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SEMI E130-1104 © SEMI 2003, 2004 19 Variable Name Data Type Size Description Comments MinXStep Float 4 The minim um step size in m icrons in the X direction. MinYStep Float 4 The minim um step size in m icrons in the Y d…

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SEMI E130-1104 © SEMI 2003, 2004 18
1) Equipment offsets that match the performance of several pieces of equipment that would otherwise perform
differently due to inherent manufacturing differences. Examples are home values and motion axis scaling
factors.
2) Setting the configuration of the equipment to allow for different material specifications, equipment options,
material flows, frequency of automatic functions, etc.
3) Managing optional machine features. Examples are constants that tell the system whether optional substrate ID
readers are present and control the configuration and function of these optional subsystems when they are
present.
20.3.2 Status Variables are valid at all times. A status variable may not be changed by the host but may be
changed by the equipment or operator. The value of the status variables may be queried by the host at anytime using
the “Selected Equipment Status Request” remote command (See SEMI E30). Data variables are variables that are
valid only upon the occurrence of specific collection events. An attempt to read a data variable at the wrong time
will not generate an error, but the data reported may not have relevant meaning.
20.3.3 Data Types and Sizes
Table 5 Data Types and Sizes
Type Size Definition
String 0–32767 A string of ASCII characters from zero to “Size” characters in length.
Integer 1,2,4 An integer value that may be represented by “Size” bytes. E.g. If size=2 then the value may be
–32768 to 32767.
Float 4 IEEE single-precision 32-bit floating point type [IEEE 754-1985]
Boolean 1 True or False
Table 6 Composite Data Types
Data Type Definition Comments
DieCoordinate Structure composed of:
XCoordinate
YCoordinate
Structured data used to specify die locations on a substrate
XCoordinate Integer Coordinate in the X direction (column)
YCoordinate Integer Coordinate in the Y direction (row)
20.4 Data Item Variable Table
Table 7 Data Item Variable Table
Variable Name Data Type Size Description Comments
ContactCount Integer 2 The number of times the probe card has come
in contact with a substrate.
This value is reset when the host issues
the SET-PROBE-CARD-ID or RESET-
CONTACT-CNT remote commands.
This data item must be available for the
host to query at all times.
DieXCoordinate Integer 2 The coordinate of the die in the x direction
(column).
Any event associated with the movement
of the chuck requires this variable.
DieYCoordinate Integer 2 The coordinate of the die in the y direction
(row).
Any event associated with the movement
of the chuck requires this variable.
DieZPosition Float 4 The position of the Chuck Z-axis in microns. A
user/supplier defined unit of measure other than
microns is permissible and must be
documented.
Any event associated with the movement
of the chuck requires this variable.
DieZCoordinate Integer 2 The coordinate of the die in the z direction. 0:DOWN, 1:UP
InspectionResult Boolean 1 Result of the last inspection. True:PASS, False:FAIL
SEMI E130-1104 © SEMI 2003, 2004 19
Variable Name Data Type Size Description Comments
MinXStep Float 4 The minimum step size in microns in the X
direction.
MinYStep Float 4 The minimum step size in microns in the Y
direction.
MinZStep Float 4 The minimum step size in microns in the Z
direction (Alternative user-defined unit of
measure may be specified for the Z motion).
ProbeCardId String 25 The ID of the Probe Card
TaskID String 50 The ID of the service task being performed. Must be available when a Service Task is
being performed.
21 Recipe Management
21.1 PSEM300 does not attempt to specify how recipes are stored on the equipment or the internal structure of a
recipe. Recipe parameters must be available for query by the host. The equipment must support process tuning as
defined in SEMI E40.
21.2 Recipe Setup Parameters contains the minimum set of recipe attributes required by PSEM300. It is expected
that additional parameters will be used to reflect the capabilities of the specific equipment configuration and
technologies available for use.
21.3 Recipes and Process Programs
21.3.1 Recipes and Process Programs are considered to be the same in this document. The recipe of the prober
consists of the main recipe with optional service recipes referenced within the main recipe.
21.4 Recipe Requirements
21.4.1 The PSEM300 requires that the GEM capability of recipe management be fully supported for this class of
equipment. The Process Job specifies the recipe to be executed.
Table 8 Recipe Setup Parameters
Tag Data Type Size Description Unit
ProdId String 50 Product name (i.e., Device type) -
WaferSize Integer 2 Wafer size millimeters
DeviceSizeX Float 4 Die size X microns
DeviceSizeY Float 4 Die size Y microns
MatrixSizeX Float 4 Matrix size X. For non-matrix substrates, this attribute is equal to
StepSizeX.
microns
MatrixSizeY Float 4 Matrix size Y. For non-matrix substrates, this attribute is equal to
StepSizeY.
microns
MatrixDeviceRows Integer 2 The number of device rows within an expsosure field. For non-
matrix substrates, this attribute = 1. This attribute is dependant
on the Orientation attribute.
-
MatrixDeviceCols Integer 2 The number of device columns within an exposure field. For
non-matrix substrates, this attribute = 1. This attribute is
dependant on the Orientation attribute.
-
StepSizeX Float 4 Step Size X. This attribute is dependant on the Orientation
attribute.
microns
StepSizeY Float 4 Step Size Y. This attribute is dependant on the Orientation
attribute.
microns
ReferenceDeviceX Integer 2 X coordinate of the reference device. This attribute is dependant
on the Orientation attribute.
Column
SEMI E130-1104 © SEMI 2003, 2004 20
Tag Data Type Size Description Unit
ReferenceDeviceY Integer 2 Y coordinate of the reference device. This attribute is dependant
on the Orientation attribute.
Row
RefDevicePosX Float 4 Offset of the center of the reference device in the X-direction
from the center of the substrate.
microMeters
RefDevicePosY Float 4 Offset of the center of the reference device in the Y-direction
from the center of the substrate.
microMeters
RefDeviceMatrixX Integer 2 X coordinate of the reference device within an exposure field.
For non-matrix substrates, this attribute = 1. This attribute is
dependant on the Orientation attribute.
-
RefDeviceMatrixY Integer 2 Y coordinate of the reference device within an exposure field.
For non-matrix substrates, this attribute = 1. This attribute is
dependant on the Orientation attribute.
-
Overdrive Float 4 Over drive value microns
UseControlMap Boolean 1 Probe locations defined in control map. -
Orientation Integer 2 Fiducial (flat or notch) orientation. Defines the Orientation used
to describe the substrate geometries. The substrate may be loaded
onto the equipment chuck with an orientation established by the
OrientationOnChuck attribute. OrientationOnChuck does not
impact the substrate coordinate references.
Degree
OriginLocation Integer 2 Reference Quadrant: 0 = Center, 1 = Upper Right, 2
= Upper Left 3 = Lower Left (default), 4 = Lower Right
-
OrientationOnChuck Integer 2 Fiducial (flat or notch) orientation of the substrate loaded onto the
chuck. Coordinate references are not impacted by this attribute.
-
FiducialType Integer 2 0 = NOTCH, 1 = FLAT -
UseHotChuck Boolean 1 Flag set to indicate the use of temperature control. -
HotChuckTemperature Integer 2 Hot chuck temperature. This attribute applies when the
“UseHotChuck” attribute is set to TRUE.
Celsius
HotChuckTolerance Integer 2 Hot chuck tolerance. This attribute applies when the
“UseHotChuck” attribute is set to TRUE.
Celsius
Rows Integer 2 The number of rows of devices on the substrate. For a row to be
included, a row must contain at least one complete device.
-
Columns Integer 2 The number of columns of devices on a substrate. For a column
to be included, a column must contain at least one complete.
-
22 Remote Commands
22.1 The purpose of this section is to identify remote commands, command parameters, and valid commands versus
states in the processing state models.
22.2 Requirements
22.2.1 All the remote commands defined by PSEM300 are required.
22.2.2 The GEM remote commands START, STOP, PAUSE, ABORT, RESUME, PP-SELECT and RCP-SELECT
are not used.
22.2.3 The alphanumeric strings defined by PSEM300 for remote commands and command parameters are
required.
22.2.4 If additional remote commands are supported, then the “Remote Command Versus Valid States” matrix must
be generated for these additional commands. Place an “X” in the table for each state in which a given command is
valid.
22.3 Remote Commands Descriptions
22.3.1 CLEAN-PROBES — This command causes the probe cleaning routine to be executed. The recipe will
contain sufficient settings to identify the cleaning processes. If there is more than one cleaning process defined, each