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SEMI E49.2-1104 © SEMI 1995, 2004 8 10.7.2 To avoid the cost involved in perform ing the Particle test (Section 9.4) and Ionic and Metallic Contamination tests (Section 9.5) on every Assembly delivered directly to an en …

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SEMI E49.2-1104 © SEMI 1995, 2004 7
intervals with very small counts are not taken. In
addition, the user should remain cognizant of the
requirement in Table 1 for allowable particle adders.
9.4.7 As noted in Table 1, the requirement to pass this
test is <
120 allowable Particle adders (particles/L > 0.1
µm). The outlet particle concentration and date and
concentration of most recent inlet particle concentration
verification should be noted on the test report.
9.5 Anions and Metals Testing Recommendations —
These tests are required periodically to establish that the
Assembly design is typically capable of meeting the
performance criteria in Table 1.
9.5.1 The test flow rate should be no more than the
maximum recommended flow for the Assembly under
test or the instrument(s) being used.
9.5.2 Grab Sample Methodology for Assembly supply:
Step 1: Open and close sampling valve 5 times.
Step 2: Open valve full throttle and allow UPW to flow
for at least 2 minutes.
Step 3: Adjust to approximately 1liter/minute and
allow to flow at least 5 minutes.
Step 4: Use precleaned and qualified bottles one each
for anions and metals.
Step 5: Fill to overflowing and empty the contents.
Repeat 4 times. Avoid contact with the neck or inside
of the cap with hands or sample port.
Step 6: Minimizing the distance between the port and
bottle, fill the container to the bottom of the neck.
Step 7: Carefully rinse the cap and immediately secure
it tightly to the bottle.
9.5.3 Grab Sample Methodology for Assembly
Outflow:
Step 1: Under standard assembly operation, allow
outflow to run at least 5 minutes.
Step 2: Use precleaned and qualified bottles one each
for anions and metals. Note that for convenience,
outflow bottles may be prerinsed using inflow UPW.
Step 3: Minimizing the distance between the outflow
and bottle, fill the container to the bottom of the neck.
Step 4: Carefully rinse the cap and immediately secure
it to the bottle.
9.5.4 Use ASTM D4327 with preconcentration to
analyze anions. Use an industry standard method with
ICP-MS to analyze metals.
9.5.5 Required precision for each analyte is such that
the difference of the incoming and outgoing reading has
an error of no more than +/- 20%.
9.5.6 As noted in Table 1, the requirements to pass this
test are dependent on the ionic or metallic adder. The
inlet and outlet concentrations for each analyte (or
copies of laboratory reports) should be maintained and
available upon request.
10 Certification
10.1 The supplier of an Assembly shipped to an end
user is responsible for defining, establishing, executing,
and maintaining a certification program based on the
tests in Section 6.
10.2 By default all of the requirements within this
document apply unless another agreement is made
between supplier of an Assembly shipped to an end
user and an end user.
10.3 Qualification tests and certification documents
shall reflect current production practices.
10.4 The certification program will specify any
necessary corrective action plan in the event that an
Assembly fails to meet these requirements during
testing.
10.5 Upon request, the supplier of an Assembly
shipped to an end user is responsible for supplying
documentation that proves the Assembly consistently
meets the requirements of this document.
10.6 As stated in the purpose, this document is a
“guideline by which the purity and mechanical integrity
of all ultrapure water and liquid chemical Assemblies
shipped to end users may be qualified”. To ensure the
purity and mechanical integrity of Assemblies shipped
to end users is maintained, these guidelines must also
be implemented throughout the supply chain. Section
10.7 provides recommendations for Assemblies shipped
directly to an end user and Section 10.8 provides
recommendations for the remainder of the supply chain.
10.7 The certification program for an Assembly
delivered directly to an end user will specify the
frequency of testing and the test Assembly(s).
10.7.1 Each individual Assembly delivered directly to
an end user shall have the following tests performed:
Hydrostatic test (See Table 1 and Sections 9.1 and
9.2)
Ultrapure Water Flush test (see Table 1 and
Sections 9.1, 9.3.1, and 9.3.2)
SEMI E49.2-1104 © SEMI 1995, 2004 8
10.7.2 To avoid the cost involved in performing the
Particle test (Section 9.4) and Ionic and Metallic
Contamination tests (Section 9.5) on every Assembly
delivered directly to an end user, Assemblies shall be
selected which represent all unique components and
production techniques. The Assemblies will be
certified as meeting the requirements within Table 1
based on the outcome of the representative tests and a
periodic testing program.
10.7.3 Particular attention and increased testing
frequency are recommended for Assemblies that
include components not covered by SEMI F57.
10.7.4 The supplier of an Assembly shipped directly to
an end user should specify which components do, and
which components do not, comply with SEMI F57
where SEMI F57 is applicable.
10.8 The certification program for Assemblies not
delivered directly to an end user will specify the
frequency of testing and the test Assembly(s).
10.8.1 To avoid the cost involved in performing
Hydrostatic testing (Section 9.2), the Ultrapure Water
Flush test (section 9.3), the Particle test (Section 9.4)
and the Ionic and Metallic Contamination tests (Section
9.5) on every Assembly, test Assemblies shall be
selected which represent all unique components and
production techniques. The Assemblies will be
certified as meeting the requirements of Table 1 based
on the outcome of the representative tests and periodic
testing program. Particular attention and increased
testing frequency are recommended for Assemblies that
include components not covered by SEMI F57.
10.8.2 The supplier chain should specify which
components do, and which components do not, comply
with SEMI F57 where SEMI F57 is applicable.
11 Supply Chain Traceability
11.1 It will be the responsibility of all Assembly
suppliers to verify that all components covered by
SEMI F57 comply with the specifications set forth in
SEMI F57.
11.2 It will be the responsibility of all Assembly
suppliers to ensure that all components have been
handled and assembled in accordance with the
recommendations set forth in SEMI E49.7.
11.3 It will be the responsibility of all Assembly
suppliers to maintain records that show all assemblies
comply with Section 10 of this document.
11.4 It will be the responsibility of all Assembly
suppliers to ensure that their sources of Assemblies are
controlled to the extent that they support the
requirements within Section 10.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer's instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E49.4-0298 © SEMI 1995, 19981
SEMI E49.4-0298
GUIDE FOR HIGH PURITY SOLVENT DISTRIBUTION SYSTEMS IN
SEMICONDUCTOR MANUFACTURING EQUIPMENT
1 Purpose
1.1 This document specifies guidelines for high purity
(HP) solvent distribution systems in semiconductor
production equipment.
2 Scope
2.1 The distribution systems consi st of stainless steel
(SS) piping designed to supply flammable solvents
only.
2.2 Typical processes are photolithography track
equipment, solvent wet stations, and isopropyl alcohol
vapor dryers.
3 Referenced Documents
3.1 SEMI Standards
SEMI E49 — Guide for Standard Performance,
Practices, and Sub-Assembly for High Purity Piping
Systems and Final Assembly for Semiconductor
Manufacturing Equipment
SEMI E49.6 — Guide for Subsystem Assembly and
Testing Procedures - Stainless Steel Systems
SEMI F1 — Specification for Leak Integrity of High-
Purity Gas Piping Systems and Components
3.2 ASTM Standards
1
See Section 3.3 of SEMI E49.
3.3 ASM Document
2
ASM UNS S31603 — Composition of Standard
Stainless Steels
3.4 ASME Document
3
ASME SA479 — Specification for Stainless and Heat-
Resisting Steel Bars and Shapes for Use in Boilers and
Other Pressure Vessels (ASTM A 479/A 479-90)
(Boiler and Pressure Vessel Codes, 1989)
4 Terminology
See Section 4 of SEMI E49.
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohoken, PA 19428-2959
2 American Society of Metals, Metals Park, OH 44073
3 American Society of Mechanical Engineers, 345 East 47th Street,
New York, NY 10017
5 Performance Guidelines
5.1 Leak Test and Purity Indices
5.1.1 Pressure Decay Test
• Test Media — Nitrogen (N
2
)
• Pressure — 2 times system operating pressure
• Time — 24 hours
• Temperature — Constant
• Fail-Pressure Loss — > 1% of test pressure
5.1.2 N
2
Particle Count (ptc), at ≥ 0.2 µm Size
• < 0.18 ptc/L (< 5 ptc/ft
3
) average single count
• < 1.8 ptc/L (< 50 ptc/ft
3
) maximum single count
5.2 All performance measures are absolute values,
relative to respective test instrument background level.
5.3 See SEMI E49.6 for recomme nded gas system
testing procedures.
5.4 Reliability and Maintainability Indices —
Equipment supplier should provide actual gas system
performance data and/or component reliability data,
accompanied by the associated failure analysis method.
Indices Hours
Mean time between failure (MTBF)
Mean time between assists (MTBA)
Mean time to repair (MTTR)
Start-up time (Initial)
6 Design Guidelines
6.1 All weld joints should be automatically orbital butt
welded.
6.2 Mechanical fittings should be used where required
for component removal/replacement.
6.3 Dead volumes should be less than five pipe
diameters in length/height. Pressure gauges with gauge
protectors should be used. Pressure transducers are
optional.
6.4 A means of process liquid sampling should be
installed as close as possible to point of dispense.