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SEMI P3-0298 © SE MI 1982, 1998 3 NOTICE: T hese standards do n ot purport to address safety issues, if any, ass o ciated with their use. It is the responsibility of t he user of these standards to establish appropriate …
SEMI P3-0298 © SEMI 1982, 1998 2
characteristic shall be assigned an acceptable quality
level (AQL) and lot total percent defective (LTPD)
value in accordance with MIL-STD-105. Definitions
for critical, major, and minor classifications may
alternatively be assigned cumulative AQL and LTPD
values. Inspection levels shall be agreed upon between
the user and supplier.
8 Handling
8.1 Resist-coated substrates are to be handled on the
edges only with approved finger cots or gloves under
clean room conditions.
9 Certification
9.1 Upon request of the purchaser in the contract or
order, a manufacturer’s or supplier's certification that
the material was manufactured and tested in accordance
with this specification shall be provided.
10 Packaging and Marking
10.1 Resist-coated substrates shall be packed in a
Class 100 environment as defined in Federal Standard
209D. Containers shall be designed to prevent
movement and glass-to-glass contact and to protect the
substrates from contamination in handling and transit.
Orientation of the coated side shall be indicated on each
container. Packaging shall comply with the applicable
international, national, state, and local laws and
regulations required for shipping.
10.2 Each shipment shall be identified by user
purchase order number, drawing number (if applicable),
quantity, supplier lot number, material identification,
bake time and temperature, resist type, resist lot
number, and date of applying resist.
10.2.1 Photoresist — Containers shall be labeled,
“Warning: Open and Handle Under Safe Yellow Light
in Clean Room Conditions Only.”
10.2.2 E-Beam Resist — Containers shall be labeled,
“Warning: Open and Handle Under Clean Room
Conditions Only. DO NOT X-RAY.”
Table 1 Total Allowable Defects for Unsensitized
Photoplates
Defects in the Circular Quality Area
Substrate Size Defect Size
Grade
1–5.0 µm5.1–10 µm 10 µm
4" AA 0 0 0
4" A (Master) 4 0 0
4" B 6 2 0
4" C (Test) N/A N/A 20
5" AA 0 0 0
5" A (Master) 4 0 0
5" B 8 2 0
5" C (Test) N/A N/A 30
6" AA 0 0 0
6" A (Master) 6 0 0
6" B 12 4 0
6" C (Test) N/A N/A 40
Defects in the Square Quality Area
Substrate Size Defect Size
Grade
1–5.0 µm5.1–10 µm 10 µm
4" AA 0 0 0
4" A (Master) 4 0 0
4" B 8 2 0
4" C (Test) N/A N/A 20
5" AA 0 0 0
5" A (Master) 6 0 0
5" B 12 4 0
5" C (Test) N/A N/A 30
6" AA 0 0 0
6" A (Master) 8 0 0
6" B 16 2 0
6" C (Test) N/A N/A 40
SEMI P3-0298 © SEMI 1982, 19983
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer's
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user's attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International),
3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI P4-92 © SEMI 1983, 1999 1
SEMI P4-92 (Reapproved 0299)
SPECIFICATION FOR ROUND QUARTZ PHOTOMASK SUBSTRATES
This specification was technically reapproved by the Mask & Mask Equipment Committee and is the direct
responsibility of the North American Microlithography Committee. Current edition approved by the North American
Regional Standards Committee in October 1998. Initially available at www.semi.org February 1999; to be published
February 1999. Originally published in 1983; previously published in 1996.
Editorial changes were made to the following: Sections: 2.2, 6.2, and 13.1, Tables 3, 4 and 5, and Figure 5.
General Requirements
1. Preface
This specification covers the general requirements of
the quartz round substrate for hard surface photomasks.
2. Applicable Documents
2.1 ASTM Standards
1
ASTM E 122 Recommended Practice for Choice of
Sample Size to Estimate the Average Quality of a Lot
or Process
ASTM E 228 Standard Test Method for Linear
Thermal Expansion of Rigid Solids with a Vatreous
Silical Dilatometer
2.2 ISO Standard
2
ISO 14644-1 Cleanrooms and Associated Controlled
Environments Part 1: Classification of Air Cleanliness
2.3 Military Specifications
3
MIL-STD-105 Sampling Procedure and Tables for
Inspection and Attributes
3. Terminology
None.
4. Ordering Information
Purchase orders for hard surface photomask substrates
furnished to this specification shall include the
following:
Dimensions (See Section 5)
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohoken, PA 19428-2959
2 ISO Central Secretariat, 1, rue de Varembé, C.P. 56, CH-1211
Genève 20, Switzerland
3 Military Standards, Naval Publications and Form Center, 5801
Tabor Avenue, Philadelphia, PA 19120
Material (See Section 6)
Flatness Criteria (See Section 7)
Visual Criteria (See Section 8)
Lot Acceptance (See Section 9)
5. Dimensions and Permissible Variations
The material shall conform to the dimensions and
dimensional tolerances as specified in Tables 1 and 5,
Dimensions for Round Quartz Photomask Substrates.
6. Material Specifications (ULTE glass only)
6.1 Thermal Characteristics 0
−
300
°
C
6.1.1 100% Quartz Material Coefficient of
expansion 5.5 × 10
-7
/°C.
6.1.2 Less Pure Quartz Coefficient of expansion
less than 7.5 × 10
-7
/°C.
6.2 Transmission Characteristics
4
Wave Lengths
Minimum % @ 1.5 mm
Thickness
200 nm To be agreed upon between
user and supplier.
230 nm To be agreed upon between
user and supplier.
254 nm To be agreed upon between
user and supplier.
365 nm To be agreed upon between
user and supplier.
405 nm To be agreed upon between
user and supplier.
4 After correction for surface reflection