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SEMI T13-1104 © SEMI 2004 24 APPENDIX 1 APPENDIX Device Tracking NOTICE : The material in this appendix is an official part of SEMI T13 and was approved by full letter ballot procedur es on April 30 , 2004. A1-1 Device T…

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SEMI T13-1104 © SEMI 2004 23
12.2.6.7 enroll — This service is used to ask under control of requester DieTraceManager for device tracking. The
following table defines its parameters.
Table 31 Service Definition of enroll for Die Tracer
Parameter Req/Ind Rsp/Conf Description
ManagingTracer M - Specifier of DieTraceManager.
ServiceStatus - M Result of service request
12.2.6.8 takeDTD — This service is used to report obtained DieTraceData. The following table defines its
parameters.
Table 32 Service Definition of takeDTD for Die Tracer
Parameter Req/Ind Rsp/Conf Description
TraceData M - Data value with its property.
ServiceStatus - M Result of service request
12.2.6.9 Parameter List — Above services use the following parameters.
Table 33 Service Parameter Definitions for Die Tracer
Parameter Definition Form
DataName DieTraceData name. Suppliers or user shall document data names and
their definitions.
Text.
DataNameList List of Data name separated by space. Text.
Destination URI or some other code/name to specify forwarded application. If it is
null, it means removal of existing forwarding setups for specified
data.
Text
ManagingTracer URI or some other code/name to specify DieTraceManager. Text
Target Code/name to specify process or machine. Text
TraceData Die Trace Data value with its property. See DieTraceDat for the
property.
Any form depending on
Data.
ServiceStatus Result of service to show successful or reason of failure. Text
SEMI T13-1104 © SEMI 2004 24
APPENDIX 1
APPENDIX Device Tracking
NOTICE: The material in this appendix is an official part of SEMI T13 and was approved by full letter ballot
procedures on April 30, 2004.
A1-1 Device Tracking
A1-1.1 Die Tracking vs. Device Tracking
A1-1.1.1 Growing modern semiconductor technology allows more than one die in a package. Such package
technologies as Flip Chip Packaging and System In Package (SIP) are examples. Sometimes more than five dice are
packaged in a small plastic package. Because the word “device” is the final product of semiconductor, tracking
devices can be covered by tracking die specification.
A1-1.2 Device Tracking Data — Devices are moved from one substrate to another. The dimensions of the
substrates are not the same so inevitably there will not be a one-to-one relationship between the “From” substrate
and the “To” substrate. The simplest solution would be to send a set of reports each of which include the “From”
substrate type, ID and XY devices coordinates and the same type of information again for the “To” substrate. This
will, however, lead to a lot of repetition of substrate type and ID.
A1-1.2.1 Tracking Report — In order to keep it compact, the report will contain an ordered array of elements for
each device on the “To” substrate. The “From” substrate type and Id are only provided when substrate changes.
The array may be row major or column major to match the processing sequence used on equipment, otherwise the
“From” substrate type and Id might change back and forth.
A1-1.2.2 Device Tracking Example — An example of Device Tracking is provided in Related Information.
A1-1.3 Device ID Data — Devices may be marked either while they are still on the wafer (ref: Backside WaferId
TF) or when they are packaged on a strip, or in a tray.
A1-1.3.1 Device ID Reporting Example — An example of Device ID Reporting is provided in Related
Information..
A1-1.4 Substrate Layout Data — Device Tracking Data and Device ID Data depend on the devices to which they
refer being arranged in a regular two dimensional array or matrix. I some cases, for example a multi-chip module,
this is not the case. The Substrate Layout Data contains a representation of the substrate geometry in terms of
repeating and nested matrices. Each matrix works as an identifier which links those elements to the corresponding
Device Tracking Data and Device ID Data.
A1-1.4.1 Substrate Layout Data Example — example of Substrate Layout Data Reporting is provided in Related
Information.
SEMI T13-1104 © SEMI 2004 25
APPENDIX 2
COORDINATE SYSTEMS
NOTICE: The material in this appendix is an official part of SEMI T13 and was approved by full letter ballot
procedures on April 30, 2004.
A2-1 Horizontal Coordinates
A2-1.1 Die Coordinate, Origin and Fiducial — Definition of the origin of coordinates used with this specification
is basically compliant to such SEMI standard as G81 and G84. For complicated or irregular die arrangement
including sub-array of dice, it is assumed to be compliant to Section 18 Coordinate System in SEMI E130. If the
other coordinate system or origin definitions, which are specific to substrates or user/equipment dependent, user or
supplier shall specify in specification or complementary document. Fiducial information shall be also documented if
it is necessary for tracking.
A2-1.2 The other Coordinate Systems — If surface position is required to give Die Trace Data except Device
coordinates, such SEMI standard as M17, M20 or M21 shall be basically used: e.g. for visual inspection and film
thickness measurement. If some derivations from the standards or complete different coordinate system are required,
depending on equipment, supplier or user shall document to exchange specification.
A2-2 Vertical Dimension
A2-2.1 Vertical Position — Sometimes vertical position may be required to represent Die Trace Data. This standard
assumes one of the following representation of vertical position.
A2-2.1.1 Z Dimension — This representation consists of ‘Order’ and ‘Height’. ‘Order’ means order number of
concerning device from lowest substrate. ‘Height’ is actual vertical dimension of concerning device from top surface
of the device just below it or substrate. Unit of the Height is given with the value or common with the other
information. See R1-3 for example.
A2-2.1.2 GCD Grid — When above positioning system is not convenient or doesn’t work for specific equipment or
tracking system, this system is used alternatively. Take Greatest Common Denominator (GCD) of all mounted
devices on substrate and assume a grid of the GCD. It may be 50 micron for example. The origin of the grid must be
surface of base substrate and minus vale may be used in such a case that a die is implanted in the substrate. This may
be useful for some advanced assembly or bird-eye view preferred systems.
A2-2.2 The Other Vertical dimensions — Additional vertical dimension may be required for some equipment.
Because they are equipment dependent, this document doesn’t specify anything about coordinates except the
previous subsections. User or suppliers shall document to understand Die Trace Data correctly.