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SEMI M1-0305 © SEMI 1978, 2005 36 12 Packing and Shipping Container Labeling 12.1 Special packing requirements shall be s ubject to agreement between the su pplier and custom er. Otherwise, all wafers shall be handled, i…
SEMI M1-0305 © SEMI 1978, 2005 35
8 Sampling
8.1 Unless otherwise specified, ASTM Practice E 122 shall be used to define the sampling plan. When so specified,
appropriate sample sizes shall be selected from each lot in accordance with ANSI/ASQC Z1.4. Each quality
characteristic shall be assigned an acceptable quality level (AQL) or lot tolerance percent defective (LTPD) value in
accordance with ANSI/ASQC Z1.4 definitions for critical, major, and minor classifications. If desired and so
specified in the contract or order, each of these classifications may alternatively be assigned cumulative AQL or
LTPD values. Inspection levels shall be agreed upon between the supplier and the purchaser.
9 Test Methods
9.1 Measurements shall be made or certifiable to one of the SEMI, ASTM, JEITA, JIS, or DIN standard test
methods for the item as selected from Table 1 and specified in the purchase order.
9.2 If several different standard test methods for an item are commonly used within a region, it is particularly
important that the applicable method of test be identified in the purchase order.
9.3 If no method of test is specified in the purchase order and if standard test methods from different geographic
regions are available, the default method shall be a method in common usage for the region of the purchaser of the
wafer.
9.4 If no standard test method for an item is available, the test procedure to be used must be agreed upon between
supplier and customer.
9.5 Information about the various test methods listed in Table 1 is provided in Related Information 2 together with
information about some additional test methods no longer in wide use throughout the industry.
10 Certification
10.1 Upon request of the purchaser in the contract or order, a manufacturer’s or supplier’s certification that the
material was manufactured and tested in accordance with this specification, together with a report of the test results,
shall be furnished at the time of shipment.
10.2 In the interest of controlling inspection costs, the supplier and the customer may agree that the material shall
be certified as “capable of meeting” certain requirements. In this context, “capable of meeting” shall signify that the
supplier is not required to perform the appropriate tests in §9. However, if the customer performs the test and the
material fails to meet the requirement, the material may be subject to rejection.
11 Product Labeling
11.1 The wafers supplied under these specifications shall be identified by appropriately labeling the outside of each
box or other container and each subdivision thereof in which it may reasonably be expected that the wafers will be
stored prior to further processing. Identification shall include as a minimum the nominal diameter, conductivity
type, dopant, orientation, resistivity range, and lot number. The lot number, either (1) assigned by the original
manufacturer of the wafers, or (2) assigned subsequent to wafer manufacture but providing reference to the original
lot number, shall provide easy access to information concerning the fabrication history of the particular wafers in
that lot. Such information shall be retained on file at the manufacturer’s facility for at least one month after that
particular lot has been accepted by the customer.
11.2 Alternatively, if agreed upon between supplier and customer, one of the box labeling schemes in SEMI T3
shall be used and the information listed in ¶11.1 that is not included on the label shall be retained in the supplier’s
data base for at least one month after that particular lot has been accepted by the customer.
11.3 Wafers of Category 1.15 (300 mm in diameter) shall be shipped in packages labeled in accordance with SEMI
M45.
SEMI M1-0305 © SEMI 1978, 2005 36
12 Packing and Shipping Container Labeling
12.1 Special packing requirements shall be subject to agreement between the supplier and customer. Otherwise, all
wafers shall be handled, inspected, and packed in such a manner as to avoid chipping, scratches, and contamination
and in accordance with the best industry practices to provide ample protection against damage during shipment.
12.2 Wafers of Category 1.15 (300 mm in diameter) shall be shipped in accordance with SEMI M45.
12.3 Unless otherwise indicated in the purchase order, all outside wafer shipping containers shall be labeled in
accordance with ANSI/EIA 556-B.
SEMI M1-0305 © SEMI 1978, 2005 37
APPENDIX 1
FLATNESS DECISION TREE
NOTICE: The material in this appendix is an official part of M1. Approval was by full letter ballot
procedures with publication authorized by the NA Regional Standards Committee on October 21, 1999.
A1-1 Scope
A1-1.1 The increasing complexity of integrated circuits and the reduction in design rule dimensions place new
demands on the characterization of wafer surface geometry. Various high resolution optical lithographic systems
have very limited depth of field and use a variety of methods to hold the wafer, to establish the focal plane, and to
position the wafer relative to the focal plane during exposure. These varying focusing and location methods differ
enough to make a single, simple flatness criterion (such as global TIR) ineffective in predicting successful or
unsuccessful lithography in all cases.
A1-1.2 To clarify the requirements for wafer flatness characterization for the various classes of lithographic
equipment, the decision tree depicted in Figure A1-1 has been developed. This tree gives an orderly procedure for
selecting the various parameters that must be specified if wafer flatness is specified.
A1-1.3 In this tree, it is assumed that the focal point is the site center for all parameters, except for SFQD, SFQR,
SFSD, and SFSR, where the focal plane is identical to the reference plane. Most flatness characterization systems
employ this convention. However, a number of photolithographic aligners use slightly different conventions for
determining the focal plane. Currently, the difference between the centerpoint and other focusing conventions has
not been quantified, but it is presumed to be insignificant for material characterization purposes.
A1-1.4 For sites to be included in the measurement, the site center must lie within the Flatness Quality Area
(FQA). For subsites (se Figure A1-2) to be included in the measurement, the subsite center must lie within a site
whose center is within the FQA and some of the subsite must lie within the FQA (see Figure A1-3).
A1-2 Use of the Flatness Decision Tree
A1-2.1 In the decision tree, there are decision blocks, shown as diamonds, whose use requires some knowledge of
the lithographic tool to be used. The rectangular blocks require information to be furnished; this information is
dependent on the device layout and the manufacturing procedures to be employed (such as dedicated or mixed
aligner use).
A1-2.2 Step 1 — Select the Fixed Quality Area (FQA): Decide on and specify the nominal edge exclusion, EE,
which defines the FQA. (See Figure 1.)
A1-2.3 Step 2 — Choose the Measurement Method: Choose global flatness (G) if the lithographic tool uses a single,
global exposure of the wafer, or choose site flatness (S) if the lithographic tool steps across the wafer, exposing only
a portion of the wafer at a time.
A1-2.3.1 If global flatness is chosen, proceed to Step 3. If site flatness is chosen, it is also necessary to specify site
size (related to exposure area dimensions) and site array (including (a) number of sites, (b) location of sites relative
to the center of the FQA and to each other, as in an offset or bricklaying pattern, and (c) whether or not partial sites
are to be excluded).
A1-2.4 Step 3 — Choose the Reference Surface: Choose front surface (F) or back surface (B), depending on
whether the lithographic tool is referenced to the front or back surface.
A1-2.5 Step 4 — Choose the Reference Plane and Area:
A1-2.5.1 For global flatness measurements, a global reference plane is appropriate. If the lithographic tool is
referenced to the back surface, an ideal plane (I) defined by the chuck which holds the wafer is appropriate. If the
lithographic tool is referenced to the front surface, either a 3-point plane (3) defined by three points equally spaced
about the edge of the front surface of the wafer or a plane defined by the least squares fit to the front surface (L) may
be appropriate. The 3-point plane is appropriate if the lithographic tool holds the wafer in this fashion and does not
allow interactive gimbaling of the wafer, while the least squares plane is appropriate if the lithographic tool allows
interactive gimbaling of the wafer.