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SEMI E57-0305 © SEMI 1996, 2005 1 SEMI E57-0600 (Reapproved 0305) MECHANICAL SPECIFICATION FO R KINEMATIC COUPLINGS USED TO ALIGN AND SUPPORT 300 mm WAFER CARRIERS This specificatio n was technically reapproved b y the G…

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SEMI E56-1104 © SEMI 1996, 2004 13
15.3 Repeatability — Report a single number, as
calculated above, as a percentage of the reading.
15.4 Hysteresis — Report a single number, as
calculated above.
15.5 Deadband — Report a single number, as
calculated above.
16 Related Documents
16.1 SEMI Standard
SEMI E28 — Guideline for Pressure Specifications of
the Mass Flow Controller
SEMI E67 — Test Method for Determining Reliability
of Mass Flow Controller (refer to this standard if
reliability data is needed for some of the parameters
tested in this method)
16.2 ANSI Standards
3
ANSI C39.5 — Safety Requirements for Electrical and
Electronic Measuring and Controlling Instrumentation
ANSI C42.100 — Dictionary of Electrical and
Electronics Terms
ANSI MC4.1 — Dynamic Response Testing of Process
Control Instrumentation
16.3 ASME Standard
4
ASME MFC-1M — Glossary of Terms Used in the
Measurement of Fluid Flow in Pipes
16.4 IEC Standards
5
IEC 160 — Standard Atmospheric Conditions for Test
Purposes
IEC 546 — Methods of Evaluating the Performance of
Controllers with Analogue [sic] Signals for Use in
Industrial Process Control
16.5 ISA Standard
6
ISA S7.3 — Quality Standards for Instrument Air
3 American National Standards Institute, Headquarters: 1819 L
Street, NW, Washington, DC 20036, USA. Telephone: 202.293.8020;
Fax: 202.293.9287, New York Office: 11 West 42nd Street, New
York, NY 10036, USA. Telephone: 212.642.4900; Fax:
212.398.0023, Website: www.ansi.org
4 American Society of Mechanical Engineers, Three Park Avenue,
New York, NY 10016-5990, USA. Telephone: 800.843.2763
(U.S./Canada), 95.800.843.2763 (Mexico), 973.882.1167 (outside
North America), Website: www.asme.org
5 International Electrotechnical Commission, 3, rue de Varembé,
Case Postale 131, CH-1211 Geneva 20, Switzerland. Telephone:
41.22.919.02.11; Fax: 41.22.919.03.00, Website: www.iec.ch
6
Instrument Society of America, 67 Alexander Drive, Research
Triangle Park, NC 27709 USA Telephone: 919.549.8411 Website:
www.isa.org
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer's instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E57-0305 © SEMI 1996, 2005 1
SEMI E57-0600 (Reapproved 0305)
MECHANICAL SPECIFICATION FOR KINEMATIC COUPLINGS USED
TO ALIGN AND SUPPORT 300 mm WAFER CARRIERS
This specification was technically reapproved by the Global Physical Interfaces and Carriers Committee and
is the direct responsibility of the North American Physical Interfaces and Carriers Committee. Current
edition approved by the North American Regional Standards Committee on November 4, 2004. Initially
available at www.semi.org January 2005; to be published March 2005. Originally published in 1996;
previously published June 2000.
1 Purpose
1.1 This standard specifies the mechanical couplings used to ergonomically align and precisely support 300 mm
wafer carriers (including transport cassettes, process cassettes, quartz boats, pods, lot boxes, and shipping boxes).
Such a kinematic coupling can be used at several interfaces, including:
between a box or cassette and a tool load-port or vehicle nest,
between a transport cassette and a box, and
between a process cassette or quartz boat and the floor of a process chamber.
2 Scope
2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation
while ensuring modularity and inter-changeability at all mechanical interfaces. Only the bottom half of the
kinematic coupling is specified so that suppliers can be flexible in designing wafer carriers that can mate with it.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E15 — Specification for Tool Load Port
SEMI E19 — Standard Mechanical Interface (SMIF)
SEMI E19.4 — 200 mm Standard Mechanical Interface (SMIF)
3.2 ISO Document
1
ISO 4287 — Geometrical Product Specifications (GPS) — Surface texture: Profile method — Terms, definitions
and surface texture parameters
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 Definitions
4.1.1 bilateral datum plane — a vertical plane that bisects the wafers and that is perpendicular to both the
horizontal and facial datum planes.
4.1.2 box — a protective portable container for a cassette and/or substrate(s).
4.1.3 cassette — a open structure that holds one or more substrates.
1 International Organization for Standardization, ISO Central Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland.
Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30, Website: /www.iso.ch
SEMI E57-0305 © SEMI 1996, 2005 2
4.1.4 facial datum plane — a vertical plane that bisects the wafers and that is parallel to the front side of the carrier
(where wafers are removed or inserted). On tool load ports, it is also parallel to the load face plane specified in
SEMI E15 on the side of the tool where the carrier is loaded and unloaded.
4.1.5 horizontal datum plane — a horizontal plane from which projects the kinematic-coupling pins on which the
carrier sits. On tool load ports, it is at the load height specified in SEMI E15 and might not be physically realized as
a surface.
4.1.6 nominal wafer center line — the line that is defined by the intersection of the two vertical datum planes (facial
and bilateral) and that passes through the nominal centers of the seated wafers (which must be horizontal when the
carrier is placed on the coupling).
4.1.7 pod — a box having a Standard Mechanical Interface (SMIF) per SEMI E19.
4.1.8 wafer carrier — any cassette, box, pod, or boat that contains wafers (as defined in SEMI E15).
5 Requirements
5.1 Kinematic Coupling Pin Shapes — The physical alignment interface on the bottom of the wafer carrier consists
of features (not specified in this standard) that mate with six pins underneath. As shown in Figure 1 and defined in
Table 1, each pin is radially symmetric about the vertical center axis line and can be seen as the intersection of a
cylinder of diameter d91 and a sphere of radius r93 (which might contact a flat plate). An additional rounding radius
r95 provides contact with angled mating surfaces, and blend radii r94 and r96 smooth the resulting edges. The final
roughness height of the over-all surface finish must be less than or equal to r97. Dimensions r92 and z91 have zero
tolerance because they only give a distance to another toleranced dimension. (Dimensions in parenthesis are not part
of the requirements in this standard but are intended to clarify the preparation of manufacturing instructions.)
5.2 Kinematic Coupling Pin Locations — The pins are arranged in three sets with two pins in each set. As shown in
Figure 2, the outer pin in each set is designated the primary pin for use on a tool load-port or vehicle nest or inside a
box, and the inner pin in each set is designated the secondary pin for use on a robotic arm that would pick up the
carrier (typically from the side opposite the load face plane). The location of each pin is determined with respect to
the three orthogonal datum planes defined in §4: the horizontal datum plane, the facial datum plane, and the bilateral
datum plane. Figure 3 shows the locations of the kinematic coupling pins as viewed from above, and Table 2 defines
the locations (all of which are bilaterally symmetric about the bilateral datum plane). Angle is shown in Figure 3
for clarity and is not part of the requirements in this standard.
5.3 Empirical Determination of Datum Plane Locations — Given a set of three primary or secondary kinematic
coupling pins, the datum planes should be determined as follows. The two pins that are closest together are the front
pins which (along with a known vertical direction) define a Cartesian coordinate system. The center axis line of each
pin is defined to be the vertical line whose x
(left-right) coordinate is the average of the maximum protrusions of the
pin to the left and to the right and whose y (front-back) coordinate is the average of the maximum protrusions of the
pin to the front and to the back. The bilateral datum plane is defined to be the vertical plane that contains the center
axis line of the rear pin and that is equally distant from the center axis lines of the front pins. The facial datum plane
is defined to be the vertical plane that is perpendicular to the bilateral datum plane and whose distance to the center
axis line of the rear pin is 1.5 times the average of the distances to the center axis lines of the front pins. The
horizontal datum plane is defined to be the horizontal plane that is 13 mm (0.51 in.) below the average of the heights
of the highest and lowest pin tops. Once these datum planes have been determined, the three kinematic coupling pins
can be evaluated to see if they conform to ¶¶5.1 and 5.2 of this specification. If they comply, the kinematic coupling
pins and datum planes can be used to evaluate the compliance of carriers to standards cited in §6.
6 Related Documents
6.1 SEMI Standards
SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E47.1 — Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm
Wafers
SEMI E62 — Provisional Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)
SEMI E63 — Mechanical Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface