews

procedures and problems associated with various test

methods that are often used to evaluate

triboelectrification characteristics.

12.3 Other Related Documents

12.3.1 Military Standards

MIL-STD-1686C: ESD Control Program for Protection

of Electrical and Electronic Parts, Assemblies and

Equipment (Excluding Electrically Initiated Devices).

This military standard establishes requirements for ESD

control programs. It applies to U.S. military agencies,

contractors, subcontractors, suppliers, and vendors. It

requires the establishment, implementation, and

documentation of ESD control programs for static-

sensitive devices but does not mandate or preclude the

use of any specific ESD control materials, products, or

procedures.

MIL-HDBK-263B: ESD Control Handbook for

Protection of Electrical and Electronic Parts,

Assemblies and Equipment (excluding Electrically

Initiated Explosive Devices). This reference provides

guidance, but not mandatory requirements, for the

establishment and implementation of an ESD control

program in accordance with the requirements of MIL-

STD-1686.

2 Naval Publication and Forms Center, 5801 Tabor Avenue,

Philadelphia PA 19120 U.S.A

12.3.2 JEDEC Standards

JESD625A: Requirements for Handling ESD-Sensitive

Devices. This voluntary standard establishes minimum

requirements for ESD control methods and materials

designed to protect electronic devices having Human

Body Model (HBM) sensitivities of 200 V or greater. It

is intended for use by semiconductor distributors,

semiconductor processing and testing facilities, and

semiconductor end users.

12.3.3 EIA Standards

EIA 541 – Packaging Material Standards for ESD

Sensitive Items — This standard presents requirements

and tests methods for selecting packaging materials to

be used with ESD sensitive devices.

EIA 583 – Packaging Material Standards for Moisture

Sensitive Items — This standard contains information

regarding packaging materials used for the protection of

ESD sensitive items when moisture levels are also

important.

EN100015: Protection of Electrostatic Sensitive. This

European Norm covers ESD handling practices for

electronic devices.

12.3.4 IEC Standards

IEC 61000-4-2 – Transient Immunity Standard. This

IEC document provides requirements and test methods

for ESD transient immunity.

IEC 61340-5-1:1998, Electrostatics, Part 5-1:

Protection of Electronic Devices from Electrostatic

Phenomena-General Requirements. This IEC

(International Electrotechnical Commission) document

provides guidance for establishing a static control

program.

IEC 61340-5-2:1999, Protection of Electronic Devices

from Electrostatic Phenomena-Users Guide. This IEC

handbook supplement the information contained in Part

5-1 above.

3 Joint Electron Device Engineering Council, 2500 Wilson Blvd.,

Arlington, VA 22201, website: www.jedec.org

4 EIA Engineering Department, Standards Sales Office, 2001 Eye

Street, NW, Washington, D.C. 20006, website: www.eia.org

5 International Electrotechnical Commission, 3, rue de Varembé,

Case postale 131, CH-1211 Genève 20, Switzerland, website:

www.iec.ch

SEMI E43-0301 © SEMI 1995, 2001 10

APPENDIX 1

MEASUREMENT SELECTION MATRIX

NOTE: This appendix offers information related to selecting the appropriate measurement methods from those contained in this

document. It was approved as an official part of SEMI E43 by full letter ballot procedure.

A1-1 The matrix contained in Table A1-1 is intended to assist in the selection of an appropriate measurement

method for static charge. Users should note that a variety of measurement methods is available for any given

situation. Consult manufacturers of the equipment for additional information concerning its proper use and

applicability.

Table A1-1 Measurement Method Recommendations

Object Electrostatic

Fieldmeter

Charged Plate

Monitor

Electrostatic

Voltmeter

Electrometer Coulombmeter Oscilloscope EMI

Detector

Small

object/device

charge

XX X

Surface charge X X

Ionization system

charge

neutralization

XXX

ESD event

detection

XXX

Human body

voltage

XXX

Product cart

charge level

XXX

Chair charge level X X X

Charge decay X X X X

Product material

handling

XXX

Ionizer Offset

Voltage (Balance)

Wafer charge X X X

Process

equipment –

Charge and ESD

generation

XXX X

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacture's instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

By publications of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights are entirely their own responsibility.

RELATED INFORMATION 1

NOTES ON EQUIPMENT

NOTE: This related information is not an official part of this standard. However, it contains relevant information for using the

standard in situations commonly encountered with semiconductor manufacturing facilities and equipment. Determination of the

suitability of the material is solely the responsibility of the user.

R1-1 A charged conductive plate establishes a uniform

electrostatic field as long as measurements are not made

close to the edges and the measurement distance is

small relative to the dimensions of the plate. This

specification requires meters capable of making field

measurements at a distance of 2.54 cm (1 inch) or less

from a 15 cm (6 inch) square plate as a practical means

to ensure performance verification to a known field.

R1-2 Charged plate monitors using 15 cm square plates

with a 20 picofarad capacitance are commonly used to

determine the performance of air ionization systems.

Isolators are used to assure minimal leakage to ground.

A 15 cm square plate of any metal approximately 1 mm

thick and isolated from adjacent surfaces using

insulative standoffs is a perfectly acceptable substitute.

R1-3 The verification procedure is intended to ensure

that the meter used does not drift excessively (less than

5% in 5 minutes) and can repeatedly measure a known

field to within 5%. When actually using the meter to do

a field survey, maintaining the correct distance from the

sensor head to the surface or object being measured

becomes the greatest source of error. If the ability of the

meter operator to maintain the correct distance is within

10%, then the total error of the measurement would be

within about 12% using this calibration procedure

(RMS of the 5% drift, 5% repeatability, and 10%

distance errors).

R1-4 If two operators using two different meters

follow the verification procedure, and they both are

able to maintain the correct distance to within 10% as

above, then they both would be within 12% of the true

field strength when measuring the same surface or

object. Taking the RMS of these errors, the two

operators using two meters should be within 17% of

each other.

R1-5 Many meters read out in volts/inch. 100

volts/inch is about 4,000 volts/m.