semi合集-English.pdf - 第935页
SEMI E119-1104 © SEMI 2002, 2004 7 must not allow a wafe r to move outside of a circle of radius correspo nding to the larger bound on r 2. Ther e are two exceptions to this limit o n wafer movement. When the wafer is pu…
SEMI E119-1104 © SEMI 2002, 2004 6
z
4.6
x
1
50
x
2
75
x
3
125
Detail in
Figure 5
Detail in
Figure 4
horizontal datum plane
z 8
= 35
15
z 6
28.5
z
12
= 6.25
bilateral datum plane
Figure 3
Front View of FOBIT Internal Dimensions
z
23
1.5
z
11
2.9
z
12 = 6.25
x
3
125
bilateral
datum
plane
top
nominal
wafer
plane
z
z
10 = ± 0.5
(height of
wafer bottom)
r
2 = 152
r3
r2 + 1
+1
–0
z
15
4.6
Figure 4
Upper Cross-Section at Facial Datum Plane
5.7.1 Wafer Set-Down Volume — The open space for
the wafer set-down volume consists of a cylindrical
section with radius r2 and a main axis parallel to and y1
in front of the nominal wafer centerline. The top of this
cylindrical section is z11 above the nominal wafer-
seating plane and its bottom is z10 above the nominal
wafer-seating plane. The implications for wafer
positioning of the tolerance on r2 are as follows. The
wafers should be placed in the FOBIT within a circle of
radius corresponding to the smaller bound on r2 to
avoid touching the edge of the wafer to the side of the
FOBIT. Once the wafer has been placed, the FOBIT
SEMI E119-1104 © SEMI 2002, 2004 7
must not allow a wafer to move outside of a circle of
radius corresponding to the larger bound on r2. There
are two exceptions to this limit on wafer movement.
When the wafer is pushed toward the rear of the
FOBIT, the location of the wafer is defined by the
wafer pick-up volume (see Section 5.7.3). When the
FOBIT is gently tilted forward up to 45°, the wafers
may slide forward, but it is recommended that they not
extend further than y20 from the facial datum plane.
5.7.2 Wafer Extraction Volume — The open space for
the wafer extraction volume includes a cylindrical
section with radius r3 and a main axis parallel to and y1
in front of the nominal wafer centerline. The top of this
cylindrical section is z11 above the nominal wafer-
seating plane and its bottom is z23 above the nominal
wafer-seating plane. The wafer extraction volume also
includes the extrusion out the front of the FOBIT of this
cylindrical section. The implications for wafer
extraction of the definition of dimension r3 (r3 r2 +
1) are as follows; the FOBIT must give an extra 1mm
(0.04 in.) of horizontal clearance once the wafer is
picked up from wherever it ends up (within the bounds
of r2) after transport in the FOBIT.
5.7.3 Wafer Pick-Up Volume — If a wafer is placed in
the wafer set-down volume and is then pushed toward
the rear of the FOBIT, then the entire bottom of the
wafer must be contained in the wafer pick-up volume.
However, if the wafer is not pushed toward the rear of
the FOBIT, then the wafer may only be somewhere
within the wafer extraction volume. The wafer pick-up
volume is defined by a cylindrical section with radius
r1 and a main axis at the nominal wafer centerline. Its
top and bottom are the upper and lower tolerance of z10
around the nominal wafer-seating plane.
z
8 =35
x
3
125
z
12 =6.25
z
12 =6.25
bilateral
datum
plane
horizontal
datum plane
bottom
nom inal
wafer
plane
z
6
28.5
Figure 5
Lower Cross-Section at Facial Datum Plane
SEMI E119-1104 © SEMI 2002, 2004 8
Table 1 Internal FOBIT Dimensions (Figures 15)
Symbol
Used
Figure
Number
Value Specified
Datum Measured from
Boundary or Feature Measured to
r1 1 151 mm (5.94 in.)
maximum
nominal wafer centerline outer edge of wafer pick-up volume
r2 1, 4 152 = + 1/– 0 mm
(5.98 + 0.04 – 0 in.)
y1 in front of nominal
wafer centerline
encroachment of FOBIT side domains on
wafer set-down volume
r3 1, 4 r2 + 1 mm (0.04 in.)
minimum
y1 in front of nominal
wafer centerline
encroachment of FOBIT side domains on
wafer extraction volume
r4 1 170 mm (6.69 in.)
minimum
nominal wafer centerline encroachment of FOBIT on end effector
exclusion zone between front and rear FOBIT
side domains
x1 1, 3 50 mm (1.97 in.)
minimum
bilateral datum plane inside of rear FOBIT side domains
x2 1, 3 75 mm (2.95 in.)
maximum
bilateral datum plane outside of rear FOBIT side domains
x3 1, 3, 4, 5 125 mm (4.92 in.)
minimum
bilateral datum plane inside of front FOBIT side domains
x51 1 140 mm (5.51 in.)
minimum
bilateral datum plane interior of FOBIT sides between y11 and y49
x52 1 170 mm (6.69 in.)
minimum
bilateral datum plane interior of FOBIT sides between y49 and y52
y1 1 3 mm (0.12 in.)
maximum
facial datum plane origin of r2 and r3 on bilateral datum plane
y5 1, 2 120 mm (4.72 in.)
minimum
facial datum plane front of rear FOBIT side domains
y11 1 85 mm (3.35 in.)
maximum
facial datum plane interior of FOBIT sides between x3 and x51
y20
#1
None 158 mm (6.22 in.) facial datum plane maximum protrusion of wafers toward the
front of the FOBIT
y49 1 134 mm (5.28 in.)
maximum
facial datum plane interior of FOBIT sides between x51 and x52
y51 1, 6, 8 140 mm (5.51 in.)
minimum
facial datum plane rear of door
z6 2, 3, 5 28.5 mm (1.12 in.)
maximum
horizontal datum plane top of FOBIT bottom domain
z8 2, 3, 5 35 mm (1.38 in.) horizontal datum plane bottom nominal wafer seating plane
z10 4 0 ± 0.5 mm
(0.00 ± 0.02 in.)
each nominal wafer
seating plane
entire bottom of the wafer
z11 4 2.9 mm (0.11 in.)
minimum
each nominal wafer
seating plane
encroachment of FOBIT side domains on
clearance above the wafer
z12 2, 3, 4, 5 6.25 mm (0.25 in.)
nominal
each nominal wafer
seating plane
adjacent nominal wafer seating planes
z15 2, 3, 4 4.6 mm (0.18 in.)
minimum
top nominal wafer
seating plane
bottom of FOBIT top domain
z23 4 1.5 mm (0.06 in.)
maximum
each nominal wafer
seating plane
bottom of wafer extraction volume
#1
These dimensions are for optional features.
5.8 External Dimensions — Figures 6 through 8 and
Figure 10 show the side, rear, top, and bottom views for
the FOBIT, respectively. Table 2 defines all of these
dimensions. In this and following figures, the heaviest
lines are used for surfaces that have tolerances (not
surfaces that have only maximum or minimum
dimensions). If an identification tag is used, it must be
located at the bottom rear centered on the bilateral
datum plane and must be contained within the
maximum outer dimensions of the FOBIT.