semi合集-English.pdf - 第498页
SEMI E70-1103 © SEMI 1998, 2003 9 NOTICE: SEMI makes no warranties or represen tations as to th e suitability of the standards set forth herein for any particular application. The d etermination of th e suitability of th…

SEMI E70-1103 © SEMI 1998, 2003 8
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Figure 2
Tool Accommodation Process Flow Chart

SEMI E70-1103 © SEMI 1998, 2003 9
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for
any particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.

SEMI E72-0600 © SEMI 1998, 2005 1
SEMI E72-0600 (Reapproved 0305)
SPECIFICATION AND GUIDE FOR 300 mm EQUIPMENT FOOTPRINT,
HEIGHT, AND WEIGHT
This specification was technically approved by the Global Physical Interfaces & Carriers Committee and is
the direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition
approved by the North American Regional Standards Committee on December 10, 2004. Initially available
at www.semi.org February 2005; to be published March 2005. Originally published in 1998, previously
published June 2000.
1 Purpose
1.1 Currently, device manufacturers cannot easily plan or retrofit their fabs, because equipment volumes are not
predictable. Similarly, equipment suppliers cannot predict fab designs, because there are too many configurations. In
general, fab space is not used efficiently, and there seems to be a trade-off between space efficiency and
maintainability. This standard is a guide for equipment design and a specification for maximum limits on equipment
volume and weight.
2 Scope
2.1 This standard specifies limits on the footprint, height, and weight of equipment for 300 mm fabs. Separate limits
are given for the parts of the equipment in the main fab and in the sub-fab. Separate limits are also given for the
equipment after it is installed and for the components of the equipment as it is moved into the fab. The actual
footprint may vary by equipment type.
2.2 This standard is intended to set an appropriate level of specification that places minimal limits on supplier
innovation while ensuring opportunities for users to be globally (though possibly not locally) efficient with
equipment volumes.
2.3 This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of
the users of this standard to establish appropriate safety and health practices and determine the applicability of
regulatory limitations prior to use.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E15 — Specification for Tool Load Port
SEMI E15.1 — Specification for 300 mm Tool Load Port
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 Definitions
4.1.1 cost footprint — the area (A) of the smallest horizontal rectangle that contains all of the shadow footprint and
half of the easement space around the equipment (for use as the floor space metric in Cost of Ownership
calculations). As shown in Figure 1, this is computed as
A = [Wt + ½ (Ws – Wt)] × [Dt + ½ (Ds – Dt)]
= ¼ (Wt + Ws) × (Dt + Ds)
Where W represents width and D represents depth