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SEMI G75.13-06 98 © SEMI 1998 4 NOTICE: T hese standards do n ot purport to address safety issues, if any, ass o ciated with their use. It is the responsibility of t he user of these standards to establish appropriate sa…

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SEMI G75.13-0698 © SEMI 19983
5 Procedure
5.1 Setup the test circuit as shown in Figure 2.
Figure 2
Test Circuit for Measurement of Leakage Current
5.2 Place the first molded sample in the shielded box and attach clips to the leads A
1
and A
2
(see Figure 1).
Measure the initial leakage current at 500 volts maximum.
NOTE 3: The leakage current shall be measured after 5 minutes voltage application.
5.3 Repeat the measurement for all the lead pairs, A
2
with A
3
, B
1
with B
2
, and B
2
with B
3
.
5.4 Place the samples in the HAST chamber and run the test.
5.5 After the tester has been automatically cooled to room temperature, remove the samples.
5.6 Measure the leakage current between the same lead pairs mentioned in Sections 5.2 and 5.3.
5.7 Repeat the HAST exposure and measure the cur-rent leakage.
5.8 Calculation
5.8.1 Maximum and minimum leakage current shall represent the test results.
5.8.2 Calculate the average result for all of the test points at each test stage.
5.8.3 Obtained data should be converted to 100 volts basis or as agreed on between vendor and customer.
6 Related Documents
6.1 ASTM Specification
1
ASTM D 257 — Test Methods for D-C Resistance or Conductance of Insulating Materials
6.2 JIS Specification
2
JIS K 6911 — Testing Methods for Thermosetting Plastics
1 American Society of Testing and Materials, 100 Barr Harbor Drive, West Conshohoken, PA 19428-2959 (all cited standards may be found in
Volume 10.05 of the Annual Book of ASTM Standards)
2 Japanese Standards Association, 1-24, Akasaka 4 Chome, Minato-ku, Tokyo, Japan
SEMI G75.13-0698 © SEMI 1998 4
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G76-0299 © SEMI 1999 1
SEMI G76-0299
SPECIFICATION FOR POLYIMIDE-BASED ADHESIVE TAPE USED IN
TAPE CARRIER PACKAGES (TCP)
1. Purpose
1.1 This standard addresses the adhesive demands of
tape carrier packages (TCPs) and how reliability,
versatility and cost may be optimized. The
standardization of polyimide adhesive tape used in TCP
is being promoted in order to meet these demands.
2. Scope
2.1 This standard defines the standard for polyimide-
based adhesive tapes (hereinafter " tape" ).
3. Referenced Documents
NOTE: Standards cited below refer to the latest adopted
revision of the standard. (Draft documents may not be
referenced.)
3.1 JIS Standards
1
C-1303 — High Insulation Resistance Meters
C-2110 — Testing Methods for Electric Strength of
Solid Insulating Materials
C-2318 — Polyester Films for Electrical Purposes
P-8101 — Testing Method for Dissolving Pulp
Z-3282 — Soft Solder
4. Terminology
4.1 camber — Curvature of the tape strip edge.
4.2 machine direction (MD) curl — Curvature along
the length of the tape.
4.3 tranverse direction (TD) curl — Transverse
bowing of the tape.
4.4 twist — Angular rotation of one end of the tape
with reference to the other end.
4.5 wakame — Waviness along the edge of the tape.
5. Ordering Information
5.1 The following items shall be included in purchase
orders for tape which conforms to this standard:
1 Japanese Standards Association, 1-24, Akasaka 4 Chome, Minato-
ku, Tokyo, Japan
5.1.1 Type of adhesive material
5.1.2 Type of base film
5.1.3 Width of adhesive material
5.1.4 Width of base film
5.1.5 Length of product
6. Requirements
6.1 Structure of Polyimide Adhesive Tape Used in
TCP — Adhesive material is applied to polyimide film
defined in Section 6.2. When necessary, a protective
film may be used to stop adhesion of the adhesive
material to the back of the tape to prevent
contamination of the adhesive material, improve
puncture characteristics, etc.
6.2 Base Film Thickness and Width
6.2.1 Base Film Thickness (see Table 1)
Table 1. Base Film Thickness
Thickness (
µ
m) Tolerance (
µ
m)
50.0
± 4.0
75.0
± 5.0
125.0
± 8.0
For thicknesses other than those above, use nominal value
thickness denoted in µm.
6.2.2 Base Film Width (see Table 2)
Table 2. Base Film Width
Width (mm) Tolerance (mm)
34.975
± 0.10
48.175
± 0.10
69.95
± 0.10
For widths other than those above, use nominal value width
denoted in mm.
6.3 Adhesive Material Thickness and Width
6.3.1 Adhesive Material Thickness (see Table 3)