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SEMI E2-93 © SEMI 1986, 2003 2 4 Referenced Documents SEMI M1 — Specifications for Polished Monocrystalline Silicon Wafers SEMI M3 — Specifications for Polished Mono- crystalline Sapphire Substrates SEMI M9 — Specificati…

SEMI E2-93 © SEMI 1986, 2003 1

SEMI E2-93 (Withdrawn 1103)

SPECIFICATIONS FOR QUARTZ AND HIGH TEMPERATURE WAFER

CARRIERS

These specifications were technically reapproved by the Physical Interfaces & Carriers Committee and are

the direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition

approved by the North American Regional Standards Committee in October 1998. Initially available at

www.semi.org February 1999; to be published February 1999. Originally published in 1986; previous

published revision in 1996.

NOTICE: This document was balloted and approved

for withdrawal in 2003.

1 Scope

1.1 These specifications cover the dimensional

requirements for quartz and high temperature wafer

carriers used in processing wafers. These general

requirements assist in the compatibility of wafer

carriers and most automated wafer processing

equipment. Wafer pre-orientation is recommended

before transferring wafers into quartz carriers to avoid

interference between the flat fiducial(s) and carrier

slots. These standards are intended to promote the

interchangeability of wafer carriers and encourage the

production of equipment suitable to a greater

percentage of the market.

1.2 The design definitions of SEMI Wafer Carrier

Specifications assume compliance to wafer dimensions

defined in SEMI M1, M3, or M9. For a wafer carrier to

be said to “meet the SEMI specifications,” it must be

manufactured within the dimensional limits of the given

specification, and in addition be dimensionally stable

within specification when used in accordance with

manufacturer' s recommendations. Since wafer carriers

are manufactured from a number of different raw

materials and several different manufacturing methods,

it is up to each manufacturer to determine the

recommended usage for each wafer carrier type. The

specifications were not established nor do they

represent or suggest a means to obtain any ideal

efficiencies in wafer processing results or quality of end

product.

1.3 For referee purposes, SI (System International,

commonly called metric) units shall be used for 80 mm

and larger diameter wafers.

2 Selected Definitions

2.1 For illustrations of terms, see Figure 1 for Carrier

Style 1, and Figure 2 for Carrier Style 2. Dimensions

and tolerances are given in Table 1 of the standards for

carriers of the appropriate wafer diameter.

2.1.1 base — the material at the bottom of the carrier

that the carrier rests on when placed on a flat reference

surface.

2.1.2 bottom plane — a horizontal plane tangent to the

base.

2.1.3 end — either end of carrier parallel to wafer

plane.

2.1.4 lift access — the clearance space used to insert an

implement to pick up a wafer carrier.

2.1.5 side — either one of the sides perpendicular to

the wafer plane.

3 Dimension Definitions

Symbol

Wafer Height — distance from the horizontal center line

of the wafer to the bottom plane

Base Width — the outside dimension of the base from

side to side

C Base Length — length of the base from end to end

Lift Access Height — distance from horizontal

centerline of lift access opening to bottom plane

Lift Access Spacing — distance from center line to

center line of lift access opening

Lift Access Opening — size of opening for the insertion

of an implement to pick up the carrier

Base End to First Slot — the distance from either end of

the carrier to the first slot on same end

Slot Spacing — the distance from the center line of one

slot to the center line of the adjacent slot

End Slot to other End Slot — the center line of the first

slot on either end to the center line of the slot on the

other end

Pocket Size — the diameter of a circle coincident to the

bottom of all wafer slots in a wafer position

Base Side to Wafer Center line — horizontal distance

from the vertical wafer center line to either side of the

base

Carrier Region — region enclosed by the greatest

included angle between a line drawn from the center

point of the wafer and the outermost member of the

carrier on one side and a similar line on the other side

P Separation — separation of wafers when placed in slots

SEMI E2-93 © SEMI 1986, 2003 2

4 Referenced Documents

SEMI M1 — Specifications for Polished

Monocrystalline Silicon Wafers

SEMI M3 — Specifications for Polished Mono-

crystalline Sapphire Substrates

SEMI M9 — Specifications for Polished Mono-

crystalline Gallium Arsenide Slices

Figure 1

Style 1: Non-Contiguous 25 & 50 Slot

Figure 2

Style 2: Contiguous 25 & 50 Slot

APPLICATION NOTE

NOTE: The material contained in these application notes is not an official part of SEMI E2 and is not meant to modify or

supersede it in any way. Rather, these notes are provided primarly as a source of information to aid in the application of the

standard, as such, they are to be considered as reference material only. The standard should be referred to in all cases.

Table A1-1 lists the dimensions in linear, versus

angular, measurements for ease of dimensional

verification. The dimensions fall within SEMI

specification; however, they correspond closer to an

“L” angular dimension of 140 degrees versus the 150

degrees. The figures A1-1 and A1-2 illustrate these

dimensions for non-contiguous and contiguous style

quartz carriers.

A1-1 Carrier — Dimension L

Automated mass transfer of silicon wafers requires

edge contact below the centerline of the wafer

according to Table 1. These dimensions have been

determined as the minimum distance below the wafer

center line allowing the gripping mechanism to overlap

the vertical tangent of the wafer edge below the

centerline. This overlap allows the wafers to be

passively crattled. Contacting the wafer any higher

toward the centerline will require clamping force on the

wafers.

Table A1-1

Wafer Size 100 mm 125 mm 150 mm 200 mm

A 18 mm 21 mm 25 mm 32 mm

Style I & II (0.70" ) (0.82" ) (1.00" ) (1.25" )

Figure A1-1

Style 1: Non-Contiguous