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SEMI M44-0305 © SEMI 2001, 2005 3 6.3 Irrespective of the calibration factor, to convert oxygen density (atoms/cm 3 ) to oxygen co ncentration (ppm a) , within the same cal ibration factor, di vide the oxygen density val…

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SEMI M44-0305 © SEMI 2001, 2005 2
3.2 ASTM Standards
F 121-70 through F 121-79 — Test Method for Interstitial Atomic Oxygen Content of Silicon by Infrared
Absorption
3
F 121-80 through F 121-83 — Test Method for Interstitial Atomic Oxygen Content of Silicon by Infrared
Absorption
4
3.3 JEITA (formerly JEIDA) Standard
EM-3504 (61) — Standard Test Method for Interstitial Atomic Oxygen Content of Silicon by Infrared Absorption
5,6
3.4 DIN Standards
DIN 50438 Part 1 [1978] — Determination of Impurity Content in Silicon by Infrared Absorption: Oxygen
7
DIN 50438 Part 1 [1994, 1995] — Determination of Impurity Content in Silicon by Infrared Absorption; Part 1
Oxygen
8
3.5 Guo Biao Standard
GB/T 1557-1989 — Test Method for Interstitial Oxygen Content in Silicon Crystals by Infrared Absorption
Spectroscopy (in Chinese)
9
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 Many terms relating to silicon technology are defined in SEMI M59.
5 Other Techniques
5.1 Other measurement techniques for measuring oxygen in silicon (e.g., SIMS or gas fusion analysis, GFA)
measure total oxygen whereas the infrared absorption methods, to which this guide applies, measure interstitial
oxygen only.
6 Conversion Factors Among International Standards
6.1 Table 1 gives the calibration factors published in various standard test methods for determination of interstitial
oxygen content in silicon by infrared absorption. The factor to obtain the oxygen concentration in parts per million
atomic is given in column 2 while the factor to obtain the oxygen density in atoms/cm
3
is given in column 3. The
calibration factors are listed in order from the smallest value to the largest value irrespective of the time frame over
which they were adopted.
6.2 Table 2 gives the factors to convert oxygen concentration of one standard to oxygen concentration of another
standard. The interstitial oxygen content found by any procedure may be reported in any other standardized scale by
multiplying the value by the appropriate conversion factor in Table 2. The factors are listed in the same order as in
Table 1.
3 Revised to change the calibration factor in 1980; last available edition in the 1980 edition of Annual Book of ASTM Standards, Part 43. ASTM
International, 100 Barr Harbor Drive, West Conshohocken, PA 19428. Telephone: 610-832-9500, Fax: 610-832-9555, Website:
www.astm.org
4 Withdrawn in 1988; last available edition in the 1987 edition of Annual Book of ASTM Standards, Vol 10.05. Replaced by ASTM F 1188
(now SEMI MF1188) that refers to IOC-88.
5 Japan Electronics and Information Technology Industries Association, 3
rd
floor, Mitsui Sumitomo Kaijo Bldg. Annex, 11, Kanda-Surugadai 3-
chome, Chiyoda-ku, Tokyo 101-0062, Japan, Telephone: 81.3.3518.6434, Fax: 81.3.3295.8726, Website:
www.jeita.or.jp.
6 This standard replaces the calibration factor reported in T. Iizuka, S. Takasu, M. Tajima, T. Arai, T. Nozaki, N. Inoue, and M. Watanabe,
“Determination of Conversion Factor for Infrared Measurement of Oxygen in Silicon,” J. Electrochem. Soc. 132, 1707-1713 (1985), which was
previously widely used in Japan.
7 Deutches Institut für Normung e.V., Burggrafenstrasse 6, 10787 Berlin, Germany, Telephone: 49.30.2601-0, Fax: 49.30.2601.1263, Website:
www.din.de. Replaced in 1994 by revised edition that refers to IOC-88.
8 Deutches Institut für Normung e.V standards are available in both English and German editions from Beuth Verlag GmbH, Burggrafenstrasse
6, 10787 Berlin, Germany, Telephone: 49.30.2601.0, Fax: 49.30.2601.1263, Website:
www.beuth.de.
9 China Electronic Standardization Institute, Beijing, China
SEMI M44-0305 © SEMI 2001, 2005 3
6.3 Irrespective of the calibration factor, to convert oxygen density (atoms/cm
3
) to oxygen concentration (ppma),
within the same calibration factor, divide the oxygen density value by the factor 5 10
16
(atoms·cm
–3
·ppma
–1
), and
to convert oxygen concentration (ppma) to oxygen density (atoms/cm
3
), within the same calibration factor, multiply
the concentration value by the same factor.
Table 1 Calibration Factors
Calibration Factor Cited in Standard(s) or
Publication
Value to Obtain Oxygen
Content in ppma
Value to Obtain Oxygen
Content in atoms/cm
3
New ASTM ASTM F 121, 1980-1983;
DIN 50438/1, 1978
4.90
2.45 10
17
“JEIDA Coefficient (Original)” Cited in Iizuka et al., see
Footnote 6
6.06
3.03 10
17
Guo Biao (Old Edition) Cited in Baghdadi et al., see
Footnotes 1 and 2.
6.20 3.10 × 10
17
IOC-88
SEMI MF1188;
DIN 50438, 1994 and 1995;
JEITA EM3504;
Guo Biao GB/T 1557-1989
6.28
3.14 10
17
Old ASTM ASTM F 121, 1970-1979 9.63
4.815 10
17
Table 2 Conversion Factors
To: →
Convert From: ↓
New ASTM
#1
“JEIDA
Coefficient
(Original)”
#2
Guo Biao
(Original)
#3
IOC-88
#4
Old ASTM
#5
New ASTM
#1
1 1.237 1.265 1.282 1.965
“JEIDA Coefficient (Original)”
#2
0.809 1 1.023 1.036 1.589
Guo Biao (Old Edition)
#3
0.790 0.977 1 1.013 1.553
IOC-88
#4
0.780 0.965 0.987 1 1.533
Old ASTM
#5
0.509 0.629 0.644 0.652 1
#1
Cited in all editions of ASTM F 121 from 1980 through 1983 (replaced by ASTM F 1188, now SEMI MF1188, in 1988) and in the 1978
edition of DIN 50438, Part 1.
#2
Reported in T. Iizuka et al., Reference 6.
#3
Old edition; cited in Baghdadi et al., see footnotes 1 and 2. Since revised to cite IOC-88.
#4
See footnotes 1 and 2. Cited in all editions of SEMI MF1188, the 1994 and 1995 editions of DIN 50438, Part 1, all editions of JEITA EM-
3504 (and its predecessor JEIDA 16), and the 1989 edition of GB/T 1557.
#5
Cited in all editions of ASTM F 121 from 1970 to 1979.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
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standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
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consent of SEMI.
SEMI M45-0703 © SEMI 2001, 2003 1
SEMI M45-0703
PROVISIONAL SPECIFICATION FOR 300 mm WAFER SHIPPING
SYSTEM
This provisional specification was technically approved by the Global Silicon Wafer Committee and is the
direct responsibility of the European Silicon Wafer Committee. Current edition approved by the European
Regional Standards Committee on April 3, 2003. Initially available at www.semi.org June 2003; to be
published July 2003. Originally published March 2001.
1 Purpose
1.1 This standard stipulates transport related materials
and systems to minimize the total cost relating to
transport of 300 mm wafers from the wafer supplier to
the customer.
2 Scope
2.1 This standard stipulates materials relating to
transport of 300 mm wafers using Shipping Boxes
(FOSB) regulated by SEMI M31, and includes wafer
shipping boxes, bags, labels, cushions, secondary
containers, pallets, and shipping documentation.
NOTE 1: This standard is provisional because some technical
issues are not implemented. Once these issues are addressed,
this standard should be modified and upgraded from
provisional status.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI M31 — Provisional Mechanical Specifications
for Front-Opening Shipping Box Used to Transport and
Ship 300 mm Wafers
SEMI T3 — Specification for Wafer Box Labels
3.2 ANSI Standards
ASNI/EAI-556-B — Outer Shipping Container Label
Standard
1
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
1 American National Standards Institute, Headquarters: 1819 L
Street, NW, Washington, DC 20036, USA. Telephone: 202.293.8020;
Fax: 202.293.9287, New York Office: 11 West 42nd Street, New
York, NY 10036, USA. Telephone: 212.642.4900; Fax:
212.398.0023, Website: www.ansi.org
4 Terminology
4.1 Definitions
4.1.1 bag — a package used for sealing the outside of
the wafer shipping box. Typically two or three types of
different plastic film and aluminum film are laminated,
and these are usually heat-sealed.
4.1.2 cushions — materials placed between the wafer
shipping box and secondary container in order to absorb
shock during shipping and to stabilize the wafer
shipping box within the secondary container.
4.1.3 label — the label on the wafer shipping box or
items such as bags identifying the product and its
manufacturer.
4.1.4 pallet — a flat container used for collecting and
holding a suitable amount of secondary containers that
hold wafers, to make handling with forklifts easier.
4.1.5 recycle — to use an already used item for some
other useful purpose.
4.1.6 reuse — to repeat use of an item in its original
shape for the same purpose as initially intended.
4.1.7 secondary container — the outermost box of the
smallest transport unit. Typically cardboard boxes or
similar boxes are used.
4.1.8 shipping document — documents required when
shipping.
4.1.9 wafer shipping box — a box that directly holds
the wafers. In this standard, this box is specified by
SEMI M31.
5 Requirements
5.1 Wafer Shipping Box
5.1.1 Wafer shipping boxes that comply with SEMI
M31 must be used.
5.1.2 There are no grounding or ESD requirements for
wafer shipping box.
5.1.3 To make sure raw materials are traceable, the
product number, revision number, and manufacturing
period (year, week) must be displayed on the wafer