semi合集-English.pdf - 第5630页

SEMI P10-0705 © SEMI 1990, 2005 125 8.1.262 E ND_SHIPPABLE _DATA — Must match d ata field of STAR T_SHIPPABLE_ DATA. 8.1.263 END_SUBSTRATE — Must match data field of START _ SUBSTRATE. 8.1.264 END_SURFACE_DEFINITION — M …

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SEMI P10-0705 © SEMI 1990, 2005 124
8.1.234 END_MASK_RESULTS — Must match START_MASK_RESULTS data field.
8.1.235 END_MASK_RESULTS_OPTIONS — Alphanumeric data field must match data field of
START_MASK_RESULTS_OPTIONS
8.1.236 END_MASK_SET — Must match data field of MASK_SET_ID for which data is complete.
8.1.237 END_MASK_SET_OPTIONS — Must match data field of MASK_SET_ID for which options are
complete.
8.1.238 END_MATERIALS_USED — Alphanumeric data field must match data field of
START_MATERIALS_USED.
8.1.239 END_MEASURED_ETCH_DEPTH_SITE — Must match data field of
MEASURED_ETCH_DEPTH_MARK_SITE_ID.
8.1.240 END_MEASURED_PHASE_ANGLE_SITE — Must match data field of
MEASURED_PHASE_ANGLE_MARK_SITE_ID.
8.1.241 END_MEASURED_REGISTR_MARK — Must match data field of
MEASURED_REGISTR_MARK_ID.
8.1.242 END_MEASURED_TRANSMISSION_SITE — Must match data field of
MEASURED_TRANSMISSION_MARK_SITE_ID.
8.1.243 END_OPC — Must match data field of START_OPC.
8.1.244 END_ORDER — Must match data field of START_ORDER for which data is complete.
8.1.245 END_PATTERN_DEFINITION — Must match data field of LEVEL_ID for which data is complete.
8.1.246 END_PATTERN_GROUP — Must match data field of PATTERN_GROUP_ID for which data is
complete.
8.1.247 END_PATTERN_GROUP_INSTANCE — Must match data field of PATTERN_GROUP_INSTANCE.
8.1.248 END_PATTERN_GROUP_OPTIONS — Must match data field of PATTERN_GROUP_ID for which
options are complete.
8.1.249 END_PATTERN_GROUP_RESULTS — Alphanumeric data field must match data field of
START_PATTERN_GROUP_RESULTS.
8.1.250 END_PATTERN_OPTIONS — Must match data field of START_PATTERN_OPTIONS.
8.1.251 END_PHASE_ANGLE_MEASUREMENTS — Must match data field of
START_PHASE_ANGLE_MEASUREMENTS.
8.1.252 END_PHASE_SHIFT — Must match START_PHASE_SHIFT data field.
8.1.253 END_PHASE_SHIFT_MEASUREMENTS — Must match data field of
START_PHASE_SHIFT_MEASUREMENTS.
8.1.254 END_PLACEMENT — Must match data field of START_PLACEMENT.
8.1.255 END_REGISTR — Must match data field of START_REGISTR.
8.1.256 END_REGISTR_MEASUREMENTS — Must match data field of
START_REGISTR_MEASUREMENTS.
8.1.257 END_REPAIR_DEFINITION — Must match data field of START_REPAIR_DEFINITION.
8.1.258 END_SEM_PHOTO — Must match START_SEM_PHOTO data field.
8.1.259 END_SHIP_FILM — Must match data field of SHIP_FILM.
8.1.260 END_SHIP_PLOT — Must match data field of START_SHIP_PLOT.
8.1.261 END_SHIP_TO — Must match data field of START_SHIP_TO.
SEMI P10-0705 © SEMI 1990, 2005 125
8.1.262 END_SHIPPABLE_DATA — Must match data field of START_SHIPPABLE_DATA.
8.1.263 END_SUBSTRATE — Must match data field of START_SUBSTRATE.
8.1.264 END_SURFACE_DEFINITION — Must match data field of START_SURFACE_DEFINITION.
8.1.265 END_SURFACE_INSP_MEASUREMENTS — Must match data field of
START_SURFACE_INSP_MEASUREMENTS.
8.1.266 END_TITLE — (title number) Indicates end of keywords for a specific title. Must match data field of
START_TITLE for which data is complete.
8.1.267 END_TRANSMISSION_MEASUREMENTS — Must match data field of
START_TRANSMISSION_MEASUREMENTS.
8.1.268 END_VENDOR_INFO — Must match data field of START_VENDOR_INFO.
8.1.269 ENGINEERING_ADDRESS — Address for delivery of shippable engineering data.
8.1.270 ENGINEERING_CONTACT — Name of person to contact for technical questions.
8.1.271 ENGINEERING_EMAIL — Internet address for ENGINEERING_CONTACT.
8.1.272 ENGINEERING_FAX — Phone number for facsimile machine of ENGINEERING_CONTACT.
8.1.273 ENGINEERING_PHONE — Phone number for ENGINEERING_CONTACT.
8.1.274 EQUIP_SITE_REQD — Alphanumeric identification of qualified manufacturing site, to be agreed between
customer and vendor, for preceding required equipment. For a given MASK_ID, EQUIP_SITE_REQD may not be
used in combination with MFG_SITE_REQD.
8.1.275 ESTIMATED_ARRIVAL — The date and time when the vendor predicts MASK_ID will be delivered to
the customer, based on the MILESTONE most recently completed.
8.1.276 ESTIMATED_ARRIVALS — (T or F) If T, the vendor is requested to use <mask_results> to supply a
prediction of the delivery date and time when MASK_ID will be delivered to the customer, based on the
MILESTONE most recently completed. ESTIMATED_ARRIVAL will be transmitted each time <mask_results> is
required by either MILESTONES or PERIODIC_UPDATES. If neither have been requested, then
ESTIMATED_ARRIVAL should be transmitted daily.
8.1.277 ETCH_DEPTH_EQUIP_REQD — (text) Etch depth measurement equipment required by customer.
8.1.278 ETCH_DEPTH_EQUIP_USED — (text)
Etch depth measurement equipment used.
8.1.279 ETCH_DEPTH_ERROR — Maximum allowable deviation (in angstroms) of any etch depth measurement
from ETCH_DEPTH_TARGET.
8.1.280 ETCH_DEPTH_MARK_DRAWING — The uniquely identified (for each customer) document which
shows the etching depth measurement mark structure itself, and may show the place(s) within the etching depth
measurement mark which are to be measured.
8.1.281 ETCH_DEPTH_MARK_FEATURE — Text describing the feature to be used for phase etching depth
measurement.
8.1.282 ETCH_DEPTH_MARK_LOCATION — (x,y) Location of etching depth measurement mark relative to the
nominal center of the mask (chrome side up).
8.1.283 ETCH_DEPTH_MARK_LOCATION_DRAWING — The uniquely identified (for each customer)
document which shows the location(s) of the etching depth measurement mark structure.
8.1.284
ETCH_DEPTH_MEASUREMENT_DATE — Etch depth measurement date.
8.1.285 ETCH_DEPTH_MEASUREMENT_FILE_NAME — Name of data file containing results of etch depth
measurement.
8.1.286 ETCH_DEPTH_MODE_REQD — (text) operating mode required by customer for
ETCH_DEPTH_EQUIP_USED.
SEMI P10-0705 © SEMI 1990, 2005 126
8.1.287 ETCH_DEPTH_MODE_USED — (text) operating mode for ETCH_DEPTH_EQUIP_USED.
8.1.288 ETCH_DEPTH_SITE_ID — Unique alphanumeric identifier of each etch depth measurement location
within MASK_SET_ID to identify individual locations when using <mask_results>. If the same coordinates apply
to locations on different masks within the mask set, they may have the same ETCH_DEPTH_SITE_ID, but it is not
mandatory.
8.1.289 ETCH_DEPTH_RANGE — Maximum acceptable variation (in angstroms) of all etch depth measurements,
relative to each other.
8.1.290 ETCH_DEPTH_REFERENCE_ONLY — (T or F) If T, indicates that the etch depth feature is to be
measured and the data transmitted to the customer (if requested by SHIP_PHASE_SHIFT_MEASUREMENTS), but
that deviations in its measured value due to mask processing would NOT be cause for mask rejection.
8.1.291 ETCH_DEPTH_TARGET — Desired mean etch depth in angstroms.
8.1.292 ETCH_DEPTH_TOLERANCE — Maximum acceptable deviation (in angstroms) of the mean of all
measured critical dimensions to the ETCH_DEPTH_TARGET.
8.1.293 EUV_ABSORBER_COMPOSITION (text) — Composition of the absorber stack of an EUV mask, to be
agreed on between customer and supplier, as per SEMI P38.
8.1.294 EUV_ABSORBER_OPTICAL_PROPERTIES — Percentage of absorber reflectivity as defined in Table
11 OF SEMI P38.
8.1.295 EUV_BLANK_RESISTANCE (numeric) — Electrical resistance (in Ohms) measured between the surface
of the absorber stack and the backside of the mask blank.
8.1.296 EUV_BLANK_TYPE — Type of EUV mask blank as defined in Table 1 of SEMI P38.
8.1.297 EUV_CAPPING_COMPOSITION (text) — Composition of capping layers on the multilayer stack of an
EUV mask, to be agreed on between customer and supplier, as per SEMI P38.
8.1.298 EUV_EXPANSION_COEFF — Grade of coefficient of thermal expansion for EUV mask blank as defined
in Table 3 of SEMI P37.
8.1.299 EUV_FLATNESS_BACK — Grade of flatness required for back side of EUV mask within flatness quality
area as per Figure 3 and Table 4 of SEMI P37.
8.1.300 EUV_FLATNESS_FRONT — Grade of flatness required for front side of EUV mask within flatness
quality area as per Figure 3 and Table 4 of SEMI P37.
8.1.301 EUV_MEAN_PEAK_REFLECTIVITY — Grade for percentage reflectivity of the EUV multilayer stack,
as per Table 5 of SEMI P38.
8.1.302 EUV_MMR_WAVELENGTH (wavelength) — Wavelength in nanometers of the mean median reflected of
the multilayer stack of an EUV mask, to be agreed on between customer and supplier, as per SEMI P38.
8.1.303 EUV_MULTILAYER_COMPOSITION (text) — Material composition of the multilayers of an EUV
mask, to be agreed on between customer and supplier, as per SEMI P38.
8.1.304 EUV_PEAK_REFLECTIVITY_UNIFORMITY — Grade of reflectivity uniformity required per Table 6 of
SEMI P38.
8.1.305 EWT_CEILING — (numeric) The maximum monetary amount that can be added to PRICE as an excess
write time charge for the mask. If the charge calculated with EWT_RATE exceeds EWT_CEILING, then
EWT_CEILING is used as the excess write time charge.
8.1.306 EWT_RATE — (numeric) The monetary amount per minute to be added to PRICE for write time
exceeding the EWT_THRESHOLD time. The monetary unit is defined in PRICE_UNITS.
8.1.307
EWT_THRESHOLD — (numeric) The number of minutes that a mask can write before incurring an
Excess Write Time (EWT) charge.