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SEMI E130-1104 © SEMI 2003, 2004 8 13.1 Substrate Tra cking must be supported for all product substrates and substrate locations where product subst rates may reside. S ome of the substrate locations that mig ht exist in…

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SEMI E130-1104 © SEMI 2003, 2004 7
9 Related Standards Hierarchy
300mm Standards
(E40,E87,E90,E94)
SEMI E30 (GEM)
SEMI E5 (SECS-II)
PSEM300 (this specification) Provisional Specification f or
SECS-II Protocol for PSEM300
(
future document
)
Figure 2
Related Standards Hierarchy
9.1 SEMI E30 Relationship — This document does not
attempt to redefine the concepts and behaviors of SEMI
E30 (GEM). Instead, this document takes an
hierarchical approach to identifying the methods for
achieving a given task as shown in
Related Standards Hierarchy.
9.1.1 SEMI E30 Inclusions — All of the SEMI E30
state models are required with exception of the
processing state diagram. This diagram is replaced
with the one defined in this standard.
9.1.2 SEMI E30 Exclusions — Data Type restrictions
may conflict with the newer 300 mm standards and
therefore, the constraints found within the newer
standards shall take precedence over the restrictions
found in SEMI E30 section 5 “Data Types”.
10 Process Jobs
NOTE 1: SEMI E40 is required for PSEM300 compliance.
10.1 A PSEM300 prober is not able to operate as an
independent processing agent. It requires a host to
coordinate interaction with the tester. This document
defines a suitable GEM interface consisting of the
Process State Model and associated remote commands
to allow the host to act as the processing agent on
behalf of the prober to complete the execution of the
process job.
10.2 This standard assumes that if the equipment has a
pipeline (e.g. pre-align stage and main chuck), the
equipment will support concurrent process jobs such
that when the last substrate of an active process job
leaves the first pipeline stage, the equipment will
launch another process job thus maintaining continuous
material flow.
10.3 Process Job Preconditioning — This standard
does not attempt to define the set of recipe attributes
that, when different from the current equipment
configuration, will require a transition to the Process
Job SETTING UP state (preconditioning required).
The recipe attributes that do impact the Process Job
transition to SETTING UP will be user defined and
documented as such.
10.4 A PM compliance checklist must be filled out to
indicate the level of compliance to both the
Fundamental and Additional PM capabilities.
11 Control Job
NOTE 2: SEMI E94 is required for PSEM300 compliance.
11.1 See SEMI E94 for details of Control Job
management.
11.2 A substrate’s destination substrate location is
specified in the Control Job’s MtrlOutSpec attribute. If
the MtrlOutSpec attribute is not set, the destination
substrate location defaults to the source substrate
location.
11.3 A CJM compliance checklist must be filled out to
indicate the level of compliance to Fundamental CJM
capabilities (no Additional capabilities are defined at
this time).
12 Carrier Management
NOTE 3: SEMI E87 is required for PSEM300 compliance.
12.1 CarrierReCreate — After processing material for
a given carrier, the host must be able to define a new
CJ/PJ for the same carrier without having to remove the
carrier from the tool. For this, the equipment must
support the CarrierReCreate service.
12.2 A CMS compliance checklist must be filled out to
indicate the level of support for CMS for a given
equipment configuration.
13 Substrate Tracking
NOTE 4: SEMI E90 is required for PSEM300 compliance.
SEMI E130-1104 © SEMI 2003, 2004 8
13.1 Substrate Tracking must be supported for all
product substrates and substrate locations where
product substrates may reside. Some of the substrate
locations that might exist include: handling robot, post-
chuck substrate location.
13.2 The supplier may choose not to support substrate
tracking for certain internal substrate locations. This is
allowable if the substrate location will not be occupied
by product substrates (e.g. Cleaning Media tray, AUX
Tray). The supplier must document which substrate
locations are available for substrate tracking.
13.3 A CMS “CarrierReCreate” service will cause each
of the substrates contained within a recreated carrier to
be reset to the AT SOURCE and NEEDS
PROCESSING state.
NOTE 5: A STS compliance checklist must be filled out to
indicate the level of compliance to STS Fundamental and
Additional capabilities.
14 Equipment Configuration
14.1 This standard does not attempt to specify the
physical equipment configuration. The intent of this
standard is to provide a generalized specification that
applies to all configurations. The supplier is
responsible for assuring that additional features
integrate consistently with the relevant standards
impacted by the feature. The purpose of this section is
to add clarification to baseline assumptions that are
implied throughout this specification.
14.2 Pipeline
14.2.1 A typical pipeline configuration consists of a
pre-align stage used to pre-process a substrate before
loading onto the chuck. The equipment can begin
processing the substrate on the chuck while the next
substrate is being prepared on the pre-align stage. For
this configuration, the material flow is assumed to
follow the path: source substrate location pre-align
stage chuck destination substrate location. There
may be additional substrate locations both before and
after the chuck.
15 Control Maps
15.1 Control Maps provide a mechanism for
communicating the selective sites for processing in a
pre-determined manner. Control Maps are not suitable
for adaptive test where dynamic site selection is used.
15.2 Control Map Uses
15.2.1 Inking — The host can download a control map
containing the sites to be inked. The host issues the
INK DIE remote command specifying the control map
as the source for the die list.
15.2.2 Normal Processing — When using a Control
Map, the host issues the INDEX remote command to
move the prober coordinates to the next site listed in the
Control Map. The host may issue a move related
command other than INDEX to move the chuck to any
location on the substrate. Move commands other than
INDEX, do not impact the state of the Control Map.
The prober processes subsequent INDEX commands by
going to the next site listed in the Control Map. If the
Control Map does not contain additional sites the
equipment sends an event to the host indicating that the
control map has been completed.
15.2.3 Interrupted Processing — If the processing of a
substrate using a Control Map is interrupted (i.e.
Correlation Test, Probe Cleaning with a cleaning
substrate, Chuck Reset, etc...), the equipment shall
resume processing with the Control Map from the point
where processing was suspended when the substrate
processing resumes. The exceptions to this requirement
are
15.2.3.1 If the current Process Job is altered such that
the suspended substrate is no longer in the IN
PROCESS state, the Control Map is no longer valid.
15.2.3.2 If the host issues a RESET-CONTROL-MAP
command, the Control Map will resume at the first site.
If the host designates coordinates with the RESET-
CONTROL-MAP command, the prober will resume the
Control Map with the designated coordinates. It is the
responsibility of the host to assure that the coordinates
provided with this command are contained in the
Control Map.
15.3 If the host issues a SET-CONTROL-MAP
command, the prober will begin processing the Control
Map at the first site of the designated Control Map. If
the host designates coordinates with the SET-
CONTROL-MAP command, the prober will process
the Control Map beginning with the designated
coordinates. It is the responsibility of the host to assure
that the coordinates provided with this command are
contained in the Control Map.
15.4 Control Map Transmission — The method for
downloading/uploading control maps is outside the
scope of this document.
15.5 Control Map Structure — The structure of the
control map is outside the scope of this document. The
use of SEMI G81 or SEMI G85 standards is
recommended to describe map structures.
15.6 Control Map Modifications — The option to
update a control map to register sites as they are
processed is a user specific detail. In the event that
control maps are modified on the prober, the prober
must support uploading the modified maps to the host.
SEMI E130-1104 © SEMI 2003, 2004 9
16 Service Tasks
16.1 The recipe on a PSEM300 compliant prober
contains setup parameters and references to a collection
of service recipes. (See SEMI E42 for a description of
Service Recipe’s). The host can issue a command to
execute a service task. The instructions for performing
the specified task are contained in the respective service
recipe. This standard makes no attempt to define the
full list of service tasks available for a given equipment.
However, when a service task is available, the supplier
is responsible for documenting the command and
parameters required for the host to request the task.
When a service task is performed, the Process State
model transitions to the SERVICE TASK state and
provides the host with a descriptive TaskID.
16.2 Inking
16.2.1 The host can perform inking on individual
devices by issuing the INK-DEVICE command, or the
host can ink a list of devices by issuing the INK-DIE
command and a die list. The die list parameter may
reference a Control Map containing the die selection.
16.3 Inspecting
16.3.1 There are several inspections the prober may be
capable of performing such as inspecting the probes,
inspecting ink marks, and inspecting the Probe to Pad
alignment. The supplier must document the inspections
that are supported and provide remote commands for
selecting the designated inspection.
16.3.2 The Inspection associated with the maintenance
activity is not to be confused with the process of
Inspecting as defined in this section. The activity of
inspecting the equipment in a maintenance capacity
may involve the use of subsystems including one or
more inspection process steps. While the use of an
inspection subsystem in a process capacity constitutes a
transition to the SERVICE TASK state, the equivalent
use of the same subsystem in a maintenance capacity
does not.
16.4 Probe Cleaning
16.4.1 This document does not attempt to specify the
full set of probe cleaning features. However, this
document does require at minimum the ability to
designate logical zones within a cleaning media type to
prevent cross-contamination between wafer technology
types. The supplier must provide suitable means
through the use of Equipment Constants and Status
Variables to allow the user full selectivity of the
available options.
17 Material Movement
17.1 Between Substrate Locations (Inter-Substrate
Moves)
17.1.1 Loading Substrates
17.1.1.1 The host issues the LOAD-SUBSTRATE
command to load the next substrate identified in the
current Process Job’s PRMtlNameList attribute onto the
chuck. The order by which the substrates of a process
job are processed is fully defined within the Process
Job.
17.1.1.2 If the equipment is configured with a multi-
stage pipeline, upon receiving the LOAD-
SUBSTRATE command from the host, the equipment
will fill the pipeline up to the point where the substrate
to be processed is loaded onto the chuck and readied for
processing. Subsequent LOAD-SUBSTRATE
commands will maintain a full pipeline as long as
additional substrates are available for processing. This
assures continuous material flow.
17.1.1.2.1
Example: if the equipment is configured
with a two-stage pipeline consisting of a pre-align stage
and a main chuck, A LOAD-SUBSTRATE command
issued by the host while the Process State model is in
the AWAITING LOAD state and the pipeline is empty
will cause the first substrate to be processed through the
pre-align stage and onto the chuck. The next substrate
will then be loaded onto the pre-align stage.
17.1.2 Loading Substrates—Spanning Process Job
Boundaries
17.1.2.1 When the host issues the LOAD-
SUBSTRATE command that moves the last substrate
of the current Process Job out of the first pipeline stage
(or chuck for non-pipelined configurations) and another
Process Job is defined with the PRProcessStart attribute
set to TRUE, the equipment will automatically launch
the next Process Job. If Process Job preconditioning is
not required for the newly launched Process Job, the
first substrate listed in the PRMtlNameList will be
loaded into the first pipeline stage (or chuck for non-
pipelined configurations).
17.1.3 Loading Substrates—Substrate State Model
17.1.3.1 Substrate Tracking events (SEMI E90) must
be available to the host. When a substrate is moved
from the source carrier to the first pipeline stage (or
chuck for non-pipelined configurations), the substrate
state model will transition from AT SOURCE to AT
WORK.
17.1.3.2 When a substrate is loaded on the chuck, the
substrate state model will transition from NEEDS
PROCESSING to IN PROCESS for substrates that
were not previously suspended (see Section 17.1.5 for