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SEMI T13-1104 © SEMI 2004 23 12.2.6.7 enroll — This service i s used t o ask unde r control of requester DieTrace Manager for device trac king. The following table defines its parameters. Table 31 Service Definition of e…

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SEMI T13-1104 © SEMI 2004 22
12.2.6.2 collectDTD — This service is used to expect extra DieTraceData to a DieTraceManager. The following
table defines its parameters.
Table 26 Service Definition of collectDTD for Die Tracer
Parameter Req/Ind Rsp/Conf Description
DataName M - Data name to be acquired.
TraceData - C Collected data value with its property.
ServiceStatus - M Result of service request
12.2.6.3 planDTD — This service is used to request expected DieTraceData to DieTraceManager. The following
table defines its parameters.
Table 27 Service Definition of planDTD for Die Tracer
Parameter Req/Ind Rsp/Conf Description
DataNameList M - Data names to be collected.
Target M - Possible data source or group.
ServiceStatus - M Result of service request
12.2.6.4 showDTD — This service is used to inquire specific DieTraceData. The following table defines its
parameters.
Table 28 Service Definition of showDTD for Die Tracer
Parameter Req/Ind Rsp/Conf Description
DataName M - Data name to see.
Target C - Possible data source or group.
TraceData - C Obtained data value with its property.
ServiceStatus - M Result of service request
12.2.6.5 setForward — This service is used to forward specific DieTraceData to entity or application when the data
are acquired. The following table defines its parameters.
Table 29 Service Definition of setForward for Die Tracer
Parameter Req/Ind Rsp/Conf Description
Destination M - Destination of forwarded data.
DataNameList M - Data name list to be forwarded.
Target C - Possible data source or group.
ServiceStatus - M Result of service request
12.2.6.6 catchDTD — This service is used to transfer specific DieTracedata from the other Tracer. The following
table defines its parameters.
Table 30 Service Definition of catchDTD for Die Tracer
Parameter Req/Ind Rsp/Conf Description
TraceData M - Data value with its property.
ServiceStatus - M Result of service request
SEMI T13-1104 © SEMI 2004 23
12.2.6.7 enroll — This service is used to ask under control of requester DieTraceManager for device tracking. The
following table defines its parameters.
Table 31 Service Definition of enroll for Die Tracer
Parameter Req/Ind Rsp/Conf Description
ManagingTracer M - Specifier of DieTraceManager.
ServiceStatus - M Result of service request
12.2.6.8 takeDTD — This service is used to report obtained DieTraceData. The following table defines its
parameters.
Table 32 Service Definition of takeDTD for Die Tracer
Parameter Req/Ind Rsp/Conf Description
TraceData M - Data value with its property.
ServiceStatus - M Result of service request
12.2.6.9 Parameter List — Above services use the following parameters.
Table 33 Service Parameter Definitions for Die Tracer
Parameter Definition Form
DataName DieTraceData name. Suppliers or user shall document data names and
their definitions.
Text.
DataNameList List of Data name separated by space. Text.
Destination URI or some other code/name to specify forwarded application. If it is
null, it means removal of existing forwarding setups for specified
data.
Text
ManagingTracer URI or some other code/name to specify DieTraceManager. Text
Target Code/name to specify process or machine. Text
TraceData Die Trace Data value with its property. See DieTraceDat for the
property.
Any form depending on
Data.
ServiceStatus Result of service to show successful or reason of failure. Text
SEMI T13-1104 © SEMI 2004 24
APPENDIX 1
APPENDIX Device Tracking
NOTICE: The material in this appendix is an official part of SEMI T13 and was approved by full letter ballot
procedures on April 30, 2004.
A1-1 Device Tracking
A1-1.1 Die Tracking vs. Device Tracking
A1-1.1.1 Growing modern semiconductor technology allows more than one die in a package. Such package
technologies as Flip Chip Packaging and System In Package (SIP) are examples. Sometimes more than five dice are
packaged in a small plastic package. Because the word “device” is the final product of semiconductor, tracking
devices can be covered by tracking die specification.
A1-1.2 Device Tracking Data — Devices are moved from one substrate to another. The dimensions of the
substrates are not the same so inevitably there will not be a one-to-one relationship between the “From” substrate
and the “To” substrate. The simplest solution would be to send a set of reports each of which include the “From”
substrate type, ID and XY devices coordinates and the same type of information again for the “To” substrate. This
will, however, lead to a lot of repetition of substrate type and ID.
A1-1.2.1 Tracking Report — In order to keep it compact, the report will contain an ordered array of elements for
each device on the “To” substrate. The “From” substrate type and Id are only provided when substrate changes.
The array may be row major or column major to match the processing sequence used on equipment, otherwise the
“From” substrate type and Id might change back and forth.
A1-1.2.2 Device Tracking Example — An example of Device Tracking is provided in Related Information.
A1-1.3 Device ID Data — Devices may be marked either while they are still on the wafer (ref: Backside WaferId
TF) or when they are packaged on a strip, or in a tray.
A1-1.3.1 Device ID Reporting Example — An example of Device ID Reporting is provided in Related
Information..
A1-1.4 Substrate Layout Data — Device Tracking Data and Device ID Data depend on the devices to which they
refer being arranged in a regular two dimensional array or matrix. I some cases, for example a multi-chip module,
this is not the case. The Substrate Layout Data contains a representation of the substrate geometry in terms of
repeating and nested matrices. Each matrix works as an identifier which links those elements to the corresponding
Device Tracking Data and Device ID Data.
A1-1.4.1 Substrate Layout Data Example — example of Substrate Layout Data Reporting is provided in Related
Information.