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SEMI E5-1104 © SEMI 1982, 2004 154 10.15 Stream 1 1 has been deleted and will no t appear again in this publication . 10.15.1 It is the consensus of the Comm unicatio ns Committee that Stream 11 is obsolete. Its use is d…
SEMI E5-1104 © SEMI 1982, 2004 153
Stream,Function Name (Mnemonic) Direction
S10,F9 Broadcast (BCN) S,H->E,[reply]
Description
This function is generally the same as S10,F3 except that specific TID in each equipment need not be specified. Instead, the text
is directed to each terminal in the equipment when the function is received. This function assumes that this feature exists on all
equipment, otherwise repeated S10,F3 messages should be used.
Structure
<TEXT>
Exception
None
Stream,Function Name (Mnemonic) Direction
S10,F10 Broadcast Acknowledge (BCA) S,H<-E
Description
Acknowledge or error
Structure
<ACKC10>
Exception
None
SEMI E5-1104 © SEMI 1982, 2004 154
10.15 Stream 11 has been deleted and will not appear
again in this publication.
10.15.1 It is the consensus of the Communications
Committee that Stream 11 is obsolete. Its use is
discouraged, and it has been removed from the 1989
edition of the standard. The reasons for removal are
three-fold:
1. The purpose of this stream, as it was originally
envisioned, is perceived to be of little use and can
best be accomplished by other means beyond the
scope of this standard;
2. The functions in this stream have many technical
problems that severely limit their use;
3. There is a noticeable lack of implementations of
this standard that utilize Stream 11 in its originally
intended form.
NOTE 11: Applications that need to transfer unformatted
data between the host and equipment should use the facilities
of Stream 13.
10.16 Stream 12 Wafer Mapping — Messages which
deal with coordinate positions and data associated with
those positions. This includes functions such as wafer
mapping with coordinates of die on a wafer and the
associated binning information.
10.16.1 Structure — Functions 1 through 20 address
the variations required by semiconductor equipment
manufacturers in transmitting wafer maps to and from
the process equipment (wafer probe through die attach).
The functions include three basic formats. The three
formats developed are:
1. Row/column format where a coordinate row
starting position is given with die count in the row
and starting direction. The respective binning
information follows for each die.
2. Array format is structured such that a matrix array
captures all or part of a wafer with the associated
binning information.
3. Coordinate format provides an X/Y location and
bin code for die on the wafer.
10.16.2 Definitions and Descriptions — The following
information is required to perform map association to
the physical wafer as it relates to the archival use and
transmission of wafer maps.
1. Flat/Notch Location
2. Frame Rotation
3. Row Count
4. Column Count
5. Die Units of Measure
6. Die Size
7. Process Die Count
8. Reference Points
9. Bin Code Equivalents
10. Process Axis
11. Null Bin Code Value
12. ID Type
10.16.2.1 Flat/Notch Location — The position in
degrees that the flat or notch are oriented during
processing relative to a “normal” position of zero
degrees. See Figure 6.
10.16.2.2 Frame Rotation — The orientation of a film
frame relative to a “normal” position of zero degrees.
See Figure 7.
10.16.2.3 Row/Column Count — The row and column
counts are the total number of rows and columns,
respectively, on a wafer which must be correlated
directly with the wafer map. These numbers will
always be greater than zero.
10.16.2.4 Die Sizes — The die size is given in standard
units as specified by the die unit of measure item
DUTMS, and will also be greater than zero. The value
of the die size is determined by measuring the distance
from a point on one die to the same point on the next
die, often referred to as an index. This is depicted in
the lower portion of Figure 7, Section B in the General
Rules Section.
10.16.2.5 Process Die Count — The process die count
item is used by equipment that is being map driven to
make determinations about how much material to
prepare. For example, a die attach will epoxy lead
frames in advance of the attach process. By knowing
the total number of die to be processed within a wafer
map, the equipment can stop epoxying lead frames
equivalent to the last die to be attached. This item is
also used by the equipment to tell the host how many
total die it processed for that map. For example, a die
attach would use PRDCT to report the total die actually
attached from a particular wafer.
10.16.2.6 Reference Points — Reference points
provide a means of relating a map to the physical wafer.
The total number of these points, and the method for
assigning and detecting them, is the responsibility of
the equipment. This standard only provides a means for
transmitting them.
10.16.2.7 Origin — The origin is in one of five
locations which is specified by the equipment when
generating a wafer map. The origin is on an array
structure having dimensional values equal to those
SEMI E5-1104 © SEMI 1982, 2004 155
specified by the row and column count. The origin then
lies on one of the four corners of that array or in a
center location determined by the following formula:
row ~ or ~ column 1
2
truncated
10.16.2.7.1 It is implicit in determining the center
location that the upper-left-hand corner of the area, in
the normal position, be counted as the first row and
column position. An equipment requesting a map
provides the origin location that it wants the map to be
based on before transmission. If the equipment does
not provide an origin, the host must provide a default
value. An equipment transmitting a map must provide
the origin with the map setup data.
10.16.2.8 Bin Code Equivalents — Bin code
equivalents is a list of bin codes that the receiving
equipment will process. (i.e., if a map contains codes 1
through 10 and the good die are bins 1 and 2, then bin
code equivalent list could indicate 1 and 2 if only the
good die categories were needed. These are the only
bin codes to which an equivalent will drive for its
respective process function.) In the case of X/Y
coordinate format, the locations transmitted will be only
those with the bin codes stated in the Bin Code
Equivalent list, unless the length byte is set to zero, in
which all of the bin codes in the map will be
transmitted.
10.16.2.9 Process Axis — The process axis is the axis,
either rows or columns, increasing or decreasing, and
the side of the map, (top, bottom, left, or right,
respectively) that the map data will originate from.
This is based on the coordinate system as described
under the General Rules section of this document.
10.16.2.10 ID Type — ID type indicates the
appropriate material ID type (i.e., wafer, cassette, or
film frame).
10.16.3 General Rules
10.16.3.1 Map Data Size — Stream 12 provides for the
transmission of a complete map regardless of size.
Equipment requiring segmented maps for transmission
or reception will not be able to use the Stream 12
functions to handle the complete conversation.
10.16.3.2 Orientation Conventions — The orientation
of a wafer presented for processing will differ from
equipment to equipment. Stream 12 specifies
conventions for expressing wafer orientation so that a
map can be translated from one geometric
representation to another.
10.16.3.2.1 The bottom of the wafer is the notch or the
line of the major flat. The orientation of a wafer is
measured in positive degrees clockwise (CW) from the
“normal” position. The “normal” position is where the
bottom of the wafer is closest to you when the wafer is
lying horizontally in front of you with the die side
facing up. The “normal” position has an orientation of
zero degrees. See Figure 6 for graphic representation of
wafer orientations.
10.16.3.2.2 The bottom of a film frame is also the
notch or the line of notches. Its orientation and
“normal” position are measured in the same manner as
for wafers. See Figure 7 for examples of bottoms of
film frames.
10.16.3.2.3 The orientation of an unmounted wafer
presented for processing is given by the parameter
FNLOC, Flat/Notch LOCation.
10.16.3.2.4 The ultimate orientation of a wafer
presented for processing after it has been mounted on a
film frame is the cumulative rotation of the wafer from
the “normal” position on the film frame and the rotation
of film frame as it is presented to the equipment. This
is determined by the sum of the parameters FNLOC and
FFROT, Film Frame ROTation. It is possible for an
application to represent the ultimate orientation of a
wafer in one of these parameters only and pass the other
parameter as zero length.
10.16.3.2.5 Figure 6 shows wafers oriented at 270
degrees with respect to the bottoms of a metal and
round film frame. If one of these film frames were
presented to an equipment rotated 90 degrees clockwise
(CW), (bottom facing the left edge of the page), the
ultimate orientation of the wafer would be zero degrees.
10.16.3.2.6 In the case where either FNLOC or FFROT
are unknown or irrelevant information, a zero-length
data item is transmitted, and the item will be ignored by
the application. One of the items must exist.
10.16.3.3 Coordinate Axis System — The coordinate
axis orientation is shown in Figure 8, Section A. The
assumption is that the “X” or “column” coordinates
increase to the right of the “Y-axis” and the “Y” or
“row” coordinates increase above the “X-axis.” In
describing the physical wafer it is also given that the
coordinate axis orientation never rotates. The wafer
moves or rotates within the coordinate axis system.
The origin within the array describing the wafer’s
coordinate system must be in one of five locations on
that array (the center, upper-left, lower-left, upper-right,
or lower-right corner of the array).