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SEMI P33-0998 © SEMI 1998 1 SEMI P33-0998 PROVISIONA L SPECIFICATION FOR DEVELOP MENTAL 230 mm SQUARE HARD SURFACE PHOTOMASK SUBSTRATES 1 Purpose 1.1 To define t he dimensional requ i r e ments for nominally s quare hard…
SEMI P32-1104 © SEMI 1998, 2004 6
10 Related Documents
10.1 SEMI Standards
SEMI P12 — Determination of Iron, Zinc, Calcium,
Magnesium, Copper, Boron, Aluminum, Chromium,
Manganese, and Nickel in Positive Photoresists by
Inductively Coupled Plasma Emission Spectroscopy
(ICP)
SEMI P13 — Determination of Sodium and Potassium
in Positive Photoresists by Atomic Absorption
Spectroscopy
SEMI P14 — Determination of Tin in Positive
Photoresists by Graphite Furnace Atomic Absorption
Spectroscopy
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
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of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
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the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI P33-0998 © SEMI 19981
SEMI P33-0998
PROVISIONAL SPECIFICATION FOR DEVELOPMENTAL 230 mm
SQUARE HARD SURFACE PHOTOMASK SUBSTRATES
1 Purpose
1.1 To define the dimensional requirements for
nominally square hard surface photomask substrates of
230 mm nominal edge length for research on, and
development of, process and manufacturing equipment,
pellicles, carriers, other accessory materials, and any
related mask designs.
2 Scope
2.1 This specification covers information pertaining to
glass substrates for 230 mm square hard surface
photomasks. This information includes, but is not
limited to, physical dimensions, testing criteria, and
measurement criteria.
3 Referenced Documents
3.1 ANSI/ASQC Standard
1
Z1.4 — Sampling Procedures and Tables for Inspection
by Attributes
3.2 ASTM Standard
2
E 228 — Test for Linear Thermal Expansion of Rigid
Solids with a Vitreous Silical Dilatometer
3.3 Federal Standard
3
209E — Clean Room and Work Station Requirements,
Controlled Environments
4 Terminology
4.1 230 mm — the nominal edge length for the reticle
generation defined in this specification. Also referred
to as “9 inch” size.
4.2 critical side — major side intended for patterning.
The critical side has no chamfered corner(s) (see
Section 9.2), and has flatness equal to or better than the
non-critical side (see Section 8.1).
4.3 non-critical side — major side not intended for
patterning. Any and all chamfered corners are on the
non-critical side (see Section 9.2, Figures 5 and 6).
1 American Society for Quality Control, 611 East Wisconsin Avenue,
Milwaukee, WI 53202
2 American Society for Testing & Materials, 100 Barr Harbor Drive,
West Conshohoken, PA 19428-2959
3 General Services Administrator, 4th and D Streets, SW, Room
6039, Washington D.C. 20407
NOTE: Selected terms relating to photomasking are given for
information only in Appendix 2, Related Information.
5 Ordering Information
5.1 Purchase orders for hard surface photomask
substrates furnished to this specification shall include
the following:
5.1.1 Nominal edge length, nominal thickness
dimension, edge criteria, and parallelism of major sides
(see Section 6);
5.1.2 Material (see Section 7);
5.1.3 Flatness quality area and flatness Total Indicated
Reading (TIR; see Section 8);
5.1.4 Visual quality area (see Section 9); and
5.1.5 Lot acceptance criteria (see Section 10).
6 Dimensions and Permissi ble Variations
6.1 The substrates shall conform to the dimensional
tolerances appropriate to the nominal edge length and
thickness as listed in Table 1. Dimensions are
illustrated in Figure 1, and a fixture for measuring the
squareness dimensions is shown in Figure 2.
6.2 Substrates shall have beveled edges. The edges
shall conform to the dimensional tolerances appropriate
to the nominal thickness listed in Table 2. Dimensions
are illustrated in Figure 3.
6.3 The major sides of square substrates shall be
parallel within 5.0 µm along both major axes.
Measurements are taken within the quality flatness area,
along both major axes. Calculation of parallelism is
illustrated in Figure 7.
7 Material Specifications
7.1 Substrate materials shall be specified “ultra low
thermal expansion” (ULTE). An example of ULTE
material is fused silica (quartz).
7.2 Selected physical properties of ULTE materials are
provided for information only in Appendix 1.
8 Flatness Specifications
8.1 Substrates shall be supplied with two major sides
having flatness (TIR) of 1, 2, or 5 µm over a square
quality flatness area as defined in Figure 4. Sides are
not required to have equivalent flatness. (NOTE: 0.5
µm is not yet available but is widely expected in the
SEMI P33-0998 © SEMI 1998 2
near future. Flatness of 0.5 µm is very desirable for
semiconductor production, and equipment suppliers
may want to consider this in their designs.)
9 Visual Criteria
9.1 A visual quality area, which may or may not
correspond with the flatness area, shall be agreed upon
between the user and supplier.
9.2 Fused silica (ULTE) substrates shall be identified
with one corner chamfer as shown in Figure 5.
Dimensions of the chamfer shall be as specified in
Figure 6. The corner chamfer is made only on the non-
critical side of the substrate.
10 Sampling
10.1 Unless otherwise specified, appropriate sample
sizes shall be selected from each lot in accordance with
ANSI/ASQC Z1.4. Each quality characteristic shall be
assigned an acceptable quality level (AQL) in
accordance with ANSI/ASQC Z1.4 definitions for
critical, major, and minor classifications. If desired,
and so specified in the contract or order, each of these
classifications may alternatively be assigned cumulative
AQL values. Inspection levels shall be agreed upon
between user and supplier.
11 Test Methods
11.1 Thermal Expansion — Determine in accordance
with ASTM E 228.
11.2 Flatness (to be agreed upon between user and
supplier).
11.3 Visual (to be agreed upon between user and
supplier).
11.4 Parallelism (to be agreed upon between user and
supplier; non-contact methods are preferred).
12 Handling
12.1 Substrates are to be handled on the edges only.
Substrates are to be handled with gloves approved for
cleanroom use, when human handling is required.
13 Orientation
13.1 For ULTE substrates with a single corner
chamfer (see Section 9.2), it is recommended that all
orientation be performed referencing the corner of the
substrate diagonally opposite the chamfer. See Figure 8
for more information.
14 Certification
14.1 Upon request of the purchaser in the contract or
order, a manufacturer’s or supplier’s certification that
the material was manufactured and tested in accordance
with this specification, together with a report of the test
results, shall be furnished at the time of shipment.
15 Packing and Marking
15.1 Substrates shall be packed in a class 100
environment as defined by Federal Standard 209.
Containers shall be designed to prevent glass-to-glass
contact, and to protect the substrates from
contamination in handling and transit. Substrates shall
be shipped with the critical side toward the front or
bottom of the shipping carrier, depending on carrier
configuration. The substrate shipping position shall be
indicated on each container. Packaging shall comply
with the applicable internal, national, state, and local
laws and regulations required for shipping.
15.2 Containers shall be labeled “Warning: Open and
Handle Under Cleanroom Conditions Only” as well as
identified by user purchase order number (if
applicable), drawing number (if applicable), quantity,
supplier lot number, and material identification.
16 Related Documents
16.1 SEMI Standard
SEMI P1 — Specification for Hard Surface Photomask
Substrates