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SEMI M58-0704 © SEMI 2004 1 SEMI M58-0704 TEST METHOD FOR EVALUAT ING DMA BASED PARTICLE DEPOSITION SYSTEMS AND PROCESSES This test method was technically approved by th e Global Silicon Wafer Committee and is the direct…
SEMI M57-0705 © SEMI 2004, 2005 11
supplier is not required to perform the appropriate tests in §7. However, if the customer performs the test and the
material fails to meet the requirement, the material may be subject to rejection.
10 Product Labeling
10.1 The wafers supplied under these specifications shall be identified by appropriately labeling the outside of each
box or other container and each subdivision thereof in which it may reasonably be expected that the wafers will be
stored prior to further processing. Identification shall include as a minimum the nominal diameter, conductivity
type, dopant, orientation, resistivity range, and lot number. The lot number, either (1) assigned by the original
manufacturer of the wafers, or (2) assigned subsequent to wafer manufacture but providing reference to the original
lot number, shall provide easy access to information concerning the fabrication history of the particular wafers in
that lot. Such information shall be retained on file at the manufacturer’s facility for at least one month after that
particular lot has been accepted by the customer.
10.2 Alternatively, if agreed upon between supplier and customer, one of the box labeling schemes in SEMI T3
shall be used and the information listed in ¶10.1 that is not included on the label shall be retained in the supplier’s
data base for at least one month after that particular lot has been accepted by the customer.
10.3 Wafers of 300 mm diameter shall be shipped in packages labeled in accordance with SEMI M45.
11 Packing and Shipping Container Labeling
11.1 Special packing requirements shall be subject to agreement between the supplier and customer. Otherwise, all
wafers shall be handled, inspected, and packed in such a manner as to avoid chipping, scratches, and contamination
and in accordance with the best industry practices to provide ample protection against damage during shipment.
11.2 Wafers of 300 mm diameter shall be shipped in accordance with SEMI M45.
11.3 Unless otherwise indicated in the purchase order, all outside wafer shipping containers shall be labeled in
accordance with ANSI/EIA 556-B.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI M58-0704 © SEMI 2004 1
SEMI M58-0704
TEST METHOD FOR EVALUATING DMA BASED PARTICLE
DEPOSITION SYSTEMS AND PROCESSES
This test method was technically approved by the Global Silicon Wafer Committee and is the direct
responsibility of the North American Silicon Wafer Committee. Current edition approved by the North
American Regional Standards Committee on April 22, 2004. Initially available at www.semi.org May 2004;
to be published July 2004.
1 Purpose
1.1 SEMI M52 requires the use of certified reference
materials (CRMs) for calibration of scanning surface
inspection systems (SSISs). The calibration method is
defined in SEMI M53. This test method provides the
procedure to determine whether a specific particle
deposition system, using a differential mobility
analyzer (DMA), can produce the required CRMs.
1.2 Both organizations producing depositions internally
for in-house use and companies manufacturing
depositions for sale can apply this test method to ensure
that their particle deposition systems provide
depositions that meet the requirements of SEMI M52.
2 Scope
2.1 This test method covers determination of the
deposition peak diameter and the associated expanded
relative combined peak diameter uncertainty produced
by a particle deposition system and its associated
deposition procedures for comparison to the 3%
requirement of SEMI M52.
2.2 This test method also covers determination of the
ability of the deposition system to produce depositions
with diameter distributions that are less than 5% full
width at half maximum (FWHM) as required by SEMI
M52 even when using a particle source with a much
wider distribution.
2.3 These tests require that the deposition system
employ a DMA (or an equivalent programmable
filtering system) to accomplish both peak diameter
determination and narrowing of particle source
distributions (see Related Information 1).
2.4 This test method covers determination of
repeatability over a period of one week. Tests can be
repeated periodically to determine long term stability.
Long term stability of most DMA-based particle
deposition systems is believed to be on the order of a
year or more, but it is recommended that the tests be
repeated on an annual basis or whenever the instrument
appears to be out of control.
2.5 This test method requires the use of three different
kinds of particle distributions with specified
characteristics and wafers that have surface
characteristics adequate to allow detection of the
smallest particles utilized with a capture rate of greater
than 95%.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 This test method is limited to use of depositions of
PSL spheres, even though the deposition system under
test may be capable of depositing particles of other
materials.
3.2 When used to make a deposition from a suspension
of PSL spheres that does not have an observable
certified peak diameter (or if the deposition is made at a
size away from the peak of the distribution in the
suspension), the uncertainty with which the deposition
system evaluates a peak deposition diameter includes
bias information determined from measurements on a
known standard or standards with extremely narrow
distributions. At the time when this test method was
developed, only one such standard existed. Therefore if
the bias contribution to uncertainty is a function of the
peak diameter in the suspension, the determination may
be in error at peak diameters away from that of the
known standard.
3.3 There is the possibility that the deposited particle
diameter may differ slightly from the certified value for
the bottle containing the suspension because the
surfactant in the suspension and contaminants in the
water may cause an increase in particle size. This
limitation can be avoided by using DMAs with the
same spray system, the same purity of dilution water,
and the same suspension concentration both to size the
particles in the bottle and make the deposition. This
possibility may be minimized by using PSL suspension
fluids with low non-volatile content to reduce the
possibility of non-volatile materials drying onto the
particles in the suspension.
SEMI M58-0704 © SEMI 2004 2
4 Referenced Standards
4.1 SEMI Standards
SEMI M50 — Test Method for Determining Capture
Rate for Surface Scanning Inspection Systems by the
Overlay Method
SEMI M52 — Guide for Specifying Scanning Surface
Inspection Systems for Silicon Wafers for the 130-nm
Technology Generation
SEMI M53 — Practice for Calibrating Scanning
Surface Inspection Systems using Depositions of Mon-
odisperse Polystyrene Latex Sphere on Unpatterned
Semiconductor Wafer Surfaces
SEMI MF1241 — Terminology of Silicon Technology
4.2 ISO Standard
1
ISO 14644-1 Cleanrooms and associated controlled
environments — Part 1: Classification of airborne
particulates
NOTICE: As listed or revised, all documents cited
shall be the latest publications of adopted standards.
5 Terminology
5.1 Definitions for terms related to surface scanning in-
spection systems are found in SEMI M50, SEMI M52,
and SEMI M53.
5.2 Additional terminology related to silicon wafer
technology is defined in SEMI MF1241.
6 Summary of Method
6.1 Three bottles (A, B and C) of PSL sphere
suspensions meeting specific requirements are obtained.
Bottle A is a CRM with a certified peak diameter and a
very narrow diameter distribution so that no matter how
the deposition system functions, the deposition will
meet the requirements of SEMI M52. Bottles B
(smaller diameters) and C (larger diameters) have much
wider distributions and there are no restrictions on peak
diameter accuracy.
6.2 Over a five day period, spot depositions of the same
number of each of the three PSL sphere sizes are made
each morning on one or more wafers and a final scan
check of the diameter of spheres in Bottle A is made
late in the day.
1 International Organization for Standardization, ISO Central
Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,
Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30
Website:
www.iso.ch
; also available in the US from American
National Standards Institute, New York Office: 11 West 42nd Street,
New York, NY 10036, USA. Telephone: 212.642.4900; Fax:
212.398.0023 Website:
www.ansi.org, and in other countries from
ISO member organizations.
6.3 The deposited diameters from each bottle, as
determined by the deposition system, are recorded on a
data sheet.
6.4 At the end of the week the spot depositions are
scanned with an SSIS to obtain a histogram for each
spot deposition. The FWHM values are obtained from
these histograms and recorded. The peak diameter
values and particle counts found from the SSIS may
also be recorded, but these values are not required to
verify the requirements of SEMI M52.
6.5 The results for each bottle are analyzed to determine
if the deposition system has a peak diameter expanded
relative combined standard uncertainty less than 3%
and a deposited FWHM on the wafer of less than 5%,
as required by SEMI M52.
7 Apparatus
7.1 Particle Deposition System
7.1.1 The particle deposition system to be evaluated
must be available in a clean room of class 4 or better as
defined in ISO 14644-1.
7.1.2 The deposition system must have an atomizer
that takes the particles from the liquid suspension to an
air droplet mist.
7.1.3 The particle deposition system must have a DMA
(or an equivalent programmable filtering system) to
accomplish both peak diameter determination and
narrowing of particle source distributions.
7.1.4 The deposition system must have wafer handling
equipment appropriate for the wafers on which the
depositions are being made.
7.2 Surface Scanning Inspection System
7.2.1 An SSIS appropriate for use with the wafers used
and the PSL spheres deposited must be capable of
determining the FWHM of each of the depositions
made.
7.2.2 The SSIS does not have to be calibrated in
accordance with SEMI M53 in order to be used in this
test method, but the results obtained when the test
method is performed can give an indication of the
calibration of the SSIS in the size region of the test.
8 Reagents and Materials
8.1 PSL Spheres
8.1.1 Three types of PSL liquid sphere suspensions are
used in this test method.
8.1.1.1 Bottle A is a CRM that contains a suspension of
PSL spheres with a relative expanded peak diameter
uncertainty much less than 3% and a FWHM less than