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SEMI 30.1-0200 © SEMI 1998, 2000 4 4.2 Other References Harel, D., “Statecharts: A Visual Formalism for Complex Systems,” Science of Computer Programming 8, (1987), 23 1-274 NOTE 1: A s listed or revised, all docume nts …

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SEMI 30.1-0200 © SEMI 1998, 20003
SEMI E30.1-0200
INSPECTION AND REVIEW SPECIFIC EQUIPMENT MODEL (ISEM)
This standard was technically approved by the Global Information and Control Committee and is the direct
responsibility of the North American Information and Control Committee. Current edition approved by the
North American Regional Standards Committee on September 3, 1999. Initially available at www.semi.org
November 1999; to be published February 2000. Originally published June 1998.
1 Purpose
1.1 This standard establishes a Specific Equipment
Model (SEM) for Inspection and Review Equipment
(ISEM). The model consists of equipment
characteristics and behavior that are to be implemented
in addition to the SEMI E30 fundamental requirements
and additional capabilities. The intent of this standard is
to facilitate the integration of ISEM equipment into an
automated (semiconductor fabrication) factory. This
document accomplishes this by defining an operational
model for ISEM equipment as viewed by a factory
automation controller. This definition provides a
standard host interface and equipment operational
behavior (e.g., control, state models, data reports, and
reporting levels). Several topics require additional
activity that are within the scope of this standard:
substrate pattern maps; defect classification code
management; and review data management.
2 Scope
2.1 The scope of this standard is li mited to the
definition of Inspection, Review, and Inspection/
Review equipment behavior as perceived by a SEMI
Equipment Communications Standard II (SEMI
E5/SECS-II) host that complies with SEMI E30. It
defines the external view of the equipment through the
SECS link; it does not define the internal operation of
the equipment. This standard expands the SEMI E30
requirements and capabilities in the areas of the
processing state model, remote commands, variable
items, alarms, and data collection.
2.2 This standard is intended for ISEM equipment that
generates data and information about anomalies and
defects found on substrates. Inspection equipment finds
anomalies. Anomalies are occurrences on a substrate
that have been judged to be unexpected, abnormal,
incongruous, or inconsistent. Anomalies may be
examined using review equipment, at which time they
may be classified as defects or non-defects. Some
inspection equipment may generate, and some review
equipment may use, coordinate data to locate anomalies
on a substrate. The accuracy of the coordinate data
generated or used is equipment-dependent.
2.3 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
3 Limitations
3.1 This document addresses three distinct types of
equipment: inspection, review, and inspection/review.
The term ISEM equipment refers to all three types of
equipment. These three equipment types are
differentiated by the basic functions they perform:
3.1.1 Inspection Equipment that looks for anomalies
on a substrate and reports information regarding those
anomalies. Inspection equipment may determine the
location of anomalies relative to a coordinate system.
Inspection equipment may also provide other types of
data related to the anomaly.
3.1.2 Review Equipment that accepts information
about anomalies on a substrate, gathers information on
those anomalies, and reports that data.
3.1.3 Inspection/Review Equipment having the
characteristics of both inspection and review
equipment.
4 Referenced Standards
4.1 SEMI Standards
SEMI E5 — SEMI Equipment Communications
Standard 2 Message Content (SECS-II)
SEMI E30 — Generic Model for Communications and
Control of SEMI Equipment (GEM)
SEMI E37 — High-Speed SECS Message Services
(HSMS) Generic Services
SEMI E37.1 — High-Speed SECS Message Services
Single-Session Mode (HSMS-SS)
SEMI E58 — Automated Reliability, Availability, and
Maintainability Standard (ARAMS): Concepts,
Behavior, and Services
SEMI M20 — Specification for Establishing a Wafer
Coordinate System
SEMI M21 — Specification for Assigning Addresses to
Rectangular Elements in a Cartesian Array
SEMI 30.1-0200 © SEMI 1998, 2000 4
4.2 Other References
Harel, D., “Statecharts: A Visual Formalism for
Complex Systems,” Science of Computer Programming
8, (1987), 231-274
NOTE 1: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
5 Terminology
5.1 Abbreviations and Acronyms
5.1.1 GEM — generic equipment model
5.1.2 PE — pattern element
5.1.3 TCP/IP — Transmission Communication
Protocol/Internet Protocol
5.2 Definitions
5.2.1 align — to put into proper relative position or
orientation.
5.2.2 alignment — a procedure in which a coordinate
system is established on a substrate.
5.2.3 alignment mark — a feature on the substrate
selectively used for alignment.
5.2.4 anomaly — an occurrence on a substrate that has
been judged to be unexpected. Something abnormal,
incongruous, or inconsistent.
NOTE 2: After an anomaly is reviewed, it may be classified
as a defect.
5.2.5 batch — a group of substrates or lots intended
for a process sequence versus single substrate
processing.
5.2.6 carrier — a container with one or more fixed
positions at which material can be held.
5.2.7 carrier location — a physical place within the
equipment capable of holding a carrier.
5.2.8 cassette — a container with one or more
substrate locations (see slot).
5.2.9 defect — 1) A physical, optical, chemical, or
structural irregularity that degrades the ideal substrate
structure or the thin films built over the substrate. 2) An
undesirable classified anomaly.
5.2.10 defect classification — the categorization of
defects according to some systematic division based on
their physical, optical, chemical, or structural
properties.
5.2.11 die — 1) A field sub-unit. 2) An area of
substrate that contains the device being manufactured.
5.2.12 ended — the end of a state that may be when it
is normally completed, or its early end due to an
allowed or atypical condition (e.g., a STOP command,
or an error or alarm condition).
5.2.13 factory automation controller — a computer
system that provides integration of factory shop control
and business systems with semiconductor equipment.
5.2.14 feature — 1) A line or a point (as a feature
within a pattern). 2) A physical characteristic of the
substrate (e.g., a substrate flat).
5.2.15 field — the printed pattern from a reticle.
5.2.16 field of view — the imaging area as seen at
magnification of the inspection or review equipment.
5.2.17 global alignment — a procedure which
establishes a coordinate system for the entire substrate
(see alignment).
5.2.18 group — a logical collection of regions.
5.2.19 group alignment — a procedure which
establishes a coordinate system for an area, which is a
contiguous group (see alignment).
5.2.20 inspect — to detect anomalies and/or
information about anomalies.
5.2.21 inspection — an examination to detect
anomalies.
5.2.22 inspection equipment — equipment that looks
for anomalies on a substrate and reports information
regarding those anomalies. Inspection equipment may
determine the location of anomalies relative to a
coordinate system. Inspection equipment may also
provide other types of data related to the anomaly.
5.2.23 inspection/review equipment — equipment
having the characteristics of both inspection and review
equipment.
5.2.24 ISEM job — the information required to specify
an inspection or review that may include material
identification and location and process program
identifications as well as any other parameters required
to obtain a desired result.
5.2.25 layer — one of a sequential series of overlaying
photomasks that make up a device series.
5.2.26 lot — a group of one or more substrates of the
same type (e.g., wafers, masks, CDs).
5.2.27 major flat — the flat of longest length that is
commonly located with respect to a specific crystal
plane (ASTM F 1241-89).
5.2.28 mask — a selective barrier to the passage of
radiation. For example, a transparent plate containing
an opaque pattern that is used to transfer that pattern to
another substrate.
SEMI 30.1-0200 © SEMI 1998, 20005
5.2.29 material — a piece or pieces of substrate, one
or more substrates, a lot, a batch, or a run.
5.2.30 metrology equipment — any equipment that
collects and reports information on specific
predetermined locations or features on a substrate with
consistent data structure or that reports general
information about the entire substrate.
5.2.31 notch — a U-shaped cut on the edge of a
substrate that is commonly located with respect to a
specific crystal plane.
5.2.32 overlay — the actual distance between two
features on different layers of a substrate, compared to
the expected distance.
5.2.33 pattern — 1) The physical features on a
substrate surface. 2) An ideal pattern is the arrangement
of features expressed in a calculated or mathematical
manner.
5.2.34 pattern element — 1) Any recognizable set of
features. 2) A rectangular sub-unit of a pattern or a
pattern element. There may be multiple levels of pattern
elements.
5.2.35 primary fiducial — a key characteristic of a
substrate used to align the substrate during processing
(such as a notch or major flat).
5.2.36 region — a single field of view which may be a
collection of sites.
5.2.37 registration — the actual distance between two
features on the same layer of a substrate, compared to
the expected distance.
5.2.38 reticle — a mask that contains the patterns to
be reproduced on a substrate; the image may be equal to
or larger than the final projected image.
5.2.39 review — the process of classification of
anomalies which may result in the appending of
additional data to inspection data. Used to create a field
on a substrate.
5.2.40 review equipment — equipment that accepts
information about anomalies on a substrate, gathers
information on those anomalies, and reports that data.
5.2.41 run (noun) — the material processed during the
EXECUTING state.
5.2.42 run (verb) — the actions of a process between
the READY state and the STOPPING state.
5.2.43 safe state — a state in which the equipment
presents no danger to the product or user. This implies
that safety interlocks are in place such that the
equipment can be serviced without harm to the operator
and that the material being processed has been removed
from the processing station into an accessible location.
5.2.44 site — a single x,y coordinate where an action
can be performed (e.g., alignment or review). The area
associated with a site is determined by the equipment
accuracy (e.g., optics, stage algorithms).
5.2.45 slot — a physical location within a Carrier
capable of containing a substrate. Also referred to as a
carrier location.
5.2.46 substrate — the basic unit of material,
processed by semiconductor equipment, such as wafers,
CDs, flat panels, or masks.
6 Communication Requirem ents
6.1 It is required that any ISEM-compliant equipment
follow the Communications State Model in SEMI E30.
In addition, ISEM-compliant equipment shall support
the High Speed Messaging Service Standard (SEMI
E37/HSMS). It is a minimum requirement to support
Single Session (SEMI E37.1/HSMS-SS) sending
SECS-II messages over TCP/IP. The reason behind this
requirement is the size of the process programs used by
this class of equipment and the amount of data
produced.
7 State Models
7.1 Processing State Model Requirements
7.1.1 The processing state model included in this
standard is a requirement for ISEM equipment. This
standard requires implementation of all SEMI E30 state
models (such as control, communication, and on-
line/off-line). A state model consists of state model
diagrams, state definitions, and a state transition table.
All state transitions in this standard, unless otherwise
specified, shall correspond to collection events.
7.1.2 A state model is the host’s vie w of the
equipment and does not necessarily describe the
internal equipment operation. All ISEM state model
transitions shall be mapped sequentially into the
appropriate internal equipment events that satisfy the
requirements of those transitions. In certain
implementations, the equipment may enter a state and
have already satisfied all of the conditions required by
the ISEM state model for transition to another state.
The equipment makes the required transition without
any additional actions in this situation.
7.1.3 Some equipment may need to include additional
states other than those in this standard. Additional states
may be added but shall not change the ISEM-defined
state transitions. All expected transitions between ISEM
states shall occur.
7.2 Processing State Model Diagram — Processing
state models are detailed for ISEM equipment in Figure
1. This diagram contains all states and transitions that