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SEMI E1.9-0701 E2 © SEMI 1994, 2004 22 RELATED INFORMATION 1 NOTE: This related information is not an official par t of SEMI E1.9, and it is not intended to modify or supersede the standard in any way. This information w…

SEMI E1.9-0701

Table A1-1 Open Cassette Optional Features Checklist

Section Optional Feature Choice

6.9 carrier capacity (c)

13 wafers or

25 wafers

6.7.4 slant on 2 required fork-lift pick-up areas

angle ω = ____ (0° ≤ ω ≤ 2°)

6.4 4 robotic handling flanges

yes or

6.3 4 pentagonal side grip pits

yes or

6.7.1 features that prevent wafer creep-out

yes or

6.1 full 15 mm lead in provided by 3 features

that mate with kinematic coupling pins

primary kinematic coupling pins

yes or

and

secondary kinematic coupling pins

yes or

6.8.1 top cassette identification tag area

yes or

6.8.3 bottom cassette identification tag area

yes or

6.8.2 side cassette identification tag area (on front

right side domain)

yes or

NOTICE: These standards do not purport to address safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish appropriate safety and health practices and determine the

applicability of regulatory limitations prior to use. SEMI makes no warranties or representations as to the suitability

of the standards set forth herein for any particular application. The determination of the suitability of the standard is

solely the responsibility of the user. Users are cautioned to refer to manufacturer' s instructions, product labels,

product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are

subject to change without notice.

The user' s attention is called to the possibility that compliance with this standard may require use of copyrighted

material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights are entirely their own responsibility.

SEMI E1.9-0701

RELATED INFORMATION 1

NOTE: This related information is not an official part of

SEMI E1.9, and it is not intended to modify or supersede the

standard in any way. This information was inserted by the

North America Physical Interfaces and Carriers Committee to

alert the readers to potential changes to this provisional

standard.

R1-1 A revision ballot will be submitted to insert a

statement that application of info pads C and D are

reserved to be defined by the user (for example,

distinguishing between FEOL and BEOL carriers).

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer' s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user' s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E2-93 © SEMI 1986, 2003 1

SEMI E2-93 (Withdrawn 1103)

SPECIFICATIONS FOR QUARTZ AND HIGH TEMPERATURE WAFER

CARRIERS

These specifications were technically reapproved by the Physical Interfaces & Carriers Committee and are

the direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition

approved by the North American Regional Standards Committee in October 1998. Initially available at

www.semi.org February 1999; to be published February 1999. Originally published in 1986; previous

published revision in 1996.

NOTICE: This document was balloted and approved

for withdrawal in 2003.

1 Scope

1.1 These specifications cover the dimensional

requirements for quartz and high temperature wafer

carriers used in processing wafers. These general

requirements assist in the compatibility of wafer

carriers and most automated wafer processing

equipment. Wafer pre-orientation is recommended

before transferring wafers into quartz carriers to avoid

interference between the flat fiducial(s) and carrier

slots. These standards are intended to promote the

interchangeability of wafer carriers and encourage the

production of equipment suitable to a greater

percentage of the market.

1.2 The design definitions of SEMI Wafer Carrier

Specifications assume compliance to wafer dimensions

defined in SEMI M1, M3, or M9. For a wafer carrier to

be said to “meet the SEMI specifications,” it must be

manufactured within the dimensional limits of the given

specification, and in addition be dimensionally stable

within specification when used in accordance with

manufacturer' s recommendations. Since wafer carriers

are manufactured from a number of different raw

materials and several different manufacturing methods,

it is up to each manufacturer to determine the

recommended usage for each wafer carrier type. The

specifications were not established nor do they

represent or suggest a means to obtain any ideal

efficiencies in wafer processing results or quality of end

product.

1.3 For referee purposes, SI (System International,

commonly called metric) units shall be used for 80 mm

and larger diameter wafers.

2 Selected Definitions

2.1 For illustrations of terms, see Figure 1 for Carrier

Style 1, and Figure 2 for Carrier Style 2. Dimensions

and tolerances are given in Table 1 of the standards for

carriers of the appropriate wafer diameter.

2.1.1 base — the material at the bottom of the carrier

that the carrier rests on when placed on a flat reference

surface.

2.1.2 bottom plane — a horizontal plane tangent to the

base.

2.1.3 end — either end of carrier parallel to wafer

plane.

2.1.4 lift access — the clearance space used to insert an

implement to pick up a wafer carrier.

2.1.5 side — either one of the sides perpendicular to

the wafer plane.

3 Dimension Definitions

Symbol

Wafer Height — distance from the horizontal center line

of the wafer to the bottom plane

Base Width — the outside dimension of the base from

side to side

C Base Length — length of the base from end to end

Lift Access Height — distance from horizontal

centerline of lift access opening to bottom plane

Lift Access Spacing — distance from center line to

center line of lift access opening

Lift Access Opening — size of opening for the insertion

of an implement to pick up the carrier

Base End to First Slot — the distance from either end of

the carrier to the first slot on same end

Slot Spacing — the distance from the center line of one

slot to the center line of the adjacent slot

End Slot to other End Slot — the center line of the first

slot on either end to the center line of the slot on the

other end

Pocket Size — the diameter of a circle coincident to the

bottom of all wafer slots in a wafer position

Base Side to Wafer Center line — horizontal distance

from the vertical wafer center line to either side of the

base

Carrier Region — region enclosed by the greatest

included angle between a line drawn from the center

point of the wafer and the outermost member of the

carrier on one side and a similar line on the other side

P Separation — separation of wafers when placed in slots