semi合集-English.pdf - 第6232页

SEMI G46-88 © SEMI 1988 9 V = 5.0 v T = 400 m s I = 1.0 mA t = 2 0 CU = 249 mV/A σ = 53. 5 mV/A CU = 302. 5 m V/A H H M MD cu hig h lim it Figure 8 CU bar graph shows th er mal dis tribution of 50 dev ices when test ed a…

SEMI G46-88 © SEMI 1988 8

Figure 7

K Factor Calibration Setup and Procedure

SEMI G46-88 © SEMI 19889

V = 5.0 v

T = 400 ms

I = 1.0 mA

t = 20

CU = 249 mV/A

= 53.5 mV/A

CU = 302.5 mV/A

high

limit

Figure 8

CU bar graph shows thermal distribution of 50 devices when tested at a heating time of 400 ms. (Note: CU data

rounded off to nearest m V/A.)

General Description Steps Comments

A Initial Setup 1 thru 4 Approximate instrument settings to find variations among devices in 10 to 15

piece sample.

B Heating Curve Generation 5 thru 7 Using highest and lowest reading devices, generate Heating Curves.

C Heating Curve Interpretation 8 thru 10 Heating Curve is used to find more appropriate value for t

corresponding to heat

in the die attachment are (or some other desired interface in the heat flow path).

D Final Setup 11 Heating Power applied during t

is increased in order to improve measurement

sensitivity to variations among devices.

E Pass/F Determination 12 thru 13 A variety of methods is available for setting the fail limit; the statistical approach

is the fastest and easiest to implement.

Figure 9 — Summary table of steps required to implement thermal transient testing for IC die attachment

evaluation.

SEMI G46-88 © SEMI 1988 10

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any item

mentioned in this standard. Users of this standard are

expressly advised that determination of any such patent

rights or copyrights, and the risk of infringement of such

rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.