semi合集-English.pdf - 第3340页

SEMI E130-1104 © SEMI 2003, 2004 54 RELATED INFORMATION 2 NOTICE : This related information is not an official part of SEMI E130 and was de rived from the work of the originating task force. This relate d info rmation wa…

100%1 / 7923
SEMI E130-1104 © SEMI 2003, 2004 53
Pre-Align Chuck
PJ02
PJ01
SubstPJ01.01
SubstPJ01.02
AUX Tray
Pre-Align Chuck
PJ02
PJ01
SubstPJ01.03SubstPJ02.01
AUX Tray
Pre-Align Chuck
PJ02
PJ01
SubstPJ02.01
SubstPJ02.02
AUX Tray
Pre-Align Chuck
PJ02
PJ01
SubstPJ02.02
SubstPJ02.03
AUX Tray
Pre-Align Chuck
PJ02
PJ01
SubstPJ02.03
AUX Tray
Pre-Align Chuck
PJ02
PJ01
AUX Tray
Pre-Align Chuck
PJ02
PJ01
SubstPJ01.01
AUX Tray
Pre-Align Chuck
PJ02
PJ01
AUX Tray
Pre-Align Chuck
PJ02
PJ01
SubstPJ01.01
SubstPJ01.02
AUX Tray
SubstPJ01.03
SubstPJ01.01
Inspection
1
2
3
56
AT SOURCE
4
8
7
9
AT WORK
AT DESTINATION
10
11
NEEDS PROCESSING
IN PROCESS
PROCESSING COMPLETE
C
PROCESSED
ABORTED
STOPPED
12
Sub s tPJ0 1. 01
?
External
Inspection
Equipment
Figure R1-28
Off-Board Inspection Scenario
SEMI E130-1104 © SEMI 2003, 2004 54
RELATED INFORMATION 2
NOTICE: This related information is not an official part of SEMI E130 and was derived from the work of the
originating task force. This related information was approved for publication by full letter ballot procedures on
September 3, 2003.
R2-1 Application for Self-Indexing Probing
R2-1.1 Following ideas for implementation of specific integrations are not a part of this specification but
applications for some regency solution to maximize compliance to this specification.
R2-1.2 Some wafer prober with combined specific IC testers may index dice automatically by itself synchronized
with such communication as GPIB or RS-232C between tester and prober. According state model in this
specification, a series of this automated indexing and testing could be execution of a service task (hatched area in
following diagram).
PROCESS
EXECUTING
PROCESSING
BLOCKED
3
C
16
15
4
5
SUBSTRATE
LOADED
6
8
10
9
11
12
13
2
IDLE
SETTING UP
AWAITING COMMAND
HANDLING MATERIAL
AWAITING LOAD
7
IDLE WITH ALARMS
PROCESSING ACTIVE
17
18
14
1
SERVICE TASK
MOVING XYZ
VERIFYING
SORTING
20
21
AUTOPROBING
19
22
Figure R2-1
Self-Indexing State Model
R2-1.2.1 For the other application to distinguish this normal probing task from such generic service tasks as
Cleaning Probes, adding substate “AUTOPROBING” in the state of “PROCESS” is one of ideas as an extension of
this specification. The diagram above illustrates the extension (cross-hatched substate) of a part of the state model
in this specification. This extension also eliminates loading/unloading remote commands and related states, and is
more close to processing state in SEMI E91 (PSEM).
R2-1.2.2
Above diagram illustrates the extension (cross-hatched substate) of a part of the state model in this
specification. Clarification of extended sub-states and transitions are given below.
R2-1.3 AUTOPROBING — Automatic processing state without instruction of host. Programmed such service
operations as inking cleaning are included in this states as well as probing sequence with automated self indexing
dice. Usually prober communicates with tester through serial or parallel cable in this state.
R2-1.4 VERIFYING — One of substates of AUTOPROBING. This states starts before loading the first wafer of PJ
and concludes when all set-up conditions and all alignments for the first wafer of PJ including needle-pad alignment
for the first dice on the first wafer is completed.
R2-1.5 SORTING — One of substates of AUTOPROBING. Prober executes processing automatically without
specific host instruction. The prober needs thecapability to index to the right dice by itself, communicate with the
tester, and execute programmed sequences including such service operation as cleaning and inking.
SEMI E130-1104 © SEMI 2003, 2004 55
Table R2-1 Self-Indexing State Transition Table
#. Current State Trigger New State Action Comment
19 IDLE A process job has been
dispatched.
VERIFYING Actions taken
correspond to
preconditioning
activities within the E40
Process Job including
loading the first wafer.
Check all alignment and
set-up conditions.
A part of verification may
be done by human operator.
Some prompt, usually
sound and/or light, to
instruct human verification
may be expected when
such operation is required.
20 VERIFYING All required alignment
for the first wafer of the
PJ is completed
including verification of
needle-pad alignment
for the first dice.
SORTING Start automated process.
21 SORTING Such processing
condition as recipe
parameter is updated.
VERIFYING Check all alignment and
set-up conditions.
An optional transition.
Same as transition 19.
22 SORTING The PJ is completed and
all materials of the PJ is
restored in carriers.
IDLE There are no active process
jobs at this time.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.