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1 SEMI G64-96 © SEMI 1996, 2004 SEMI G64-96 (Reapproved 1104) SPECIFICATION FOR FULL-PLA TED INTEGRATED CIRCUIT LEADFRAMES (Au, Ag, Cu, Ni, Pd/Ni, Pd) This specification was technicall y reapproved by th e Global Assembl…

SEMI X##-#### © SEMI 2001 4

APPENDIX 1

NOTE: The material in this appendix is an official part of SEMI G63 and was approved by full letter ballot

procedures in 1995.

A1-1 Purpose

The purpose of this appendix is to indicate that speed

and height of the die contact tool affect die shear

strength results.

A1-2 Test Results

Figure A1-1

Tool Velocity Test Results

Figure A1-2

Tool Height Test Results

A1-2.1 Summary

A1-2.1.1 Shear Speed

a. Some adhesive might yield variable results due to

the relationship of the shear speed and failure

speed.

b. Some equipment with high shear speed could yield

low strength due to poor sensitivity at the peak of

the load.

A1-2.1.2 Height of the Die Contact Tool

a. In case of low height, fillet level might affect the

strength.

b. In case of high height, a variable result might be

obtained since the tool pulls the die and it tears the

adhesive.

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature

respecting any materials mentioned herein. These

standards are subject to change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express writte

consent of SEMI.

1 SEMI G64-96 © SEMI 1996, 2004

SEMI G64-96 (Reapproved 1104)

SPECIFICATION FOR FULL-PLATED INTEGRATED CIRCUIT

LEADFRAMES (Au, Ag, Cu, Ni, Pd/Ni, Pd)

This specification was technically reapproved by the Global Assembly & Packaging Committee and is the

direct responsibility of the Japanese Packaging Committee. Current edition approved by the Japanese

Regional Standards Committee on July 23, 2004. Initially available at www.semi.org September 2004; to be

published November 2004. Originally published in 1996.

1 Purpose

1.1 This specification is intended as a guideline for

evaluating plating layer characteristics required by

users of full-plated leadframes for plastic

semiconductor packages.

1.2 Background — Full-plated leadframes have

received attention in recent years as a possible solution

to challenges and restrictions resulting from the effects

of Pb on the environment, package reliability

improvement due to the P.P.F. process, lead coplanarity

on fine-pitched leadframes, and lead bridges with solder

plating.

2 Scope

2.1 The specification and test procedures detailed in

this document apply to full-plated leadframes.

2.2 Units — SI units are used in this document.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Referenced Standards

3.1 SEMI Standards

SEMI G4 — Specification for Integrated Circuit

Leadframe Materials Used in the Production of

Stamped Leadframes

SEMI G18 — Specification Integrated Circuit

Leadframe Material Used in the Production of Etched

Leadframes

SEMI G21 — Specification for Plating Integrated

Circuit Leadframes

SEMI G52 — Standard Test Method for Measurement

of Ionic Contamination on Semiconductor Leadframes

(Proposed)

SEMI G55 — Test Method for Measurement of Silver

Plating Brightness

SEMI G56 — Test Method forMeasurement of Silver

Plating Thickness

3.2 ISO Standards

ISO-3497 — Metallic Coating Measurement of Coating

Thicknesses, X-Ray Spectrometer Method

ISO-9227 — Corrosion Tests in Artifical Atmospheres

- Salt Spray Tests

3.3 JIS Standard

JIS-C-0053 — Solderability Testing by the Wetting

Balance Method

3.4 Military and Federal Standards

MIL-C-14550 — Copper Plating-Electrodeposited

MIL-F-14256 — Flux, Soldering, Liquid, Paste Flux,

Solder Paste, and Solder Paste Flux

MIL-G-45204 — Gold Plating-Electrodeposited

MIL-STD-883D — Method 2003.7, Solderability

QQ-N-290 — Nickel Plating-Electrodeposited

QQ-S-365 — General Requirements for

Electrodeposited Silver Plating

QQ-S-571 — Solder Composition

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

4 Terminology

4.1 Definitions

4.1.1 finish plating — final plating layer whose

electrodeposits fulfill the main purpose of the required

characteristic.

1 International Organization for Standardization, ISO Central

Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,

Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30,

Website: www.iso.ch

2 Japanese Industrial Standards, Available through the Japanese

Standards Association, 1-24, Akasaka 4-Chome, Minato-ku, Tokyo

107-8440, Japan. Telephone: 81.3.3583.8005; Fax: 81.3.3586.2014,

Website: www.jsa.or.jp

3 United States Military Standards, Available through the Naval

Publications and Forms Center, 5801 Tabor Avenue, Philadelphia,

PA 19120-5099, USA. Telephone: 215.697.3321

SEMI G64-96 © SEMI 1996, 2004 2

4.1.2 solderability — an index of the wettability and

coverage with solder of lead surface.

4.1.3 underplating — plating layers that complete the

required characteristics of the final plating layer and

lies between the base material and final plating layer.

5 Ordering Information

5.1 Priority

5.1.1 To avoid confusion, the order of precedence

when ordering leadframes shall be as follows:

1. Purchase Order (agreed between user and supplier)

2. This Specification

3. Referenced Documents

6 Materials

6.1 Base Material — Cu alloys or Fe/Ni alloys.

6.2 Plating Material — Underplating and Finish

plating are shown in Table 1.

Table 1 Table 1 Underplating and Finish Plating

Base Material

Finish Plating Underplating

Cu-Alloys Fe, Ni-Alloys

Au (MIL-G-

45204)

- N/A X

Ni X X

Ag (QQS-365) - X N/A

Cu X X

Cu (MIL-C-

14550)

- X X

Ni X X

Ni (QQN-290) - X X

Cu X X

Pd/Ni-Alloy - X X

Ni X X

Cu X X

Pd - X X

Ni X X

Cu X X

Pd/Ni-Alloy X X

7 Plating Specification

7.1 Plating Thickness — For full-plated leadframes, the

designed thickness including under plating is restricted

as follows to limit the effects of thickness variation on

coplanarity and outer lead width.

 Designed thickness including under plating-1 / Ag-

plating: 5 µm MAX

 Designed thickness including under plating-2 / Au,

Cu, Ni, Pd/Ni-Alloy, Pd plating: 2 µm MAX

7.2 Visual Inspection — Rejectable conditions are as

follows:

1. Any bare spots, or missing plating in critical area as

defined the coined areas or minimum flat wire bond

area in the appropriate leadframe specification.

2. Any peeling or blistered plating.

3. Any nodules in critical area as defined the coined

areas or minimum flat wire bond area in the

appropriate leadframe specification.

NOTE 1: Nodules not exceeding 0.0381 mm in a surface

dimension and 0.0127 mm in height, in non-critical areas

are allowed providing there are no more than one per

internal lead finger or six (6) per leadframe.

4. Any pits which exceed 0.008 mm in depth or 0.0127

mm in a surface dimension in critical areas or

0.0254 mm in depth or 0.051 mm in a surface

dimension in non-critical areas.

5. Any scratches or scrapes in the metallization plating

which expose underplating or base material.

6. Any scratches or scrapes in critical area which cause

a build up of material in excess of 0.0127 mm in

height.

7. Any foreign material, contamination, or tarnish.

8. Non-uniformity or rough-plated surface.

7.3 Visual Inspection after Baking — The test

procedure is described in Section 9.3. Visual inspection

after baking shall be performed according to the

procedure in Section 9.2.1.

7.4 Corrosion Resistance (not applicable to Cu

plating) — In the test result, allowable corrosion

specification shall be agreed upon between user and

supplier.

7.5 Surface Ion Contamination — Allowable ion

species and ion concentration shall be agreed upon

between user and supplier.

7.6 Adhesion — If there is any plating film on the test

tape, the component shall be rejected. Adhesive test

should be performed according to the procedure in

Section 9.6.

7.7 Functional Tests

7.7.1 Die Attach — Agreed upon between user and

supplier.