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SEMI M8-0703 © SEMI 1984, 2003 5 Item Specification CLASSIFICATION A B C 5.0 Wafer Preparation Characteristics 5.1 Wafer ID Marking Opti onal Optional Unspecified 5.2 Front Surface Thin Films Optional Optional Unspecifie…
SEMI M8-0703 © SEMI 1984, 2003 4
11.15 striations — any helical features conforming to
the definition and visible under diffuse illumination.
12 Certification
12.1 Upon request of the purchaser in the contract or
order, a manufacturer’s or supplier’s certification that
the material was manufactured and tested in accordance
with this specification, together with a report of the test
results, shall be furnished at the time of shipment.
12.2 In the interest of controlling inspection costs, the
supplier and the purchaser may agree that the material
shall be certified as “capable of meeting” certain
requirements. In this context, “capable of meeting”
shall signify that the supplier is not required to perform
the appropriate tests in Section 9. However, if the
purchaser performs the test and the material fails to
meet the requirement, the material may be subject to
rejection.
13 Packing and Marking
13.1 Special packing requirements shall be subject to
agreement between the supplier and the purchaser.
Otherwise, all wafers shall be handled, inspected, and
packed in such a manner as to avoid chipping,
scratches, and contamination, and in accordance with
the best industry practices, to provide ample protection
against damage during shipment.
13.2 The wafers supplied under this specification shall
be identified by appropriately labeling the outside of
each box or other container and each subdivision
thereof in which it may reasonably be expected that the
wafers will be stored prior to further processing.
Table 3 Specifications for Small Diameter Silicon Test Wafers
Item Specification
CLASSIFICATION
A B C
1.0
General Characteristics
1.1 Growth Method User specified
1.2 Crystal Orientation User specified
1.2.1 Crystal Orientation User specified
1.3 Conductivity Type User specified
1.4 Dopant User specified
1.5 Nominal Edge Exclusion Distance for
FQA
Not specified
2.0
Electrical Characteristics
2.1 Resistivity User specified
2.2 Radial Resistivity Variation (RRG) Optional
2.3 Resistivity Striations Unspecified
2.4 Minority Carrier Lifetime Unspecified
3.0
Chemical Characteristics
3.1 Oxygen Concentration Unspecified
3.2 Radial Oxygen Variation Unspecified
3.3 Carbon Concentration Unspecified
4.0
Structural Characteristics
4.1 Dislocation Etch Pit Density None Optional Unspecified
4.2 Slip None Optional Unspecified
4.3 Lineage None Optional Unspecified
4.4 Twins None Optional Unspecified
4.5 Swirl None Optional Unspecified
4.6 Shallow Pits None Optional Unspecified
4.7 OISF Optional Optional Unspecified
4.8 Oxide Precipitates Unspecified
SEMI M8-0703 © SEMI 1984, 2003 5
Item Specification
CLASSIFICATION
A B C
5.0
Wafer Preparation Characteristics
5.1 Wafer ID Marking Optional Optional Unspecified
5.2 Front Surface Thin Films Optional Optional Unspecified
5.3 Denuded Zone Optional Optional Unspecified
5.4 Extrinsic Gettering Optional Optional Unspecified
5.5 Backseal Optional Optional Unspecified
5.6 Annealing Optional Optional Unspecified
6.0
Mechanical Characteristics
6.1 Diameter
2.00 inch ± 0.015 in. 0.020 in. 0.030 in.
3.00 inch ± 0.020 in. 0.025 in. 0.050 in.
100 mm ± 0.20 mm 0.50 mm 1.00 mm
125 mm ± 0.20 mm 0.50 mm 1.00 mm
6.2 Primary Flat Dimension
2.00 inch (flat length) 0.500–0.750 in. 0.500–0.750 in. 0.500–0.750 in.
3.00 inch (flat length) 0.750–1.00 in. 0.750–1.00 in. 0.750–1.00 in.
100 mm (flat length) 30–35 mm 28–37 mm 28–37 mm
125 mm (flat length) 40–45 mm 38–47 mm 38–47 mm
6.3 Primary Flat Orientation {110} ± 2°
6.4 Secondary Flat Length Unspecified
6.5 Secondary Flat Location Unspecified
6.6 Edge Profile 5.2 of SEMI M1 Optional
6.7 Thickness
2 inch 0.0095–0.0125 in. 0.0090–0.013 in. 0.0080–0.0130 in.
3 inch 0.0135–0.0165 in. 0.013–0.017 in. 0.012–0.018 in.
100 mm (SEMI M1.5) 505–545 µm 500–550 µm 475–575 µm
100 mm (SEMI M1.6) 605–645 µm 600–650 µm 575–675 µm
125 mm 605–645 µm 600–650 µm 575–675 µm
6.8 Thickness Variation (TTV) Unspecified
6.9 Surface Orientation User specified Optional Unspecified
6.10 Bow Unspecified
6.11 Warp Unspecified
6.12 Sori Unspecified
6.13 Flatness/Global Unspecified
6.14 Flatness/Site Unspecified
7.0
Front Surface Chemistry
7.1 Surface Metal Contamination
Sodium Optional Unspecified Unspecified
Aluminum Optional Unspecified Unspecified
Potassium Optional Unspecified Unspecified
Chromium Optional Unspecified Unspecified
Iron Optional Unspecified Unspecified
Nickel Optional Unspecified Unspecified
Copper Optional Unspecified Unspecified
SEMI M8-0703 © SEMI 1984, 2003 6
Item Specification
CLASSIFICATION
A B C
Zinc Optional Unspecified Unspecified
7.2 Surface Organics Optional Unspecified Unspecified
8.0
Front Surface Visual Characteristics
8.1 Scratches (# of) Unspecified
(cumulative length) R/5 R/2 Unspecified
8.2 Pits None Unspecified
8.3 Haze None Unspecified
8.4 Localized Light Scatterers
(Density per square meter with 4 mm edge exclusion)
2 inch
≤1900 ≤5000
Unspecified
3 inch
≤1900 ≤5000
Unspecified
100 mm
≤1900 ≤5000
Unspecified
125 mm
≤1900 ≤5000
Unspecified
8.5 Contamination/area None Unspecified
8.6 Edge Chips None Unspecified
8.7 Edge Cracks None Unspecified
8.8 Cracks, Crow's feet None Unspecified
8.9 Craters None Unspecified
8.10 Dimples None Unspecified
8.11 Grooves None Unspecified
8.12 Mounds None Unspecified
8.13 Orange Peel None Unspecified
8.14 Saw Marks None Unspecified
8.15 Dopant Striation Rings None Unspecified
8.16 Stains None Unspecified
9.0
Back Surface Characteristics
9.1 Edge Chips None Unspecified
9.2 Cracks, Crow's feet None Unspecified
9.3 Contamination/Area None Unspecified
9.4 Saw Marks None Unspecified
9.5 Stains None Unspecified
9.6 Roughness Unspecified
9.7 Brightness (gloss) Unspecified
TBD
(NOTE 1)
Back Surface Finish Unspecified
NOTE 1: A revision to SEMI M18 to provide this item number is being developed. When this revision is completed, this specification will be
revised to include the assigned item number from SEMI M18.