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SEMI E21-94 © SEMI 1991, 2002 7 RELATED INFORMATION 1 NOTE: This related information is not an official part of SEMI E21 but was reapproved for public ation by full letter ballo t procedures on July 21, 2002. R1-1 Transp…

SEMI E21-94 © SEMI 1991, 2002 6

Figure 4

Flange Specification

SEMI E21-94 © SEMI 1991, 2002 7

RELATED INFORMATION 1

NOTE: This related information is not an official part of SEMI E21 but was reapproved for publication by full letter ballot

procedures on July 21, 2002.

R1-1 Transport Module Reach

R1-1.1 The reach (see Section 4.1.1) permits a wafer of

200 mm (8 in.) diameter or smaller to be placed on a

wafer support platform in a process chamber with

allowance for the optional isolation valve on the

process module and the chamber wall thickness. The

substantial clearance between the wafer and the

chamber wall is to allow freedom for process-specific

design requirements.

R1-1.2 Individual process chamber designs may place

the wafer closer to the interface plane than 305 mm (12

in.) and still conform to the standard.

R1-1.3 Wafers are transported individually in a

horizontal attitude. Modules may contain any number

of wafers. For example, batch processing is allowed.

R1-2 Vertical Position of Transport Plane

R1-2.1 The transport plane elevation of 1100 mm

(43.307 in.) (see Section 4.1.2) is positioned within the

constraints placed on the cluster tool by the Inter-

Equipment Automation requirement for cassette

placement (SEMI E15). SEMI E15 specifies the load

height for cassettes to be 900 mm (35.46 in.) ± 10 mm

(0.394 in.) outside an environmental load-lock.

R1-2.2 The vertical position of the transport plane is

derived from the following contributions:

• 910 mm (35.854 in.) is a worst-case cassette load

height position.

• 12 mm (0.473 in.) is a nominal pickup clearance to

zero a wafer elevator indexer after the cassette is

drawn into the environmental load-lock.

• 178 mm (7.01 in.) is the location of the top slot in a

standard 200 mm (8 in.) wafer carrier (SEMI E1.7).

R1-2.3 These additive contributions assure that the

transport plane elevation allows as much space as

possible for location of support equipment such as

pumps, electronics, and power supplies below the

process chamber. The 1100 mm (43.307 in.) “nominal”

dimension could be adjustable by the module(s) to

within ± 25 mm (1 in.).

R1-3 Vertical Motion

R1-3.1 The standard (see Section 4.1.2.1) requires that

the transport module be capable of moving in two

planes. An ability to move in other planes is optional.

R1-3.2 The transport module moves the wafer in the

horizontal wafer transport plane (see Definition 3.12).

The transport module has a vertical motion capability

for wafer handoff or pickup. It is assumed that the

transport module moves in the lower plane after wafer

handoff or prior to wafer pickup.

R1-4 Interface Seal Zone

R1-4.1 The interface seal zone (see Section 4.2.1) is

sufficiently wide to permit double seals with

intermediate pumping.

R1-4.2 Blank-Off Plates — The location of the seals on

the transport module allows plain blank-off plates to be

used for environmental sealing.

R1-5 Wafer Transport Zone

R1-5.1 The minimum specified height of 32 mm

(1.184 in.) (see Section 4.2.2) provides sufficient

clearance for passage of a knuckle joint or pivot point

in the transport module end effector (see SEMI E22,

" Cluster Tool Module Interface: Transport Module End

Effector Exclusion Volume Standard" ) and for 6 mm

(0.238 in.) of vertical motion. The wafer transport zone

may be expanded up to the boundary of the interface

seal zone when a module requires a larger opening (see

Section 4.2.1 and Figure 3).

R1-6 Interface Plane Alignment Pins

R1-6.1 The standard (see Section 4.2.3) implies the

normal engineering practice of chamfering pin ends and

countersinking pin locating holes. Actual dimensions

for this have been specified or recommended by other

authorities.

R1-6.2 Pins reside in the sealing surface to avoid

accidental damage to the surface finish during assembly

and disassembly. With centrally placed pins, valves

may be mounted in either orientation if this simplifies

servicing or accessibility.

R1-6.3 A clearance hole and slot arrangement allows

use of dissimilar flange materials in a dynamic thermal

environment.

R1-7 Isolation Valves

R1-7.1 The standard (see Section 4.2.4) allows the

valves to be integral to the modules or discrete

separable units.

R1-8 Clamping

R1-8.1 The standard (see Section 4.3.1) allows a

universal clamping scheme to be employed. Claw

clamps designed for use with ISO flanges are

accommodated by the use of a perimeter groove around

the flange.

R1-8.2 The clamping scheme provides several benefits:

• Independence from any hole pattern requirements.

• Flanges may be connected to flat plates or to other

flanges.

• The number of clamps and the number of sides

used to draw the flanges together may be varied as

required by the compression forces necessary for

the sealing method used. For example, clamps may

be spaced on 30 mm (1.191 in.) centers for metal

seals and on 150 mm (6 in.) centers for elastomeric

seals.

• Any type of clamp may be used that accommodates

the perimeter groove.

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer' s instructions, product labels,

product data sheets, and other relevant literature,

respecting any materials or equipment mentioned

herein. These standards are subject to change without

notice.

By publication of this standard, Semiconductor

Equipment and Materials International (SEMI) takes no

position respecting the validity of any patent rights or

copyrights asserted in connection with any items

mentioned in this standard. Users of this standard are

expressly advised that determination of any such patent

rights or copyrights, and the risk of infringement of

such rights are entirely their own responsibility.

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