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SEMI E33-94 © SEMI 19 94, 1996 5 ELF emissions shall be measured usin g a calibrated ELF meter. Equipment emissions shall be measured at a distan ce of 1.5 meters f ro m t he en tire perimeter of the EUT at a height of 1…

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SEMI E33-94 © SEMI 1994 4
Table 3 Ports for Process, Measurement and Control Lines, and Long Bus and Control Lines
Test Type Specification Basic Standard Remarks
Performance
Criteria
3.1 Fast transients common
mode
2 kV (peak)
5/50 Tr/Th ns
5 kHz rep. frequency
IEC 801-4
Capacitive clamp
B
3.2 Radio Frequency
common mode 1 kHz 80%
AM
0.15-100 MHz
3 V (rms) (unmod)
150 Ω source impedance
IEC TC 65 (Sec.) 144 Applicable to cables whose
length can exceed 1m
A
Table 4 Input and Output DC Power Ports
Test Type Specification Basic Standard Remarks
Performance
Criteria
4.1 Fast transients common
mode
2 KV (peak)
5/50 Tr/Th ns
2.5 kHz rep. frequency
IEC 801-4 4 kV (peak) when coupling
with capacitive clamp
B
4.2 Radio Frequency common
mode 1 kHz 80% AM
0.15-100 MHz
3 V (rms) (unmod)
150 Ω source impedance
IEC TC 65 (Sec.) 144 Applicable to cables whose
length can exceed 1 m
A
Note: Direct injection method shall be used if current consumption is less than 100 A. This test is not applicable to input ports
intended for connection to dedicated non-rechargeable power supplies.
Table 5 Input and Output AC Power Ports
Test Type Specification Basic Standard Remarks
Performance
Criteria
5.1 Fast transients common
mode
4 kV (Peak)
5/50 Tr/Th ns
5 kHz rep. frequency
IEC 801-4 4 kV (peak) when coupling
with capacitive clamp
B
5.2 Radio Frequency common
mode 1 kHz 80% AM
0.15-100 MHz
150 Ω source impedance
IEC TC 65 (Sec.) 144 Applicable to cables whose
length can exceed1 m
A
5.3 Surge 4.0 kV IEC TC 65 (Sec.) 137 Use combination wave test
generator:1.2/50 µs open
circuit, 8/20 µs short circuit
wave form
C
5.2 Emissions Test
5.2.1 EMI Testing Required — Equi pment shall be tested in accordance with CISPR 22 and EN 55 022. Test limits
are Class A, which is generally limited to non-residential use.
As noted above for radiated immunity testing, the size and complexity of semiconductor factory equipment may rule
out the use of special facilities. Thus, the tests in CISPR 22 may be adapted as required due to test site limitations.
Again, use of such facilities will yield more reproducible and accurate data, and is recommended whenever possible.
In any event, emissions greater than 6 dB above the Class A limits are not allowed.
5.2.2 ELF Testing Required — ELF emission testing is required for all ELF-sensitive equipment, since such
equipment is commonly grouped together. ELF emission testing for other types of equipment is required on request
of a purchaser intending installation of ELF-sensitive equipment in the immediate vicinity.
SEMI E33-94 © SEMI 1994, 19965
ELF emissions shall be measured using a calibrated
ELF meter. Equipment emissions shall be measured at a
distance of 1.5 meters from the entire perimeter of the
EUT at a height of 1 meter. Facility ELF shall be
measured at a height of 1 meter in the region where
ELF-sensitive equipment installation is intended.
Measurement points shall be no greater than 0.5 meter
apart in the regions specified above. Facilities electrical
systems and adjacent equipment should be in normal
operation to assure accurate measurement of the actual
operating environment.
At each measurement point, the ELF sensor should be
oriented to produce the maximum reading. The
maximum from all the measurement points is then used
to determine the level from the table below:
Level A — ELF of less than 0.25 milliGauss rms
Level B — ELF of less than 0.50 milliGauss rms
Level C — ELF of less than 1.00 milliGauss rms
Level D — ELF of less than 2.00 milliGauss rms
Level E — ELF of 2.00 milliGauss rms and greater
6 Equipment Installation and Grounding
Special installation, power, and grounding requirements
necessary to meet this standard shall be thoroughly
documented by the equipment supplier. FIPS
Publication 94 and the IEEE Emerald Book are
suggested sources of information for recommended
practices in this area.
Removable shielded panels or doors that must be
properly secured to meet this standard should be labeled
“SECURE THIS PANEL TO REDUCE
ELECTROMAGNETIC EMISSIONS.” This labeling
requirement is not applicable to interlocked panels that
must be in place for the equipment to operate.
7 Documentation
Upon request of the purchaser a report of the test results
against this standard shall be furnished. Similarly, the
supplier may use this standard as a reference in
specifying the environmental requirements of
equipment.
8 Alternate Testing
Testing completed under a different, but substantially
similar standard may be substituted for the basic
standards specified herein if the performance criteria
and test levels are similar to those above. Such
substitution shall be noted in the test report, and must
be agreed to by the concerned parties. Examples
include substitution of ANSI C63.4-1991 testing for
CISPR 22.
Similarly, equipment which satisfies the European
EMC Directive and bears the CE mark meets this
specification.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
SEMI E33-94 © SEMI 1994 6
APPENDICES
The appendices are not an official part of this standard.
However, they contain relevant information for
customizing the basic standards for testing of
semiconductor equipment and facilities, and point out
areas of concern for which no standard currently exists.
A.1 Appendix A: Charged Wafer Testing
Due to overriding microcontamination concerns, non-
static-dissipative wafer carriers must be used during
semiconductor fabrication. It is suggested that any
equipment which handles wafers be tested with wafers
charged to 18 kV/in. The charge generator used for
801-2 testing can be used to charge the wafer. Some
experimentation will be required to determine the best
means to carry out this test. Alternately, the handling
mechanism may be challenged by air or contact
discharge directed to the mechanism.
It is suggested that wafer handlers be designed to
dissipate charge on incoming wafers in a controlled,
non-sparking manner. A simple AM radio tuned
between stations and placed near the handler has been
found to be a good qualitative means to detect sparking.
Sparking will result in pops and static being heard on
the radio.
A.2 Appendix B: ESD Test Methods
Although the contact method of ESD testing has been
found to be much more reproducible than the air
discharge, the air discharge is a more realistic
simulation of possible events that can occur in the
semiconductor factory. Also, the air discharge method
is the only realistic way to test objects that are primarily
fabricated from insulators, such as wet stations and
keyboards.
In addition to testing surfaces that come in contact with
humans and wafers, it is important to test any area of
the equipment that can be exposed to ESD. For
instance, wet stations are composed of assemblies
involving large masses of insulators in proximity to
metallic sensors and controllers. It is possible for the
insulating surfaces to build up charge, which then
sparks to a sensor or controller — all internal to the
equipment itself.
A.3 Appendix C: Future Directions
Items in this section are not requirements of this
standard, but are included to indicate currently ill-
defined goals for further improvements to
semiconductor factory EMC.
A.3.1 Static Charge — Minimization of static charge
promotes cleanliness, and avoids damage to material in
process and reticles.
It is suggested that electrostatic fields be held to under
200 V/cm (500 V/in). This would be applicable to
personnel, wafers, cassettes, cassette boxes, reticles,
reticle boxes, and all equipment and facility surfaces in
proximity to these items as well as all surfaces exposed
to filtered airflow. Measurements shall be made using a
properly-grounded electrostatic field meter in
accordance with its manufacturer's instructions.
A.4 Appendix D: National Requirements
A.4.1 U.S. — Section 5.1.1 Table 1, row 1.2: Radiated
immunity testing outside a shielded enclosure is legally
accomplished by obtaining an experimental license
from the FCC using FCC form 442. The FCC
recommends using techniques such as scanning or
hopping to avoid interference.
A.4.2 Europe — The earth port: Refer to Table 1.6 of
the informative annex to EN 50 082-2 for test
requirements applicable to the earth.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
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the contents in whole or in part is forbidden without express written
consent of SEMI.