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SEMI E70-1103 © SEMI 1998, 2003 2 ISO 14644-2 — Cleanrooms and associat ed controlled environm ents Part 2: Specificati ons for test ing and monitoring to prove co ntinued compliance with ISO 14644 -1. NOTICE: Unless oth…
SEMI E70-1103 © SEMI 1998, 2003 1
SEMI E70-1103
GUIDE FOR TOOL ACCOMMODATION PROCESS
This guide was technically approved by the Global Facilities Committee and is the direct responsibility of the
North American Facilities Committee. Current edition approved by the North American Regional Standards
Committee on September 3, 2003. Initially available at www.semi.org September 2003; to be published
November 2003. Originally published June 1998.
1 Purpose
1.1 This document will provide an overview of the
various elements of Tool Accommodation, a
methodology by which semiconductor processing
equipment is installed in a cost-effective and timely
manner. This addition to the SEMI Tool
Accommodation Standards set describes the process by
which the referenced SEMI documents can be
effectively used to achieve tool installation cost and
schedule goals.
2 Scope
2.1 This overview document will provide process
development, facilities, manufacturing, and sales
engineers (as well as purchasing agents and managers)
with a basic understanding of the various elements in a
Tool Accommodation methodology. This process
emphasizes quality, completeness, timeliness, and cost-
effectiveness as key elements of successfully installing
semiconductor processing equipment into wafer
fabrication facilities. By describing a generic process
flow, this document identifies a road map for using
published standards that comprehend all the procedures
involved in tool accommodation from procurement
through acceptance. As a common ground for
communication and comparison, terms and definitions
are also included.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E6 — Guide for Semiconductor Equipment
Installation Documentation
SEMI E10 — Specification for Definition and
Measurement of Equipment Reliability, Availability,
and Maintainability (RAM)
SEMI E45 — Test Method for the Determination of
Inorganic Contamination from Minienvironments Using
Vapor Phase Decomposition-Total Reflection X-Ray
Spectroscopy (VPD-TXRF), VPD-Atomic Absorption
Spectroscopy (VPD-AAS), or VPD/Inductively
Coupled Plasma-Mass Spectrometry (VPD/ICP-MS
SEMI E49 — Guide for Standard Performance,
Practices, and Sub-Assembly for High Purity Piping
Systems and Final Assembly for Semiconductor
Manufacturing Equipment
SEMI E49.1 — Guide for Tool Final Assembly,
Packaging and Delivery
SEMI E49.2 — Guide for High Purity Deionized Water
and Chemical Distribution Systems in Semiconductor
Manufacturing Equipment
SEMI E49.3 — Guide for Ultrahigh Purity Deionized
Water and Chemical Distribution Systems in
Semiconductor Manufacturing Equipment
SEMI E49.4 — Guide for High Purity Solvent
Distribution Systems in Semiconductor Manufacturing
Equipment
SEMI E49.5 — Guide for Ultrahigh Purity Solvent
Distribution Systems in Semiconductor Manufacturing
Equipment
SEMI E49.6 — Guide for Subsystem Assembly and
Testing Procedures - Stainless Steel Systems
SEMI E49.7 — Purity Guide for the Design and
Manufacture of Ultrapure Water and Liquid Chemical
Systems in Semiconductor Process Equipment
SEMI E49.8 — Guide for High Purity and Ultrahigh
Purity Gas Distribution Systems in Semiconductor
Manufacturing Equipment
SEMI E51 — Guide for Typical Facilities Services and
Termination Matrix
SEMI S4 — Safety Guideline for the
Segregation/Separation of Gas Cylinders Contained in
Cabinets
3.2 ISO Standards
1
ISO 14644-1 — Cleanrooms and associated controlled
environments Part 1: Classification of air cleanliness.
1 International Organization for Standardization, ISO Central
Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,
Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30,
Website: www.iso.ch
SEMI E70-1103 © SEMI 1998, 2003 2
ISO 14644-2 — Cleanrooms and associated controlled environments Part 2: Specifications for testing and
monitoring to prove continued compliance with ISO 14644-1.
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Summary of Referenced Standards
4.1 SEMI E6 — Guide for Semiconductor Equipment Installation Documentation
4.1.1 Purpose of SEMI E6 is to communicate from supplier to user the facilities requirements of semiconductor
equipment.
4.1.2 Benefits of SEMI E6 include assurance of effective communication of process tool installation requirements.
4.1.3 Roles and Responsibilities for SEMI E6 — Tool supplier submits information requested in SEMI E6, facilities
interface specification. Equipment engineer, facilities engineer, and installation manager use tool requirements
information provided by supplier to prepare facility and efficiently install the tool.
Table 1 SEMI Tool Accommodation Standards
Facility
Services
Process
Tool
Process Tool Subsystems
(internal distribution system for)
Guideline for
General Water &
Chemical
Solvent Gas
Facility Services Matrix defines utilities
available for tool
SEMI E51
Facilities Interface Specification defines tool
requirements of facilities
SEMI E6
Subsystem terms and references SEMI E49
High purity (HP) subsystem requirements SEMI E49.2 SEMI E49.4 SEMI E49.8
Ultrahigh purity (UHP) subsystem
requirements
SEMI E49.3 SEMI E49.5 SEMI E49.8
Subsystem assembly and testing SEMI E49.7 SEMI E49.6 SEMI E49.6
Tool packaging and delivery SEMI E49.1
4.2 SEMI E49 — Guide for Standard Performance, Practices, and Sub-Assembly for High Purity Piping Systems
and Final Assembly for Semiconductor Manufacturing Equipment
4.2.1 Purpose of SEMI E49 is to specify requirements for process distribution systems located inside of, and
provided with, semiconductor processing tools. (SEMI E49 acts as a reference document for the series of SEMI E49
standards, SEMI E49.1 through SEMI E49.8. See Table 1, SEMI Tool Accommodation Standards for an explanation
of the ten documents included in the SEMI E49 series.)
4.2.2 Benefits of the SEMI E49 series include assurance of compatibility in purity and performance between the
tool and facility distribution systems.
4.2.3 Roles and Responsibilities for SEMI E49 Series — Facilities engineer and installation manager submit
appropriate SEMI E49 requirements, either HP or UHP. Tool supplier uses information provided to ensure
distribution system compatibility.
4.3 SEMI E51 — Guide for Typical Facilities Services and Termination Matrix
4.3.1 Purpose of SEMI E51 is to communicate from customer to supplier factory facilities available at the utility
point of connection (UPOC) for a semiconductor tool.
4.3.2 Benefits of SEMI E51 include assurance of cost-effective and timely tool installation with minimum retrofit to
customer site.
SEMI E70-1103 © SEMI 1998, 2003 3
4.3.3 Roles and Responsibilities for SEMI E51 —
Facilities engineer and installation manager submit
utility specifications requested in SEMI E51 matrixes,
either typical or site-specific. Tool supplier uses
information provided about facility to assist in
configuration of the process tool.
5 Terminology
5.1 Definitions
5.1.1 acceleration cost — additional costs incurred to
complete the project sooner than the original scheduled
baseline plan.
5.1.2 as-built drawings — documentation describing
the actual configuration and dimensions at the end of
construction.
5.1.3 base build — installation of base building,
services, and equipment to establish functional
environmental controls and utilities to support
production equipment installation.
5.1.4 bidding — obtaining sealed quotes for a defined
scope of work.
5.1.5 burdened/unburdened — identification of costs
included or excluded from contractual labor rates.
5.1.6 capital equipment — equipment that is
depreciated according to tax guidelines for durable
goods. Generally has a value greater than $ 1,000.00 and
a useful life greater than 5 years.
5.1.7 change order — a document defining a formal
change in drawings, specifications, and/or scope of
work.
5.1.8 cleanroom — confined area in which the
humidity, temperature, particulate matter, and
contamination are precisely controlled within specified
parameters. Cleanroom classes are defined in
ISO 14644.
5.1.9 conditioned power — electrical power that is
manipulated to maintain specified tolerances.
5.1.10 construction — the set of activities that
transforms plans and specifications into functional
systems capable of performing to specification.
5.1.11 construction consumable — any material used
up during construction.
5.1.12 construction management — the set of activities
that define, direct, monitor, and report construction
activities such as workmanship, adherence to design,
cost, and schedule conformance.
5.1.13 contingency — a reserve of funds, time, and/or
material that is allocated to maintain schedule and
budget. A reserve for scope changes, unforeseen site
conditions, change in material prices, or unanticipated
events.
5.1.14 contract award — notification to the successful
bidder and subsequent signing of contract documents.
5.1.15 contractor — a licensed company hired to
accomplish a contractually specified scope of work.
5.1.16 cost of ownership (COO) — the total lifetime
cost associated with acquisition, installation, and
operation of fabrication equipment [SEMI E35].
5.1.17 cycle time, gross installation — total time to
install and commission process equipment, typically
starting from dock date to release for vendor startup.
5.1.18 cycle time, net installation — actual time
devoted to construction activities related to tool hookup
from dock date to ready for inspection.
5.1.19 damage — destruction or unintentional
alteration resulting in a liability.
5.1.20 dedicated truck — exclusive drayage of a
shipment.
5.1.21 design build — a contract method whereby the
contractor assumes responsibility for design generation
and construction to accomplish a specified performance
criteria.
5.1.22 design start — a milestone event that designates
the initial conversion of equipment specifications and
design concepts into engineering plans and
specifications.
5.1.23 detailing — generation of dimensioned shop
fabrication plans based on process and instrumentation
drawings (P&ID), field surveys, and configuration
verifications.
5.1.24 direct/indirect cost — direct costs are the cost of
anything physically associated with the installation,
removal, or modification of equipment. Indirect costs
cannot be associated with a specific piece of equipment.
Profit, overhead, and administrative costs are typically
considered indirect.
5.1.25 distribution system — the collection of
subsystems and components used in a semiconductor
manufacturing facility to control and deliver process
chemicals from source to point of use for wafer
manufacturing processes.
5.1.26 dock date — the date when the fab equipment,
including all ancillary components, is on-site at the
loading dock.
5.1.27 emergency power — electrical power supplied
by alternate sources or backup systems, like generators