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SEMI E106-1104 © SEMI 2000, 2004 3 SEMI E99.1 — Specification for SECS-I and SECS-II Protocol fo r Carrier ID Reader/Writer Functional Standard SEMI E100 — Specification for a Reticle SMIF Pod (RSP) Used to Transport and…

SEMI E106-1104 © SEMI 2000, 2004 2

3 Limitations

3.1 300 mm Only — This document only covers SEMI

standards that are specific to 300 mm, even though

other standards may apply to 300 mm equipment. For

example, standards not described here include:

 metrics documents such as SEMI E10;

 minienvironment documents such as SEMI E45

and and SEMI E46;

 facilities documents such as SEMI E70;

 reticle handling documents such as SEMI E100

which specifies a reticle SMIF pod for 6-inch or

230 mm reticles based on SEMI E19.4; or

 safety documents such as SEMI S2, SEMI S8,

SEMI S11 and an upcoming Safety Guideline for

Unmanned Transport Vehicle (UTV) Systems.

3.2 Physical Interfaces and Carriers Only — This

document also does not cover standards that were

generated by committees other than the SEMI Physical

Interfaces and Carriers Committee, even though such

standards may be specific to 300 mm. For example,

standards not described here include:

 Information and Control documents such as SEMI

E82; and

 Silicon documents such as SEMI M1.15, SEMI

M8, and SEMI M28 (Developmental Wafers).

4 Referenced Standards

4.1 SEMI Standards

SEMI E1.9 — Mechanical Specification for Cassettes

Used to Transport and Store 300 mm Wafers

SEMI E10 — Specification for Definition and

Measurement of Equipment Reliability, Availability,

and Maintainability (RAM)

SEMI E15 — Specification for Tool Load Port

SEMI E15.1 — Specification for 300 mm Tool Load

Port

SEMI E19 — Standard Mechanical Interface (SMIF)

SEMI E19.4 — 200 mm Standard Mechanical Interface

(SMIF)

SEMI E21.1 — Cluster Tool Module Interface 300

mm: Mechanical Interface and Wafer Transport

Standard

SEMI E22.1 — Cluster Tool Module Interface 300

mm: Transport Module End Effector Exclusion Volume

Standard

SEMI E23 — Specification for Cassette Transfer

Parallel I/O Interface

SEMI E25 — Cluster Tool Module Interface: Module

Access Guideline

SEMI E26.1 — Radial Cluster Tool Footprint 300 mm

Standard

SEMI E45 — Test Method for the Determination of

Inorganic Contamination from Minienvironments Using

Vapor Phase Decomposition-Total Reflection X-Ray

Spectroscopy (VPD-TXRF), VPD-Atomic Absorption

Spectroscopy (VPD-AAS), or VPD/Inductively

Coupled Plasma-Mass Spectrometry (VPD/ICP-MS)

SEMI E46 — Test Method for the Determination of

Organic Contamination from Minienvironments Using

Ion Mobility Spectrometry (IMS)

SEMI E47.1 — Provisional Mechanical Specification

for Boxes and Pods Used to Transport and Store 300

mm Wafers

SEMI E57 — Mechanical Specification for Kinematic

Couplings Used to Align and Support 300 mm Wafer

Carriers

SEMI E62 — Provisional Specification for 300 mm

Front-Opening Interface Mechanical Standard (FIMS)

SEMI E63 — Mechanical Specification for 300 mm

Box Opener/Loader to Tool Standard (BOLTS-M)

Interface

SEMI E64 — Specification for 300 mm Cart to SEMI

E15.1 Docking Interface Port

SEMI E70 — Guide for Tool Accommodation Process

SEMI E72 — Specification and Guide for 300 mm

Equipment Footprint, Height, and Weight

SEMI E82 — Specification for Interbay/Intrabay

AMHS SEM (IBSEM)

SEMI E83 — Specification for 300 mm PGV

Mechanical Docking Flange

SEMI E84 — Specification for Enhanced Carrier

Handoff Parallel I/O Interface

SEMI E85 — Specification for Physical AMHS

Stocker to Interbay Transport System Interoperability

SEMI E92 — Specification for 300 mm Light Weight

and Compact Box Opener/Loader to Tool-

Interoperability Standard (BOLTS/Light))

SEMI E99 — The Carrier ID Reader/Writer Functional

Standard: Specification of Concepts, Behavior, and

Services

SEMI E106-1104 © SEMI 2000, 2004 3

SEMI E99.1 — Specification for SECS-I and SECS-II

Protocol for Carrier ID Reader/Writer Functional

Standard

SEMI E100 — Specification for a Reticle SMIF Pod

(RSP) Used to Transport and Store 6 Inch or 230 mm

Reticles

SEMI E101 — Guide for EFEM Functional Structure

Model

SEMI E103 — Provisional Mechanical Specification

for a 300 mm Single-Wafer Box System that Emulates

a FOUP

SEMI G74 — Specification for Tape Frame for 300

mm Wafers

SEMI G77 — Specification for Frame Cassette for 300

mm Wafers

SEMI M1.15 — Standard for 300 mm Polished

Monocrystalline Silicon Wafers (Notched)

SEMI M8 — Specification for Polished

Monocrystalline Silicon Test Wafers

SEMI M28 — Specifications for Developmental 300

mm Diameter Polished Single Crystal Silicon Wafers

SEMI M29 — Specification for 300 mm Shipping Box

SEMI M31 — Provisional Mechanical Specification for

Front-Opening Shipping Box Used to Transport and

Ship 300 mm Wafers

SEMI S2 — Environmental, Health, and Safety

Guideline for Semiconductor Manufacturing Equipment

SEMI S8 — Safety Guidelines for Ergonomics

Engineering of Semiconductor Manufacturing

Equipment

SEMI S11 — Environmental, Safety, and Health

Guidelines for Semiconductor Manufacturing

Equipment Minienvironments

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

5 Terminology

5.1 Abbreviations and Acronyms

5.1.1 AGV — automatic guided vehicle (as defined in

SEMI E101).

5.1.2 PGV — person guided vehicle (cart) (as defined

in SEMI E101).

5.1.3 RGV — rail guided vehicle (moving on the floor)

(as defined in SEMI E101).

5.2 Definitions

5.2.1 bilateral datum plane — a vertical plane that

bisects the wafers and that is perpendicular to both the

horizontal and facial datum planes (as defined in SEMI

E57).

5.2.2 BOLTS plane — a plane parallel to the facial

datum plane near the front of the tool where the box

opener/loader is attached (as defined in SEMI E63).

5.2.3 box — a protective portable container for a

cassette and/or substrate(s).

5.2.4 box opener/loader or BOLTS unit — the

equipment component that opens wafer carriers (if

needed) and presents the carriers to the equipment’s

wafer handler for unloading and loading wafers (as

defined in SEMI E63).

5.2.5 carrier handler — receives and passes the

carriers from and/or to the external system (such as the

factory material handling system). A carrier handler of

the internal buffer type has the functions of handling

and storing the carriers. A carrier handler for FOUPs

has the opener(s) for opening and closing FOUPs.

5.2.6 cart — a floor-based carrier transfer vehicle (as

defined in SEMI E101).

5.2.7 cassette — an open structure that holds one or

more substrates.

5.2.8 docking — the act of locating a floor-based

carrier transport vehicle for carrier transfer to/from

equipment (as defined in SEMI E101).

5.2.9 equipment front end module (EFEM) — consists

of the carrier handler that receives carriers from the

factory material handling system on one or more load

ports (as specified in SEMI E15.1), opens the carriers

(if needed), and may include a substrate handler for

unloading and loading wafers from the carrier to the

process part of the equipment (as defined in SEMI

E101).

5.2.10 facial datum plane — a vertical plane that

bisects the wafers and that is parallel to the front side of

the carrier (where wafers are removed or inserted). On

tool load ports, it is also parallel to the load face plane

specified in SEMI E15 on the side of the tool where the

carrier is loaded and unloaded (as defined in SEMI

E57).

5.2.11 fixed buffer – EFEM configuration with carrier

places only on load port units arranged in a load port

group (as defined in SEMI E101).

5.2.12 front-opening unified pod (FOUP) — a box

(that complies with SEMI E47.1) with a non-removable

cassette (so that its interior complies with SEMI E1.9)

and with a front-opening interface (that mates with a

SEMI E106-1104 © SEMI 2000, 2004 4

FIMS port that complies with SEMI E62) (as defined in

SEMI E47.1).

5.2.13 horizontal datum plane — a horizontal plane

from which projects the kinematic-coupling pins on

which the carrier sits. On tool load ports, it is at the load

height specified in SEMI E15 and might not be

physically realized as a surface (as defined in SEMI

E57).

5.2.14 internal buffer — EFEM configuration with

carrier places different from load port units (as defined

in SEMI E101).

5.2.15 minienvironment — a localized environment

created by an enclosure to isolate the product from

contamination and people.

5.2.16 OHT — overhead transport system with hoist

for lifting carriers between load port level and transport

level (as defined in SEMI E101).

5.2.17 pod — a box having a Standard Mechanical

Interface (SMIF) per SEMI E19.

5.2.18 substrate handler — transfers substrates

between carriers and the process part of the equipment

(as defined in SEMI E101).

5.2.19 wafer carrier — any cassette, box, pod, or boat

that contains wafers (as defined in SEMI E15).

6 Description of the Standards

6.1 Overview — Figure 2 shows roughly what most of

the SEMI standards for 300 mm physical interfaces and

carriers specify. However, this picture is greatly over-

simplified. For example, a front-opening shipping box

(FOSB) compliant with SEMI M31 (with its thicker

door) generally cannot be opened by equipment load

ports that are compliant with SEMI E63. Also, a wire

link to an OHT for the carrier handoff parallel I/O can

also be located at the top of the equipment.

Furthermore, the atmospheric wafer handler for

emptying the carrier will generally be different from the

wafer handler used in the vacuum environment of the

central handler module of a cluster tool.

6.2 Kinematic Coupling — The foundational document

of the SEMI standards for 300 mm physical interfaces

and carriers is SEMI E57 which specifies the

mechanical couplings used to ergonomically align and

precisely support 300 mm wafer carriers. The

kinematic coupling consists of three pins that mate with

grooves on the bottom of the wafer carrier (which are

not specified) for physical alignment and support. Most

of the dimensions in the SEMI standards for 300 mm

physical interfaces and carriers are determined with

respect to the three orthogonal datum planes defined in

SEMI E57: the horizontal datum plane, the facial datum

plane, and the bilateral datum plane. Such a kinematic

coupling can be used at several interfaces, including:

 between a FOUP or cassette and an equipment load

port or vehicle nest,

 between a transport cassette and a box, and

 between a process cassette or quartz boat and the

floor of a process chamber.

E21.1 (Cluster-Tool

Module Interface

)

E22.1 (Cluster-

Tool End Effector

)

E26.1 (Cluster-Tool Footprint)

and

E25 (

Cluster-Tool Access)

E57 (Kinematic Coupling)

E64 (Cart Docking Interface)

and

E83 (

PGV Docking Flange)

E72 (Equipment

Footprint, Height,

and Wei

)

Carriers:

E47.1 (

FOUP),

E1.9 (

Cassette),

M31 (

FOSB), or

E103 (

SWIF)

E62 (FIMS)

E15.1 (Load Port)

E84 (Carrier Handoff

Parallel I/O

)

M1.15, M8, M28 (Wafer)

E63 (BOLTS-M)

and/or

E92 (

BOLTS-Light)

E110 (Indicator/

switch Placement

)

Figure 2

Key Standards for 300 mm Equipment