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SEMI P4-92 © SEMI 1983, 1999 2 6.3 Physical Properties Infor mation on the following properties is provided for information on ly. (See Appendix 1.) 6.3.1 Pois son' s Rat io 6.3.2 Densit y 6.3.3 Young' s Modu…
SEMI P4-92 © SEMI 1983, 1999 1
SEMI P4-92 (Reapproved 0299)
SPECIFICATION FOR ROUND QUARTZ PHOTOMASK SUBSTRATES
This specification was technically reapproved by the Mask & Mask Equipment Committee and is the direct
responsibility of the North American Microlithography Committee. Current edition approved by the North American
Regional Standards Committee in October 1998. Initially available at www.semi.org February 1999; to be published
February 1999. Originally published in 1983; previously published in 1996.
Editorial changes were made to the following: Sections: 2.2, 6.2, and 13.1, Tables 3, 4 and 5, and Figure 5.
General Requirements
1. Preface
This specification covers the general requirements of
the quartz round substrate for hard surface photomasks.
2. Applicable Documents
2.1 ASTM Standards
1
ASTM E 122 Recommended Practice for Choice of
Sample Size to Estimate the Average Quality of a Lot
or Process
ASTM E 228 Standard Test Method for Linear
Thermal Expansion of Rigid Solids with a Vatreous
Silical Dilatometer
2.2 ISO Standard
2
ISO 14644-1 Cleanrooms and Associated Controlled
Environments Part 1: Classification of Air Cleanliness
2.3 Military Specifications
3
MIL-STD-105 Sampling Procedure and Tables for
Inspection and Attributes
3. Terminology
None.
4. Ordering Information
Purchase orders for hard surface photomask substrates
furnished to this specification shall include the
following:
Dimensions (See Section 5)
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohoken, PA 19428-2959
2 ISO Central Secretariat, 1, rue de Varembé, C.P. 56, CH-1211
Genève 20, Switzerland
3 Military Standards, Naval Publications and Form Center, 5801
Tabor Avenue, Philadelphia, PA 19120
Material (See Section 6)
Flatness Criteria (See Section 7)
Visual Criteria (See Section 8)
Lot Acceptance (See Section 9)
5. Dimensions and Permissible Variations
The material shall conform to the dimensions and
dimensional tolerances as specified in Tables 1 and 5,
Dimensions for Round Quartz Photomask Substrates.
6. Material Specifications (ULTE glass only)
6.1 Thermal Characteristics 0
−
300
°
C
6.1.1 100% Quartz Material Coefficient of
expansion 5.5 × 10
-7
/°C.
6.1.2 Less Pure Quartz Coefficient of expansion
less than 7.5 × 10
-7
/°C.
6.2 Transmission Characteristics
4
Wave Lengths
Minimum % @ 1.5 mm
Thickness
200 nm To be agreed upon between
user and supplier.
230 nm To be agreed upon between
user and supplier.
254 nm To be agreed upon between
user and supplier.
365 nm To be agreed upon between
user and supplier.
405 nm To be agreed upon between
user and supplier.
4 After correction for surface reflection
SEMI P4-92 © SEMI 1983, 1999 2
6.3 Physical Properties Information on the
following properties is provided for information only.
(See Appendix 1.)
6.3.1 Poisson' s Ratio
6.3.2 Density
6.3.3 Young' s Modulus
6.3.4 Modulus of Elasticity
6.3.5 Index of Refraction
6.3.6 Volume Restivity
7. Flatness Area (for one side only)
7.1 Flatness Quality Area
7.1.1 Circular Flatness Quality Area (See Tables 2
and 5.)
8. Visual Criteria (one side only)
8.1 Quality Area (See Tables 2 and 5.)
Plate Diameter Quality Area (Diameter)
125 mm 113 mm
150 mm 138 mm
8.2 Defect Limits Defects and allowable number of
each type are listed in Table 4.
8.2.1 Terminology for SEMI P4 Unless otherwise
noted, the SEMI Terms and Definitions Relating to the
Microlithography Industry shall be used.
8.2.2 Minimal Conditions or Dimensions Mini-mal
conditions or dimensions for defects are listed in Table
4 and shall be used for determining substrate
acceptability unless other minimal limiters are agreed
upon by the interested parties.
8.2.3 Photomask Substrate Edge Criteria (See
Table 3.)
8.3 Identification To be agreed upon between the
user and supplier.
9. Sampling
Unless otherwise specified, ASTM E 122 shall be used.
When so specified, appropriate samples sizes shall be
selected from each lot in accordance with MIL-STD-
105D. Each quality characteristic shall be assigned an
acceptable quality level (AQL) and lot total percent
defective (LTPD) value in accordance with MIL-STD-
105D. Definitions for critical, major and minor
classifications may alternatively be assigned cumulative
AQL and LTPD values. Inspection levels shall be
agreed upon between the user and supplier.
10. Test Methods
10.1 Thermal Expansion Determine in accordance
with ASTM E 228.
10.2 Transmission (To be agreed upon between the
user and supplier).
10.3 Flatness (To be agreed upon between the user
and supplier).
10.4 Visual (To be agreed upon between the user
and supplier.)
10.5 Roundness 2 readings at 90° with appropriate
tool such as Vernier Caliper or equivalent. Roundness
values not specified at this time.
11. Handling
Substrates are to be handled on the edges only.
Substrates are to be handled only with clean room
approved gloves.
12. Certification
Upon request of the purchaser in the contract or order, a
manufacturer' s or supplier' s certification that the
material was manufactured and tested in accordance
with this specification together with a report of the test
results shall be furnished at the time of shipment.
13. Packing and Marking
13.1 Substrates shall be packed in a class 100
environment as defined by ISO 14644-1. Containers
shall be designed to prevent glass-to-glass contact and
to protect the substrates from contamination in handling
and transit. Substrates shall be shipped with the
acceptable flatness side toward the front of the box.
This orientation shall be indicated on each container.
Packaging shall comply with the applicable
international, national, state, and local laws and
regulations required for shipping.
13.2 Containers shall be labeled " Warning: Open and
Handle Under Clean Room Conditions Only." Each
shipment shall be identified by user purchase order
number, drawing number (if applicable), quantity,
vendor lot number and material identification.
SEMI P4-92 © SEMI 1983, 1999 3
Table 1. Dimensions for Round Quartz Photomask Substrates
PLATE SIZE
ROUNDNESS
(T. B. A. Later Date)
PLATE THICKNESS
Dimension (D) Dimension Tolerance Min. Tolerance Max. Units
125 Diameter 125 ± .3
2.3 2.17 2.43 mm
150 Diameter 150 ± .3
2.3 2.17 2.43 mm
3.0 2.87 3.13 mm