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SEMI G35-87 © SEMI 198 6, 1987 1 SEMI G35-87 SPECIFICA TION FOR TEST METHODS FOR LEAD FINISHES ON SEMICONDUCTOR ( ACTIVE) DEVICES 1 Scope This specificatio n shall be used by suppliers and/or users o f semicondu ctor (ac…

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SEMI G34-89 © SEMI 1986, 1996 4
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Figure 5
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NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G35-87 © SEMI 1986, 19871
SEMI G35-87
SPECIFICATION FOR TEST METHODS FOR LEAD FINISHES ON
SEMICONDUCTOR (ACTIVE) DEVICES
1 Scope
This specification shall be used by suppliers and/or
users of semiconductor (active) devices, and is effective
for all lead finishes used.
2 Purpose
This specification establishes uniform methods and
procedures for conducting tests on lead finishes on
(active device) electronic packages. Other SEMI
standards establish materials used and the finishes for
them.
3 Applicable Documents
3.1 Order of Precedence — In the event of a conflict
between the text of this specification and the references
cited herein, the text of this specification shall take
precedence.
3.2 Referenced Documents — Unless otherwise
specified, the following standards and specifications,
with appropriate issue letter at time of order entry, form
a part of this specification to the extent and for the
purpose specified herein.
3.3 ASTM Specifications
1
E 10 — Standard Test Method for Brinell Hardness for
Metallic Materials
E 122 — Choice of Sample Size to Estimate the
Average Quality of a Lot or Process
E 384 — Standard Test Methods for Micro-Hardness of
Materials
B 487 — Measuring Metal and Oxide Coating
Thickness by Microscopical Examination of a Cross
Section
B 545 — Standard Specification for Electro Deposited
Coatings of Tin
B 567 — Measurement of Coating Thickness by the
Beta Backscatter Principle
B 568 — Measurement of Coating Thickness by X-Ray
Spectrometry
3.4 Military Specifications
2
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohoken, PA 19428-2959
MIL-STD-883 — Test Methods and Procedures for
Microelectronics
MIL-STD-105 — Sampling Procedures with Tables for
Inspection by Attributes
3.5 SEMI Specifications
SEMI G4 — Integrated Circuit Leadframe Materials
Used in the Production of Stamped Leadframes
SEMI G18 — Integrated Circuit Leadframe Materials
Used in the Production of Etched Leadframes
SEMI G20 — Lead Finishes for Plastic Packages
(Active Devices Only)
4 Selected Definitions
active devices — semiconductor devices with active
function (e.g., IC, transistor, diode) as opposed to
passive devices (e.g., inductors, capacitors).
air atmosphere — air heated to specified temperature
which, when cooled to ambient, will normalize to one
(1) standard atmosphere.
steam atmosphere — atmosphere in a closed vessel
containing water, with venting sufficient to maintain
temperature at one (1) standard atmosphere and 100° +
0, -5°C.
NOTE: The intent of this requirement is to replace air with
steam.
5 Sampling
Unless otherwise specified, Practice E 122 shall be
used. When so specified, appropriate sample sizes shall
be selected from each lot in accordance with MIL-STD-
105. Each quality characteristic shall be assigned an
acceptable quality level (AQL) and lot tolerance
percent defective (LTPD) value in accordance with
MIL-STD-105 definitions for critical, major, and minor
classifications. If desired and so specified in the
contract or order, each of these classifications may
alternatively be assigned cumulative AQL and LTPD
values. Inspection levels shall be agreed upon between
the user and supplier.
2 Military Standards, Naval Publications and Form Center, 5801
Tabor Avenue, Philadelphia, PA 19120
SEMI G35-87 © SEMI 1986, 1987 2
6 Test Methods
6.1 Visual Inspection
6.1.1 For reference purposes the required appearance
and associated properties for any specific lead finish are
specified in the detailed SEMI specification for the
specific lead finish to be evaluated.
6.1.2 Purpose
6.1.2.1 Visual inspection shall be performed to
evaluate application of the required lead finish.
Magnification at 10× preferred.
6.1.3 Failure Criteria
6.1.3.1 Finish is wrong type, is missing, or is non-
adherent (has peeling, flaking, or blistering).
NOTE: Variations in color are not cause for failure unless
there is evidence of corrosion and flaking or pitting.
6.1.3.2 Finish contains foreign material or surface
contamination such as water marks.
6.1.3.3 Leads and terminations shall be electrically
sound and mechanically intact. Nothing in the lead
finish shall detract from lead integrity.
6.2 Solderability
6.2.1 The purpose of the test, terms and definitions,
apparatus, and materials to be used are specified in
MIL-STD-883, Method 2003.
6.2.2 Procedure to be used shall be as specified in
MIL-STD-883, Method 2003, except as specified
below.
6.2.2.1 Aging as specified in MIL-STD-883, Method
2003, shall not be performed. (See Section 6.2.2.2.)
6.2.2.2 At user’s option, pre-aging at the indicated
level below shall be performed:
1. Condition A — No pre-age.
2. Condition B — 5 hours at 150°C in Air
Atmosphere.
3. Condition C — 5 hours at 200°C in Air
Atmosphere.
4. Condition D — 4 hours suspended in Steam
Atmosphere.
5. Condition E — 8 hours suspended in Steam
Atmosphere.
NOTE: See definition section for above noted atmospheric
conditions.
6.2.3 Failure criteria shall be as specified in MIL-
STD-883, Method 2003, except as specified below.
6.2.3.1 Coverage shall be 90% on major flat
(excluding non-functional areas). Non-functional areas
include end of termination, edges in clad materials, and
areas above the seating plane.
6.3 Lead Fatigue/Lead Finish Adherence
6.3.1 The purpose of the test, apparatus, and procedure
to be used are as specified in MIL-STD-883, Method
2004, Test Condition B1, except as specified below.
6.3.1.1 Purpose of this test is limited to a check of lead
finish integrity after stressing.
6.3.1.2 Three (3) leads per device shall be tested.
6.3.1.3 Three (3) cycles of rotation shall be used.
6.3.2 Failure Criteria
When examined at 10× magnification, any evidence of
peeling, or gross discontinuity shall be considered a
device failure.
6.4 Thickness
6.4.1 Thickness, when specified, shall be measured in
functional lead area. On flat leads, measure in the
center of the major flat. On round leads, measure below
the seating plane and above the gauge plane.
6.4.2 Thickness, when specified, shall be measured in
accordance with ASTM B 568 (Measurement of
Coating Thickness by X-Ray Spectrometry) as the
preferred method.
6.4.3 Thickness may be measured as an alternative to
the above by either ASTM B 567 (Beta Backskatter
Principle) or ASTM B 487 (Cross Section Principle).
6.5 Hardness
6.5.1 Hardness, when specified, shall be measured in
functional lead area. On flat leads, measure in the
center of the major flat. On round leads, measure below
the seating plane and above the gauge plane.
6.5.2 Hardness shall be tested only when specified as a
Lead Finish Detail (e.g., for socketing application).
6.5.3 Hardness shall be tested in accordance with
ASTM E 384 (Standard Test Methods for Micro-
Hardness of Materials), or ASTM E 10 (Standard Test
Method for Brinnel Hardness for Metallic Materials),
whichever is appropriate (see detailed specification or
procurement document).
7 Certification
7.1 Upon request of the purchaser in the contract or
order, a manufacturer’s or supplier’s certification that
the material was manufactured and tested in accordance