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SEMI G15-93 © SEMI 198 2, 1996 3 11 Accurac y and Pre cision (s e e AST M E 968) 11.1 Repeatability — Single Analys t — T he percent RSD over multiple da ys was determined to be 4 .2%. 11.2 Repr oducibility — Multilabora…

SEMI G15-93 © SEMI 1982, 1996 2

Figure 1

8.2 Determine the onset of melting and refer to the

manual for the temperature correction method.

NOTE 2: There are other standard reference materials with

higher melting points (see Table 1). Choose the standard

which best matches the range of interest for the material under

test.

Table 1

Reference Material Melting Point (°C)

Indium 156.6

Tin 232.0

Zinc 419.6

8.2.1 Indium is also used to calibrate the Heat of

Fusion for the DSC cell. Table 2 also lists the Standard

Heat of Fusion for alternate materials that may be used.

Table 2

Reference Material Heat of Fusion (J/g)

Mercury 11.44

Indium 28.42

Lead 23.16

Tin 59.23

Zinc 112.0

8.2.2 An area calculation of the indium melt provides

the Heat of Fusion for DSC cell (see Figure 1).

8.2.3 Refer to the operating manual to obtain the cell

constant and its correction.

9 Procedure

9.1 Sample Size — 2.000 to 12.000 mg may be used.

8.000 mg is commonly used. A small design of

experiments exercise may be used to obtain the

optimum sample size for the molding compound under

test. Different compound chemistries may have an

effect on the results if the sample size is not carefully

chosen.

Place the sample in the sample pan.

9.2 Use an empty sample pan with its cover as a

reference.

9.3 Carefully place the sample and reference pans onto

their respective thermal sensors in the DSC cell. Seal

the cell according to the manufacturer's instructions.

9.4 Set the heating rate to the optimum conditions

determined for that instrument and the specific material

under test. This rate will normally be between 5°C and

25°C per minute.

9.5 Activate the test sequence, and heat the sample

from room-temperature to 300°C in order to obtain the

DSC curve.

9.6 At the end of the run, remove the sample, and

allow the DSC cell to cool to room-temperature in

preparation for the next sample.

10 Results Report

10.1 The results report shall contain the following

items:

10.1.1 Sample and equipment details

Molding material name/number

Sample weight

Equipment used

Heating rate

Calibration constant

Any pertinent information regarding material or

equipment

10.1.2 Scan Results — The DSC curve shall indicate

the following:

Maximum peak exotherm — units °C

Exotherm onset — units °C

Exotherm — units joules/gram

NOTE 3: The total exotherm is determined by an area

calculation of the exotherm profile using a computer drawn

baseline.

SEMI G15-93 © SEMI 1982, 19963

11 Accuracy and Precision (s ee ASTM E 968)

11.1 Repeatability — Single Analyst — The percent

RSD over multiple days was determined to be 4.2%.

11.2 Reproducibility — Multilaboratory — The

percent RSD was determined to be 8.2%.

12 Alternate Procedures

12.1 Thermal Kinetic Modeling

12.2 Isothermal Differential Scanning Calorimetry —

There is a current lack of interlaboratory correlation to

recommend this method.

NOTE 4: Manufacturers’ literature may be used to obtain

information on these methods.

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI G16-88 © SEMI 1983, 19961

SEMI G16-88

SPECIFICATION FOR DIMENSIONS AND TOLERANCES USED TO

MANUFACTURE PLASTIC CHIP CARRIER TOOLING

1 Preface

This document is a guideline for the ordering of tooling

required to mold and form plastic chip carriers. It is to

be used by packaging engineers, mold manufacturers

and end of line tool makers as the basis for defining the

limits of manufacturing tolerances.

2 Applicable Documents

Related information may be found in:

MIL-STD-100

— Engineering Drawing Practices

ANSI Y14.5

— Dimensioning and Tolerancing

JEDEC Publication No. 95

— Outline for

Semiconductor Devices

3 Selected Definitions — Pr oduction Criteria

Tolerance Limits

3.1 mismatch and offset — Defined with respect to

package only. All statements will be equally applicable

in two (2) axes. All mismatch and offset measurements

are made after molding and prior to trimming.

3.1.1 cavity to frame offset — Will be measured prior

to any trimming operation. Offset will be defined as the

difference in bottom cavity position with respect to a

leadframe datum. The offset measurement will exclude

leadframe tolerances. (See Figure 1.)

3.1.2 top to bottom cavity mismatch — Characterized

by the fact that the top and bottom cavities in the mold

are not aligned properly, causing a mismatch condition.

The measurement shall be stated as the difference in the

top cavity position relative to the bottom cavity

position. (See Figure 2.)

3.2 Molded Protrusions

3.2.1 parting line protrusions — Those plastic

excesses which remain as a normal characteristic after

normal molding, deflashing, trimming, and singulation.

(See Figure 6.)

3.2.2 top or bottom protrusions — Those plastic

excesses (includes ejector pin “crowns”), which remain

1 Military Standards, Naval Publications and Form Center, 5801

Tabor Avenue, Philadelphia, PA 19120

2 ANSI, 1430 Broadway, New York, NY 10018

3 JEDEC, 2001 Eye Street, N.W., Washington, D.C. 20006

as a normal characteristic extending from the smooth

surface of the molded package.

3.3 variations in lead location — Defined with respect

to a 90° angle from the top or bottom of the smooth

surface of the molded package as viewed on the end or

side projections. (See Figure 6.)

3.4 lead shoulder protrusions and intrusions — Any

variations in straightness along the defined shoulder

width caused by dambar removal. (See Figure 6.)

3.5 package warpage — Any non-linear dimensional

change from the mold cavity characteristic, usually

caused by incorrect package design or molding

practices. (See Figure 3.)

3.6 shoulder bend location — Measured from the

outermost point of the shoulder bend radius. (See

Figure 4.)

3.7 lead co-planarity — Defined as the vertical lead

position with respect to a reference plane measured

after forming. (See Figure 5.)

4 Ordering Information

4.1 Purchase orders for tooling for plastic molded

quad semiconductor packages furnished to this

specification shall include the following items:

1. A package tooling outline drawing showing all

required dimensions listed in Section 5. Package

surface finish should be included.

2. A list of any tolerance limits which will differ

from those detailed in Section 6.

3. The type of tooling steel required.

4. The type of leadframe material to be used.

5. The type of plastic to be molded (if

proprietary, a statement of its shrinkage characteristics).

6. Sampling plan for compliance to Section 7.

7. The number of spare parts or expendable parts

desired.

8. The type of molding press to be used,

including power requirements.

9. Applicable leadframe drawing, including all

dimensions.