semi合集-English.pdf - 第7618页
NOTICE: SEMI makes no warranties or represen tations as to the suitability o f the standards set forth herein for any particular application. The determination of the suitability of the standard is solely the responsibil…
Figure A1-1
Relationship Between the Maximum Size Matrix Code Symbol, Alphanumeric Fields, and the Edges of the
Polished Front Surface of Minimum Size Wafers
SEMI T2-0298 © SEMI 1993, 2004 8
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
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respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI T2-0298 © SEMI 1993, 2004 9
SEMI T3-0302 © SEMI 1995, 2002 1
SEMI T3-0302
SPECIFICATION FOR WAFER BOX LABELS
This specification was technically approved by the Global Traceability Committee and is the direct
responsibility of the North American Traceability Committee. Current edition approved by the North
American Regional Standards Committee on November 27, 2001. Initially available at www.semi.org
February 2002; to be published March 2002.
NOTE: This document was entirely rewritten for
publication in 2002.
1 Purpose
1.1 This specification provides a common format,
content, size, and location for printed, machine-
readable labels on wafer boxes to facilitate
communication of data essential for advanced
traceability and electronic data exchange systems.
These labels differ from those used in common
commercial practice in that they provide less detailed
information about parametric properties of the wafer.
Such information is now readily stored in advanced
traceability systems.
1.2 This specification covers labels that contain two
bar code symbols and their associated human-readable
interpretation.
1.3 This specification also covers a two-dimensional
Data Matrix code symbol that can accommodate
substantially more information than can the bar code
symbols. This symbol is included to provide for a
smooth transition from existing traceability and labeling
procedures to the comprehensive, unified system
envisioned for the future in which common reading
equipment can be used throughout the plant. If the
Data Matrix symbol is used without the bar code
symbols, provision is made for an associated human
readable interpretation.
1.4 Labels provided in accordance with this specifi
-
cation satisfy the special requirements of 300 mm
Wafer Shipping Systems, detailed in SEMI M45, for
both front opening shipping box (FOSB) labels and bag
labels.
2 Scope
2.1 This specification covers size, message content and
symbology requirements of labels for wafer boxes used
for storage and transport of silicon wafers 100 mm in
diameter and larger.
2.2 For wafer boxes used with 100 to 200 mm diameter
wafers, this specification provides for two similar labels
in order that the contents of the wafer box can be
identified when the wafer box is stored in either of two
positions: with the side of the wafer box parallel with
the front of the storage shelf or with the end of the
wafer box parallel with the front of the storage shelf.
Because wafer boxes are routinely stacked for storage,
placement of box labels on the top or bottom of the box
is not recommended.
2.3 For FOSBs used with 300 mm wafers, this
specification provides for two identical labels, one to be
placed on the FOSB and the other to be placed on the
outer bag. These requirements are consistent with the
requirements of SEMI M45. SEMI M31 specifies
FOSB dimensions.
2.4 The message content and locations of the symbols
used on the labels covered by this specification are
designed to fit in a space consistent with size of the
available flat area on wafer boxes investigated. If a
larger flat area is available on the wafer boxes to be
used, the label size may be increased and additional
message content included.
2.5 This specification includes descriptions of the
characteristics of the code formats to be employed.
2.6 The labels covered by this specification may be
applied on the box itself, and on the box wrap portion
of the wafer package, but not on the transport package
(outer shipping carton) used for commercial
transportation of wafer packages.
NOTE 1: Specifications for transaction labels, which are
intended for use on the outer shipping carton, are given in
ANSI/EIA 556-B.
2.6.1 The format of the barcode is based on Code 39,
as specified in ISO/IEC 16388.
2.6.2 The format of the Data Matrix Code is specified
in ISO/IEC 16022.
2.7 Wafer box labels are intended to be applied in a
cleanroom environment concurrent with the completion
of production of the wafers. Although it is recognized
that the materials of construction and the adhesives
used to apply the label must be selected with this use in
mind, their specification is beyond the scope of this
document.
2.8 The dimensions in this specification are applicable
to labels printed with printers that have nominal
resolution of 203 dots per inch (dpi). Printers with
higher resolution may be used, but many of the
dimensions may differ from those in this specification
and the code fields may or may not fit within the
specified label size and format. In such cases, the user