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SEMI T13-1104 © SEMI 2004 26 RELATED INFORMATION 1 DEVICE TRACKING EXAMPLES NOTICE : This related information is not an official pa rt of SEMI T13 and was derived from the Japanese Traceability Committee. This related in…

SEMI T13-1104 © SEMI 2004 25

APPENDIX 2

COORDINATE SYSTEMS

NOTICE: The material in this appendix is an official part of SEMI T13 and was approved by full letter ballot

procedures on April 30, 2004.

A2-1 Horizontal Coordinates

A2-1.1 Die Coordinate, Origin and Fiducial — Definition of the origin of coordinates used with this specification

is basically compliant to such SEMI standard as G81 and G84. For complicated or irregular die arrangement

including sub-array of dice, it is assumed to be compliant to Section 18 Coordinate System in SEMI E130. If the

other coordinate system or origin definitions, which are specific to substrates or user/equipment dependent, user or

supplier shall specify in specification or complementary document. Fiducial information shall be also documented if

it is necessary for tracking.

A2-1.2 The other Coordinate Systems — If surface position is required to give Die Trace Data except Device

coordinates, such SEMI standard as M17, M20 or M21 shall be basically used: e.g. for visual inspection and film

thickness measurement. If some derivations from the standards or complete different coordinate system are required,

depending on equipment, supplier or user shall document to exchange specification.

A2-2 Vertical Dimension

A2-2.1 Vertical Position — Sometimes vertical position may be required to represent Die Trace Data. This standard

assumes one of the following representation of vertical position.

A2-2.1.1 Z Dimension — This representation consists of ‘Order’ and ‘Height’. ‘Order’ means order number of

concerning device from lowest substrate. ‘Height’ is actual vertical dimension of concerning device from top surface

of the device just below it or substrate. Unit of the Height is given with the value or common with the other

information. See R1-3 for example.

A2-2.1.2 GCD Grid — When above positioning system is not convenient or doesn’t work for specific equipment or

tracking system, this system is used alternatively. Take Greatest Common Denominator (GCD) of all mounted

devices on substrate and assume a grid of the GCD. It may be 50 micron for example. The origin of the grid must be

surface of base substrate and minus vale may be used in such a case that a die is implanted in the substrate. This may

be useful for some advanced assembly or bird-eye view preferred systems.

A2-2.2 The Other Vertical dimensions — Additional vertical dimension may be required for some equipment.

Because they are equipment dependent, this document doesn’t specify anything about coordinates except the

previous subsections. User or suppliers shall document to understand Die Trace Data correctly.

SEMI T13-1104 © SEMI 2004 26

RELATED INFORMATION 1

DEVICE TRACKING EXAMPLES

NOTICE: This related information is not an official part of SEMI T13 and was derived from the Japanese

Traceability Committee. This related information was approved for publication by full letter ballot on April 30,

2004.

R1-1 Device Tracking Report

R1-1.1 The following figurer and list are example of

Device Tracking Report.

R1-1.1.1 Device Example — The following Figure

shows a device picked from a wafer and placed on a

strip.

R1-1.1.2 Report Example — The following list shows

an example of the report for the first 2 devices on a strip

taken from Wafer1 and the next 2 taken from Wafer2.

From Substrate

OriginLocation(0,0) = "LowerLeftTop"

RowColumnMajor = "Column"

FromX

FromY

To Substrate

Index = 15

Rows = 6

Columns = 40

ToX = 2

ToY = 4

Figure R1-1

SEMI T13-1104 © SEMI 2004 27

List 1 An Example of Device Tracking Data in XML

<?xml version="1.0" encoding="utf-8" ?>

DeviceTrackingData xmlns="urn:semi-org:xsd.Doc3754.V0312.DeviceTrackingData">

<SubstrateType>Strip</SubstrateType>

<SubstrateId>MyStrip</SubstrateId>

<LayoutId>Device</LayoutId>

<OriginLocation>LowerLeftTop</OriginLocation>

<RowColumnMajor>Column</RowColumnMajor>

<SubstrateType>Wafer</SubstrateType>

<SubstrateId>Wafer1</SubstrateId>

<D><X>7</

X><Y>17</Y></D>

</FromSubstrate>

<SubstrateType>Wafer</SubstrateType>

<SubstrateId>Wafer2</SubstrateId>

</FromSubstrate>

DeviceTrackingData>

NOTE 1: The <D> elements contain the X and Y location on the substrate from which they came.

NOTE 2: The <FromSubstrate> element specifies the substrate type and identifier from which the devices came from.

NOTE 3: The <D> elements represent each device on the layout “Device” for strip “MyStrip”.

NOTE 4: The number of <D> entries must equal Rows * Columns defined in the “Device” layout.

NOTE 5: The one dimensional array of <D> elements represents the two dimensional array of locations defined in the “Devices” layout in

RowColumnMajor format with respect to the OriginLocation.

NOTE 6: The OriginLocation corresponds to the definition of the same name in SEMI G81.

R1-2 Device ID Report

R1-2.1 ID Example — The following figure shows a

strip of devices with alphanumeric and 2D matrix

marks. The unique part of the 2D mark is “LOT001-

XXYY”.

R1-2.2 Report Example — The following list shows a

truncated version of the Device Id Data report for the

strip shown in upper figure.

Substrate

Index = 3

Rows = 3

Columns = 10

ToX = 1

ToY = 1

OriginLocation (0,0) ="LowerLeftTop"

RowColumnMajor="Column"

DeviceId

Figure R1-2