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SEMI E73-0301 © SEMI 1998 , 2001 8 RELATED INFORM A TI ON 1 AP P L I C AT I O N N OT E S NOT E: T h is r elated inf o rma tion is not an officia l part of SEMI E 73 and is not intended t o modify or supercede the offic i…

SEMI E73-0301 © SEMI 1998, 20017
Table 8 Pin Assignment for Incoming Power Supply Connector
No. Pin No. Item Remarks
11 or A R AC U
2 2 or B S 3 phase V
33 or C T W
4maximum or last
pin number in the
connector
Earth/Ground When using a connector that has a special grounding pin
not included in the standard pin arrangement, the last pin
becomes a blank pin. (See Related Documents for an
example of specification for this connector.)
7 Related Documents
NOTE 2: As listed or revised, all documents cited shall be the latest publications of adopted standards.
7.1 DIN Standard
2
DIN VDE 0627 — Connectors and plug-and socket devices; for rated voltages up to 1000 V a.c., up to 1200 V d.c.
and rated currents up to 500 A for each pole
7.2
Military Standard
3
MIL-PRF-24308 — General Specification for Connectors, Electric, Rectangular, Non-Environmental, Miniature,
Polarized Shell, Rack and Panel
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
2 Deutsches Institut für Normung e.V., Beuth Verlag GmbH Burggrafenstrasse 4-10, D-10787 Berlin, Germany
3 Military Standards, Naval Publication and Form Center, 5801 Tabor Avenue, Philadelphia, PA 19120

SEMI E73-0301 © SEMI 1998, 2001 8
RELATED INFORMATION 1
APPLICATION NOTES
NOTE: This related information is not an official part of SEMI E73 and is not intended to modify or supercede the official
standard. This related information is optional and contains information that is not required to conform to this standard.
NOTE 1: While this standard was developed to specify
vacuum pumps installed with 300 mm equipment, the
standard should also be applied to vacuum pumps
installed with 200 mm equipment.
NOTE 2: Signal items for centralized supervisory
diagnostics and maintenance could not be standardized,
because they are not consistent or technically well-
established. Additional work is required for
standardization of these signals.
NOTE 3: In order to save space and reduce cost, the
connector for the control and running status signals
should be the minimum size required for the number of
pins specified in the standard. If additional signal
connections are required, another connector should be
added to the pump.
NOTE 4: Utilizing a 200 VAC system (range: 200 to
230 VAC) rather than a 400 VAC system (range: 380 to
480 VAC) can lower costs associated with
manufacturing and purchasing pumps. To help
minimize pump costs, this standard incorporates AC
supply voltages in the range of 200 to 230 VAC. Many
400 VAC systems are now in use and may be more
widespread in the future. However, standardizing on
supply voltage of 200 VAC can reduce pump costs now
without complications as long as pump manufactures
accommodate customers requesting 400 VAC units.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.

SEMI E74-0301 © SEMI 1998, 20011
SEMI E74-0301
SPECIFICATION FOR VACUUM PUMP INTERFACES -
TURBOMOLECULAR PUMPS
This specification was technically approved by the Global Physical Interfaces & Carriers Committee and is
the direct responsibility of the Japanese Physical Interfaces & Carriers Committee. Current edition approved
by the Japanese Regional Standards Committee on December 1, 2000. Initially available at www.semi.org
January 2001; to be published March 2001. Originally published June 1998; previously published February
1999.
1 Purpose
1.1 This standard specifies the physical and electrical
interfaces for turbomolecular pump (TMP) type
vacuum pumps. Standardization of pump interfaces
will allow for interchangeability of pumps. Device
manufacturers use this standard when procuring
processing equipment to specify to the equipment
supplier the interface required for interchangeability of
pumps. This document is also used by semiconductor
processing equipment suppliers to specify standardized
interfaces to pump suppliers.
2 Scope
2.1 This standard applies to vacuum pumps supplied
with 300 mm semiconductor processing equipment.
2.2 The standard specifies the mechanical and
electrical interfaces for turbomolecular pumps,
including the following:
• Mechanical connectors and locations
• Control signals and connector
• Power supply and connector
Tool
Power Supply
Range of Standardization
Area (within the broken line)
Signal for
equipment controller
Physical Interface
Electrical
I/O signal
& input power
TMP
DRP
The cables between TMP and
Power supply are not standardized
Figure 1
Scope of Standardized Interface
2.3 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
3 Limitations
3.1 This standard is not intended to dictate how to
build a vacuum pump, but to specify interfaces that will
allow for interchangeability of individual pumps.
3.2 This standard does not include specifications for
sensor-bus compliant interfaces.
3.3 This standard is not intended to address design
issues related to safety considerations and containment
issues which are addressed elsewhere in the SEMI
guidelines.
3.4 International, national and local codes, regulations
and laws should be consulted to ensure that the
equipment meets regulatory requirements in each
location of use.
3.5 This standard does not apply to turbomolecular
pumps less than 300 l/s or greater than 3000 l/s. Pumps
less than 300 l/s are too small and pumps greater than
3000 l/s pumps are not commonly used.
3.6 Double flow turbomechanical pumps are excepted
from this standard, because their shapes and structures
are different from turbomolecular pumps to be applied
this standard.
4 Referenced Standards
4.1 SEMI Standard
SEMI S2 — Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment
4.2 ISO Documents
1
ISO 7-1 — Pipe threads where pressure-tight joints are
made on the threads - Part 1: Dimensions, tolerances
and designation
1 International Organization for Standardization, C.P. 56 CH-1211
Geneva 20, Switzerland