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SEMI D6-0305 © SEMI 1992, 2005 3 Table 6 Plate Thickness and Materials (Group C) in mm + 8.0 -0.4 ~+ 0.2 Table 7 Edge Le ngth (Group D) in m m 390 × 610 Table 8 Plate Thickness and Materials (Group D) in mm Material ULTE…

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SEMI D6-0305 © SEMI 1992, 2005 2
Table 1 Edge Length (Group A) in mm
202.8 × 202.8
200 × 250 250 × 250
250 × 300 300 × 300
300 × 350 350 × 350
350 × 400 400 × 400
Table 2 Plate Thickness and Materials (Group A) in mm
Material
HTE MTE/LTE ULTE Thickness(mm)
+ + + 3.0
+ 4.8
+ + 5.0
Table 3 Edge Length (Group B) in mm
330 × 450
400 × 500
450 × 550
500 × 600
Table 4 Plate Thickness and Materials (Group B) in mm
Material
HTE MTE/LTE ULTE Thickness(mm)
+ 4.8
+ + 5.0
Table 5 Edge Length (Group C) in mm
620 × 720
650 × 750
650 × 800
700 × 800
Table 6 Plate Thickness and Materials (Group C) in mm
Material
ULTE Thickness (mm) Tolerance (mm)
+ 5.0 ± 0.2
SEMI D6-0305 © SEMI 1992, 2005 3
Table 6 Plate Thickness and Materials (Group C) in mm
+ 8.0 -0.4 ~+ 0.2
Table 7 Edge Length (Group D) in mm
390 × 610
Table 8 Plate Thickness and Materials (Group D) in mm
Material
ULTE Thickness (mm) Tolerance (mm)
+ 6.0
0.2
7 Material Specification
7.1 Substrate material shall be specified as high thermal expansion (HTE), medium thermal expansion (MTE), low
thermal expansion (LTE), or ultra low thermal expansion (ULTE). Examples of HTE materials are soda lime
glasses; of MTE materials are borosilicate and aluminosilicate glasses; of LTE materials are aluminosilicate glasses;
and of ULTE materials are synthetic quartz glasses.
7.2 Substrate materials shall conform to thermal expansion and optical transmittance characteristics specified in
SEMI P1.
7.3 Selected physical properties of HTE, MTE, LTE, and ULTE materials are provided for information in SEMI P1,
Appendix 1.
8 Related Document
8.1 SEMI Standards
SEMI D21 — Terminology for Flat Panel Display Masks
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI D7-94 © SEMI 1994, 2003 1
SEMI D7-94 (Reapproved 0703)
FPD GLASS SUBSTRATE SURFACE ROUGHNESS MEASUREMENT
METHOD
This standard was technically reapproved by the Global Flat Panel Display Committee and is the direct
responsibility of the Japanese FPD Materials and Components Committee. Current edition approved by the
Japanese Regional Standards Committee on April 28, 2003. Initially available at www.semi.org June 2003;
to be published July 2003. Originally published in 1994.
1 Purpose
1.1 This document defines the method of FPD glass
substrate surface roughness measurement by stylus
method surface roughness measurement instrument.
2 Scope
2.1 This specification shall be used by vendors and/or
buyers of glass substrates for flat panel display and is
effective for all glass substrates used.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 ISO Standards
1
ISO486-1982 — Surface Roughness — Parameters,
Their Values and General Rules for Specifying
Requirements
ISO3274-1975 — Instruments for the Measurement of
Surface Roughness by the Profile Method — Contact
(Stylus) Instruments of Consecutive Profile
Transformation
ISO4287/1-1984 — Surface Roughness —
Terminology — Part 1: Surface and its Parameters
3.2 JIS Standard
2
JIS B0601-1982 — Definitions and Designation of
Surface Roughness
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
1 International Organization for Standardization, ISO Central
Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,
Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30,
Website: www.iso.ch
2 Japanese Industrial Standards, Available through the Japanese
Standards Association, 1-24, Akasaka 4-Chome, Minato-ku, Tokyo
107-8440, Japan. Telephone: 81.3.3583.8005; Fax: 81.3.3586.2014,
Website: www.jsa.or.jp
4 Terminology
4.1 Definitions
4.1.1 long wavelength cutoff — wavelength that the
attenuation ratio of its amplitude becomes 75% when
the traced profile is passed through the high-pass
wavelength filter which eliminates waviness element.
4.1.2 short wavelengh cutoff — wavelength that the
attenuation ratio of its amplitude becomes 75% when
the traced profile is passed through the low-pass
wavelength filter which eliminates noise element.
4.1.3 stylus method surface roughness measuring
instrument — instrument that traces on a section of a
surface by a stylus, records irregularity on the surface in
a enlarged form, and indicates its amplitude as
roughness parameters.
4.1.3.1 The type of instrument in this standard is
specified to an instrument which is sometimes called as
a profiler for very thin films and steps.
5 Measurement Instrument
5.1 Method — Stylus method surface roughness
measuring instrument defined in Sections 3.1 or 3.2, or
an instrument which meets those conditions.
5.2 Stylus
Material — diamond
Shape — circular cone or rectangular cone
Tip Radius — 2 µm or less
5.3 Measuring Force — 0.1 mN (0.01 gf) or above, 0.7
mN (0.07 gf) or less.
5.4 Sampling Interval — 1 µm or less.
5.5 Vertical noise amplitude p-p value: 3 nm (= 30 Å)
or less.
6 Measurement Conditions
6.1 Long Wavelength Cutoff, λc — 0.08 mm or close.
6.1.1 Short Wavelength Cutoff, λs — 0.0025 mm or
less.
6.1.2 Evaluation length, Le — 0.4 mm.