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SEMI P30-0997 © SEMI 1997, 2004 4 maximum 5.5.4.3 Floor vibration, maximum ___________ dB 5.5.4.4 Air vibration, maximum ___________ dB 5.5.5 Electric power supply ___________ V/, ___________ /, ___________ kVA 5.5.6 W…
3 SEMI P30-0997 © SEMI 1997, 2004
5 Listed Items
The following are desirable items and examples for listing in the CD-SEM catalog.
5.1 Equipment name
5.2 Model
5.3 Performance
5.3.1 Throughput ___________ wafers/h (Example: 30 wafers / h)
5.3.2 Image resolution ___________ nm (Example: 5 nm)
5.3.3 Measurement precision
5.3.3.1 Static repeatability ___________ nm ( 3
n-1
) (Example: 5 nm ( 3
n-1
))
5.3.3.2 Dynamic repeatability ___________ nm ( 3
n-1
) (Example: 5 nm ( 3
n-1
))
5.3.3.3 Reproducibility ___________ nm ( 3
n-1
) (Example: 5 nm ( 3
n-1
))
5.3.3.4 Linearity ___________ nm ( 3
n-1
) (Example: 5 nm ( 3
n-1
))
5.3.3.5 Precision guaranteed range ___________ µm –
___________ µm
(Example: 0.2 µm ~ 10 µm, 5,000 ~
200,000 x)
5.4 Function
5.4.1 Wafer transport/Stage system
5.4.1.1 Transport method ___________ (Example: double cassette support
to C to C method)
5.4.1.2 Stage stopping error ___________µm (Example: ± µm)
5.4.1.3 Wafer size ___________ mm (Example: 100, 125, 150, 200 mm)
5.4.1.4 Positioning range ___________ (Example: whole wafer surface)
5.4.2 Alignment system
5.4.2.1 Alignment method ___________ (Example: uses optical image)
5.4.2.2 Alignment precision ___________± µm (Example: µm)
5.4.2.3 Pattern positioning method ___________ (Example: moving cursor)
5.4.2.4 Pattern positioning precision ___________ (Example: ± 0.1 µm)
5.4.3 Electro-optical system
5.4.3.1 Electron gun type ___________ (Example: LaB6 / schottky / C-FE)
5.4.3.2 Accelerating voltage ___________ (Example: 0.5 1.5 kV, 0.1 kV
step)
5.4.3.3 Probe current ___________ (Example: 0.2 10 pA)
5.4.3.4 Magnification ___________ (Example: 100 200,000 times)
5.4.4 Measurement
5.4.4.1 Measurement pattern ___________ (Example: line / hole / overlay)
5.4.4.2 Pattern determination method ___________ (Example: automatic (pattern
recognition) / manual/cursor)
5.4.4.3 Pattern edge determination
method
___________ (Example: automatic (line
approximation) / threshold method)
5.4.4.4 Operation method ___________ (Example: auto / semiauto / manual)
5.4.4.5 Communication protocol ___________ (Example: SECS)
5.4.5 Vacuum exhaust system ___________ (Example: TMP ( 500 L / s ) 1 unit,
SIP ( 20 L / s ) 2 units )
5.5 Installation conditions
5.5.1 Dimensions width______mm,
depth______mm,
height______mm
(May be included in the standard
diagram.)
5.5.2 Standard layout diagram
5.5.3 Mass ___________ kg
5.5.4 Permissible environmental
conditions
5.5.4.1 Loading capability ___________ Kg / m
2
5.5.4.2 Stray magnetic field, ___________ T p p
SEMI P30-0997 © SEMI 1997, 2004 4
maximum
5.5.4.3 Floor vibration, maximum ___________ dB
5.5.4.4 Air vibration, maximum ___________ dB
5.5.5 Electric power supply ___________ V/,
___________ /,
___________ kVA
5.5.6 Water supply ___________ L/min.
5.5.7 High-pressure gas supply ___________ (Example: Dry air, N
2
)
5.5.8 Reference standard (Example: SEMI PXX-XX)
6 Listed Items Guide (reference)
6.1 Equipment Name — List
6.2 Model — List
6.3 Throughput — To measure throughput, large-size
wafers are generally used. List the number of processes
per hour when 5-point measurement has been
continuously processed. When wafers other than the
maximum wafer sizes are used, list the wafer size.
Also, list if the operator should intervene. The
measurement position should be the center of wafer and
the outside 4 points from 1/2 of the diameter on the
diagonal line of the rectangle inscribing the wafer.
6.4 Please note that there are the following two
methods:
6.4.1 The number of wafers that can be processed per
hour for 1 wafer/lot processing.
6.4.2 The number of wafers that can be processed per
hour for 25 wafers/lot continuous processing.
6.5 Static Repeatability — Use 3
n-1
and nm as the
unit of measurement. When not listed, the sample
should be the photoresist pattern and the number of
measurement cycles should be 10.
6.6 Dynamic Repeatability — Use 3
n-1
and nm as the
unit of measurement. When not listed, the sample
should be the photoresist pattern, and the number of
measurement cycles should be 10. In addition, one
cycle of measurement should be just one cycle.
6.7 Reproducibility — Use 3
n-1
and nm as the unit of
measurement. When not listed, the sample should be
the photoresist pattern.
6.8 Image Resolution — The resolution should be
listed in nm. In addition, the accelerating voltage
acquired should be listed. When not listed, the sample
should use gold deposition, and the conversion should
be done from the photo image.
6.9 Measurement Precision Warranty Range —
Should be listed in µm. When the precision depends on
magnification, the listing of magnification is desirable.
6.10 Operation Method — List methods that can be
used in auto, semi-auto, and manual.
6.11 Transport Method — List double-cassette
supporting C to C method and/or SMIF supporting C to
C method.
6.12 Wafer Size — List dimensions defined in SEMI
M1. When creating guidelines, the dimensions are as
follows: 2 inch, 3 inch, 100 mm, 125 mm, 150 mm, 200
mm, 300 mm, and 400 mm.
6.13 Measurable Range — List ranges that can be
observed and measured through normal use in mm.
6.14 Stage Stopping Error — List the stopping error in
mm when moving the maximum distance in both X and
Y directions.
6.15 Alignment Method — List methods using optical
microscopes, SEM images, and other.
6.16 Alignment Precision — List in µm.
6.17 Measuring Pattern Identification Method — List
manual and auto and the content thereof.
6.18 Pattern Edge Determination — List manual and
auto and the content thereof.
6.19 Measuring Pattern Positioning Method — List
manual and auto and the content thereof.
6.20 Measuring Pattern Positioning Accuracy — List
in µm.
6.21 Magnification — List range.
6.22 Accelerating Voltage — List range in V or kV
units.
6.23 Electron Gun — List electron gun type.
6.24 Vacuum Exhaust System — List pump type,
exhaust volume, and number of units.
6.25 Communication Protocol — List external
computer and method of communication.
6.26 Dimensions — List block width, depth, and height
per equipment block in mm. This may be listed in the
standard layout diagram.
5 SEMI P30-0997 © SEMI 1997, 2004
6.27 Standard Layout Diagram — List the standard
layout when installing equipment. Equipment
installation conditions can be listed in the diagram.
6.28 Mass — List in kg.
6.29 Permissible Floor Weight — List in kg/m
2
.
6.30 Permissible Stray Magnetic Field — List in T,
and list effective values or peak values separately.
6.31 Permissible Floor Vibration — List the maximum
vibration level in dB in the 1–80 Hz frequency range.
The vibration acceleration level La is found from the
following equation:
La = 20l og ( a / a
o
)
Here,
a — Is the effective value of the vibration acceleration
when the sensory vibration is not corrected:
a
o
— (Standard vibration acceleration) (10
-6
m / s
2
)
6.32 Permissible Air Vibration — List the maximum
sound level in dB in the 20 Hz – 8 kHz frequency
range. The sound pressure level La is found from the
following equation:
La = 20l og (a / a
o
)
Here, a is the effective value for sound pressure in Pa
units.
a
o
(Standard sound pressure) (20 Pa)
6.33 Reference Specification — List guideline as the
reference specification.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standard set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights
asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised
that determination of any such patent rights or
copyrights, and the risk of infringement of such rights,
are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.