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SEMI G80-0200 © SE MI 2000 20 A P PENDIX 1 NOTE: T he material in this appe ndix is an of ficial part of SEMI G80 and wa s approved by f ulll letter ballot proced ures on Septem ber 3, 1999 by the North Am erian Regiona …

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SEMI G80-0200 © SEMI 200019
Table 2 (cont.) Test Method Summary - Non Data Analysis Aspects Associated with This Method
1. Level 1 –– Procedure Start Date and Time:
4. Level 2 –– Procedure Finish Data and Time:
5. Specify the Ambient Temperature when this
method was executed.
6. Manufacturer's model number and/or name for
this system analyzed.
7. System Serial Number:
8. Date & Time of Last System Calibration:
9. Specify PARTIAL or Full-Up execution of
this method. Exceptions noted in Appendix 3.
3. Level 2 –– Procedure Start Date and Time:
2. Level 1 –– Procedure Finish Date and Time:
10. Specify Number of Test Heads & Number of
Pins analyzed using this method.
SEMI G80-0200 © SEMI 2000 20
APPENDIX 1
NOTE: The material in this appendix is an official part of SEMI G80 and was approved by fulll letter ballot procedures on
September 3, 1999 by the North Amerian Regional Standards Committee.
Table A1-1 Test Method Summary Table for Establishing Overall Timing Accuracy (OTA)
LEVEL 1
Timing Linearity
Extended Delay
Multiple Period
Data below represents
Level 1 edge-delay
results
LEVEL 2
High Speed Clock
Accuracy
_
_________________
_
Drive Input Z
Timing Error
Level 1 (Section
10.3.5) Z to 0
(Low)
_
_____________
_
_____________
Timing Linearity
Level 1
(Sec.10.3.1)
Positive Error:
_________________
Negative Error:
_________________
b) High Speed
Clock Transition
Time Variation
Level 2 (Section
10.4.3- Drive Input
Transition Time
for clock function)
_
______________
a) High Speed
Clock Delay Error
Level 2 (Section
10.4.1- Drive Input
Timing Delay for
clock function)
_
______________
Extended Delay
Level 1 (Sec.
10.3.4)
Positive Error:
_________________
Negative Error:
_
_______________
Multiple Period
Level 1 Optional
(Sec. 10.3.6)
Positive Error:
_________________
Negative Error:
_
________________
Drive Input Z
Timing Error
Level 1 (Section
10.3.5) Z to 1
(High)
_
_____________
_
_____________
Drive Input Z
Timing Error
Level 1 (Section
10.3.5) 0 (Low)
to Z
_
_____________
_
_____________
Drive Input Z
Timing Error
Level 1 (Section
10.3.5) 1 (High)
to Z
_
_____________
_
_____________
1) Drive Input
To Compare
Output Timing
_
_______________
_
3) Compare
Output Edge
Placement
_
_______________
2) Drive
Input Edge
Placement
_
_______________
_
Drive Input to
Compare Out put
Timing Accuracy
calculated from
the 10.3.1 entry.
_
_____________
a) Compare
Output Time
Delay Error
Level 2 (Section
10.4.2)
_
_____________
a) Drive Input
Timing Delay
Error Level 2
(Section 10.4.1)
_
_____________
b) Drive Input
Transition Time
Variation
Level 2 (Section
10.4.3)
_
_____________
c) Drive Input
Timing Cycle
Jitter Level 2
(Section 10.4.4)
_
____________
Single Point Overall Timing Accuracy (OTA) Results
D
ata to enter here is: A = Dr (item 2) + Cmp (item 3) + Dr-Cmp (item 1)
-B = -Dr (item 2) - Cmp (item 3) + Dr-Cmp (item 1)
.
Drive Z Timing
Data below
represents Level 1 Z-
state timing results
c) High Speed
Clock Cycle Jitter
Level 2 (Section
10.4.5)
_
______________
d) High Speed
Clock Phase Jitter
Level 2 (Section
10.4.6)
_
______________
The user of the method is advised to read Section
13, Precautions before filling in this table.
SEMI G80-0200 © SEMI 200021
Table A1-1 (cont.) Test Method Summary - Non Data Analysis Aspects Associated with This Method
Drive to Compare Error = Reference - [(Min Value + Max Value)/2]
1. Level 1 –– Procedure Start Date and Time:
4. Level 2 –– Procedure Finish Data and Time:
5. Specify the ambient temperature when this
method was executed.
6. Manufacturer's model number and/or name for
this system analyzed.
7. System Serial Number:
8. Date and Time of Last System Calibration:
9. Specify PARTIAL or Full-Up execution of
this method. Exceptions noted in Appendix 3.
3. Level 2 –– Procedure Start Date and Time:
2. Level 1 –– Procedure Finish Date and Time:
10. Specify number of Test Heads and number of
Pins analyzed using this method.