semi合集-English.pdf - 第5460页

SEMI PR9-0705 © SEMI 2005 4 7.2.3 The reader is specifically reques ted to consult the Materials Safety Data Sheet (MSDS) and the manufacture r’s recomm ended practices for any fl uid or com ponent prior to use a n d to …

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SEMI PR9-0705 © SEMI 2005 3
6.3.6 Volumes should be minimized (internal, connecting, interface/interconnection, dead volumes), give relation to
time and process response, give dry-down constraints.
6.3.7 Surface roughness requirements.
6.3.8 Design for shock and vibration criteria, Reference MIL-STD 810.
6.3.9 Leak integrity: permeability, across the seat, and inboard. Reference SEMI F1.
6.3.10 Accuracy, repeatability, control range requirements.
6.3.11 Purging capability, number of times of full scale should flow for purging, turnover requirement.
6.3.12 Direction of flow
6.3.13 Upstream filtration requirements, particle requirements, moisture, other contamination characteristics.
Reference SEMI E49 for high purity and ultrahigh purity systems.
6.3.14 Attitude constraints
6.3.15 Design for reliability requirements, MTTF, MTTR
6.3.16 Temperature limits
6.3.17 Pressure (proof, burst, inlet) limits
6.3.18 Flow ranges
6.3.19 Scaling rule for dimensions of interconnections
1
6.3.19.1 Consider scaling rule to be different for different industrial applications. For example gas and liquid
cannot use the same scaling rule.
6.3.20 Adapter guidelines for smooth transition from Macro to Micro. This is for the case the MEMS system is to
replace an existing device, and there is a mismatch of the dimensions. A flexible transition may be considered if
space is limited.
6.3.21 Surfaces that come into contact with samples, process gasses, or chemicals must not adsorb or react with
them. Select components or tubing that is: 1) inherently compatible, 2) can be treated (water rinsed, O
2
ashing, acid
clean...) or 3) coated (Teflon
®
, SiO
2
, ...), to be compatible. Consider protein materials where the quantity of
biomaterial sticking to surfaces will be dependent upon the wetted surface area and how well the fluid adsorbs to the
surface.
7 Materials Guidelines
7.1 Purpose — Provide a Matrix of Materials Compatibility for commonly used materials and provide examples of
applying the matrix to designs.
7.2 Scope — Use of this guide is limited to materials types known to be commonly used such as: silicon, polymers,
glass, metals, ceramics and plastics.
7.2.1 This guideline applies to materials which may be used in fluidic devices in large or small form factors. It is
assumed the material is in the wetted flow path as either a thin surface film or bulk material. Standard temperature
(0ºC) and pressure (1 atm) are conditions considered in this table unless otherwise stated. Physical, mechanical,
thermal, microstructural, and electrical properties of materials can be found in materials selection handbooks or
material supplier datasheets. Breadth of details for chemical compatibility and materials properties varies widely
within these literature and care must be taken to consider relevant information. unlikely that a single source of
information would be suitable.
7.2.2 The intended use of the compatibility matrix is to provide a general resource to the user. Detailed research
into materials compatibility with specific chemicals is an important part of any product development program. In
depth research into materials and fluid analysis are beyond the scope of this guide and will be required in most
circumstances.
1 Hsu, Tai-Ran; MEMS and Microsystems Design and Manufacture; McGraw-Hill, 2002 Section 6.7.
SEMI PR9-0705 © SEMI 2005 4
7.2.3 The reader is specifically requested to consult the Materials Safety Data Sheet (MSDS) and the
manufacturer’s recommended practices for any fluid or component prior to use and to follow the suggestions
prescribed. In addition, the acceptable degree of chemical and material incompatibilities are relative to conditions of
use. For instance, microscopic corrosion may be intolerable in one application yet may be quite tolerable in another.
A list of such considerations is well documented in materials selection handbooks
2
, 3 , 4
.
7.3 In Service Considerations are partially listed below.
7.3.1 Operating pressure
7.3.2 Operating temperature
7.3.3 Chemical environment: dry, moist, corrosive
7.3.4 Loads-magnitude, nature-tension, bending, torsion
7.3.5 Loads-nature-static, dynamic, impact
7.3.6 Mating part materials
7.3.7 Attachment points/ mechanisms
7.3.8 Presence of potential crevices
7.3.9 Allowable deflections /rotation
7.3.10 Allowable failure modes
7.3.11 Dimensional stability needed-short and long term
7.3.12 Frequency of assembly and disassembly
7.3.13 Insulation-thermal/electrical
7.3.14 Isolation-RF, thermal, electrical
7.3.15 Chemical Potential
7.4 Manufacturing Considerations are partially listed below.
7.4.1 Cost
7.4.2 Availability of material
7.4.3 Stock shapes-availability
7.4.4 Weldability
7.4.5 Formability
7.4.6 Expected consumption rate
7.4.7 Machinability
7.4.8 Achievable surface finishes
7.5 Assembly/Transport/Shipping consideration partially listed below.
7.5.1 G Forces-allowable shock and vibration
7.5.2 Allowable Moisture
7.5.3 Allowable Temperature
7.5.4 Allowable Pressure
7.5.5 Total Weight
2 Cheremisinoff, Nicholas, P., Materials Selection Deskbook, William Andrew Publishing/Noyes, 1996, p.p. 18-36.
3 Kutz, M, Handbook of Materials Selection, 2002
4 Ashby, MF, Materials Selection in Mechanical Design, 2000
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7.5.6 Overall Dimensions
7.6 Possible root causes for chemical/materials incompatibility are partially listed below.
7.6.1 Cleanliness of fluid system
7.6.2 Outgassing of materials from solid surfaces into process fluid
7.6.3 Process fluid purity (trace chemical impurities)
7.6.4 Process fluid cleanliness (particulate)
7.6.5 Permeability of chemicals in solid materials
7.6.6 Infectious biomaterial
7.6.7 Corrosion-Erosion
7.7 Classification of materials and fluids
7.7.1 Fluids
7.7.1.1 Classification of Gases
5
(with examples)
7.7.1.1.1 Inerts — argon, helium, krypton, neon, radon, xenon
7.7.1.1.2 Hydrogen — deuterium, hydrogen, tritium
7.7.1.1.3 Hydrocarbons — acetone, acetylene, hexane, propane
7.7.1.1.4 Halogenated Hydrocarbons — carbon tetraflouride, octafluorocyclobutane
7.7.1.1.5 Hydrides — silane, germane, phosphine, arsine
7.7.1.1.6 Halogens, other than Fluorine — chlorine, iodine
7.7.1.1.7 Halides, other than Fluorides — hydrogen chloride, hydrogen bromide, hydrogen iodine
7.7.1.1.8 Fluorine and Fluorides — F
2
, XeF
2
, NF
3
, BF
3
,WF
6
7.7.1.1.9 Organo — Metallic and Siloxanes
7.7.1.1.10 Oxygen, Oxides and Sulfides
7.7.1.1.11 Nitrogen and Nitrogen Compounds
7.7.1.1.12 Acids — hydroflouric acid, nitric acid, sulfuric acid
7.7.1.1.13 Nano structures and compounds
7.7.1.2 Liquids
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7.7.1.2.1 Water — de-ionized, distilled
7.7.1.2.2 Inorganic Acids — hydrochloric acid, hydrofluoric acid, nitric acid
7.7.1.2.3 Bases — sodium hydroxide, potassium hydroxide, ammonium hydroxide
7.7.1.2.4 Organic acids — glacial acetic, trichloroacetic
7.7.1.2.5 Hydrocarbon solutions — toluene, iso-octane
7.7.1.2.6 Alcohols — ethyl, isopropanol, methyl
7.7.1.2.7 Amines — aniline, ethylenediamine
7.7.1.2.8 Ethers — tetrahydrofuran
7.7.1.2.9 Ketones/Aldehydes — acetone, benzaldehyde, methyl ethyl ketone
5 SEMI F79-0703 Guideline for Gas Compatibility with Silicon used in Gas Distribution Components
6 http://www.entegrisfluidhandling.com