semi合集-English.pdf - 第932页
SEMI E119-1104 © SEMI 2002, 2004 4 5.5 Wafer Ori entation and Numberin g — The wafers must be horizontal when the FOBIT is placed on the kinematic coupling, an d the wafers slots are num bered in increasing order from bo…
SEMI E119-1104 © SEMI 2002, 2004 3
5 Requirements
The FOBIT has the following components and sub-
components:
Key:
Required feature
Optional feature
Door on front
Holes for latch keys that lock the door to the
FIMS interface when the door is unlatched
from the box
Holes for registration pins
Door presence sensing areas
Top
Top robotic handling flange (optional)
Interior
Non-removable cassette with supports for 25
wafers
Wafer capture mechanism
2 end-effector exclusion zones
Sides
Ergonomic manual handles (optional)
Bottom
5 carrier sensing pads
Center retaining feature
Front retaining feature
4 info pads
2 advancing box sensing pads
3 features that mate with kinematic coupling
pins and provide a 10 mm lead-in
3 features that mate with kinematic coupling
pins and provide a 15 mm lead-in (optional)
2 bottom side rails for use with roller conveyor
or forklifts (optional)
5.1 Kinematic Couplings — The physical alignment
mechanism from the FOBIT to the tool load-port (or a
nest on a vehicle or in a stocker) consists of features
(not specified in this standard) on the top entity that
mate with three or six pins underneath as defined in
SEMI E57. The three features that mate with the
kinematic coupling pins must provide a lead-in
capability that corrects a FOBIT misalignment of up to
r69 in any horizontal direction.
5.2 Inner and Outer Radii — All required concave
features may have a radius of up to r65 to allow
cleaning and to prevent contaminant build-up. All
required convex features may also have a radius of up
to r66 to prevent small contact patches with large
stresses that might cause wear and particles. Note that
these limits on the radius of all required features are
specified as a maximum (not a minimum) to ensure that
the required features are not rounded off too much. The
lower bound on the radius is up to the FOBIT supplier.
Note also that this radius applies to every required
feature unless another radius is called out specifically.
A required feature is an area on the surface of the
FOBIT specified by a dimension (or intersections of
dimensions) that has a tolerance and not just a
maximum or minimum (such as the edges of the robotic
handling flange).
5.3 Door
— It is recommended that the FOBIT be in a
horizontal orientation when it is opened or closed
(corresponding to the front side of the cassette where
wafers are accessed so the door is perpendicular to the
wafers and parallel to the facial datum plane). The door
and its frame must be designed to mate with a port that
conforms to SEMI E62. Specifically, the FOBIT door
and its frame must have surfaces that mate with the seal
zones and the reserved spaces for vacuum application
(which includes all of the circles bounded by r38 except
for the holes for the registration pins at the center of
each circle) defined in Sections 5.3 and 5.6 of SEMI
E62 (which specifies r38). These FOBIT door and
frame surfaces must be a distance of y52 from the facial
datum plane and must have a flatness of y42. No
surface on the FOBIT door may project further from the
facial datum plan than the door seal zone and the
reserved spaces for vacuum application. The door of the
FOBIT must also be designed so that when the FOBIT
is pressed against the FIMS port, both latch keys on the
port are inserted to their full length. Furthermore, when
the latch keys are turned more than 45 toward the
position that unlocks the FOBIT door, the latch key
holes on the door must be such that the door is not
removable from the latch keys.
5.4 Wafer Capture and Centering — When the FOBIT
is closed, the wafers must be captured in the FOBIT to
prevent movement during subsequent handling,
including transportation. It should be noted that wafers
are typically transported in a vertical orientation and
generally require support from a secondary package. It
is recommended that this secondary package be
designed to allow for easy removal of the FOBIT from
the secondary package.
SEMI E119-1104 © SEMI 2002, 2004 4
5.5 Wafer Orientation and Numbering — The wafers
must be horizontal when the FOBIT is placed on the
kinematic coupling, and the wafers slots are numbered
in increasing order from bottom to top (so the bottom
wafer is wafer number 1, the next wafer up is wafer
number 2, etc.).
5.6 Internal Horizontal Dimensions — Figure 1 shows
a cross-section of the horizontal boundaries of the
FOBIT side domains (which contain the parts of the
FOBIT higher than z6 above the horizontal datum plane
and lower than z15 above the top wafer). In this and
following figures, the heaviest lines are used for
surfaces that have tolerances (not surfaces that have
only maximum or minimum dimensions). Table 1
defines the dimensions shown in this figure.
5.7 Internal Vertical Dimensions — Figures 2 through
5 show the vertical dimensions of the internal FOBIT.
Note that z8 (the height of the bottom nominal wafer-
seating plane above the horizontal datum plane) and z12
(the distance between adjacent nominal wafer seating
planes) are given as absolute distances with no
tolerance. This means that the sum of actual height
variations in the FOBIT from the kinematic coupling to
the supporting features holding each wafer must be
contained within the tolerance of z10 with no further
stack-up at each higher wafer. The method for meeting
this requirement is left up to the FOBIT supplier. Table
1 defines all dimensions for Figures 2 through 5.
y
1
3
facial
datum
p
lane
x
1
50
x
2
7
5
bilateral
datum
p
lane
r
4
170
ri
g
ht rear
side domain
left rea
r
side domain
front side of the FOBIT where wafers are accessed
left front
side domain
wafer
p
ick-u
p
area
ri
g
ht front
side domain
wafer set-
down and
extraction
volumes
r
2 = 152
r
3
r
2 + 1
+1
–
0
y
51
140
x
52
170
x
51
140
x
3
125
y
52
166
y
49
134
y
11
85
y
5
120
r
1
151
Figure 1
Top View of FOBIT Internal Dimensions
SEMI E119-1104 © SEMI 2002, 2004 5
horizontal datum plane
z8
=35
z6
28.5
z12
= 6.25
z15
4.6
facial datum plane
front side of the FOBIT where wafers
are accessed
y5 120
Figure 2
Side View of FOBIT Internal Dimensions