semi合集-English.pdf - 第4926页
SEMI M9-0999 © SEMI 1986, 1999 11 Figure 8 Examples of Acceptable and Unacceptable Wafer Edge Profiles NOTICE: T hese standards do n ot purport to address safety issues, if any, ass o ciated with their use. It is the res…
SEMI M9-0999 © SEMI 1986, 1999 10
Figure 6
Flat Diameter on Wafer with Primary Orientation Flat and Secondary Flat
Figure 7
SEMI Wafer Edge Profile Template
Point x y
in.
µ
m
in.
µ
m
A 0.0030 76 0.00 0
B 0.0200 508 0.00 0
C 0.0020 51 (See Note 2) (See Note 2)
D 0.00 0 0.0030 76
NOTE 1: For referee purposes, U.S. customary units are to be used for 2 and 3 in. diameter wafers and SI units otherwise.
NOTE 2: The y-coordinate of point C is 1/3 the nominal wafer thickness.
SEMI M9-0999 © SEMI 1986, 199911
Figure 8
Examples of Acceptable and Unacceptable Wafer Edge Profiles
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI M9.1-96 © SEMI 1984, 19961
SEMI M9.1-96
STANDARD FOR ROUND 50.8 mm POLISHED MONOCRYSTALLINE
GALLIUM ARSENIDE WAFERS FOR ELECTRONIC DEVICE
APPLICATIONS
NOTE: This entire document was rewritten in 1995.
The complete specification for this product includes all general requirements of SEMI M9.
Table 1 Dimension and Tolerance Requirements
Property Dimension Tolerance Units
DIAMETER
A
50.8 ± 0.5 mm
THICKNESS, CENTER POINT 450 ± 25 µm
PRIMARY FLAT LENGTH 16 ± 2 mm
SECONDARY FLAT LENGTH 8 ± 2 mm
A
The diameter standard means that the dimension is centered to this value.
Table 2 Orientation and Flat Location Requirements
Property Requirement
PRIMARY FLAT ORIENTATION
)101( ± 0.5°
A
, under an Arsenic facet. The primary flat shall
be perpendicular to the “V” etch figure
.B
SECONDARY FLAT ORIENTATION 90° ± 5° counterclockwise from the primary flat.
SURFACE ORIENTATION
C
(100) ± 0.5°
A. (See Figure 1 in SEMI M9.)
B. (100) off 2° ± 0.5° toward the (110) plane which is between the
primary and secondary flats (see Figure 3 in SEMI M9.)
ORTHOGONAL MISORIENTATION ± 5° (See Figure 5 in SEMI M9.)
A
See Table 1 in SEMI M9.
B
Using A-B, bromine-methanol, ammonium hydroxide: hydrogen peroxide etch. See Figures 1 and 3 in SEMI M9. Figure 1 also shows the
orientation of the V-groove figures relative to KOH etch pits.
C
The frame of reference is the (100) plane of the crystal. It is the wafer normal that is tilted toward the (110) plane of the crystal.
NOTICE: These standards do not purport to address safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish appropriate safety and health practices and determine the
applicability of regulatory limitations prior to use. SEMI makes no warranties or representations as to the suitability
of the standards set forth herein for any particular application. The determination of the suitability of the standard is
solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are
subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.