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SEMI E43-0301 © SEMI 1995 , 2001 9 items susceptible to discharges equal to or greater than 100 V HBM. ESD SP10.1 — A utomated Handl ing Equi pment. This document covers t est meth ods for evaluating t he ESD ground inte…

SEMI E43-0301 © SEMI 1995, 2001 8

A) Make sure meter is properly grounded according to manufacturer's

instructions.

B) Scan approximately 2.54 cm along both sides and ends of carrier.

C) Scan approximately 2.54 cm length of carrier and top-center of

wafers with meter.

D) Note high-low values for B) & C).

E) Assure that the operator is properly grounded.

Meter

Field emanating from carrier of charge

semiconductor wafers.

Wafers

Ground Plane

Carrier

Figure 4

Example of a Survey of a Carrier of Semiconductor Wafers

12 Related Documents

NOTE 2: These documents are for information only; in the

case of conflict, this document takes precedence. Also read/be

aware of appendices to this document before use.

12.1 ESD Association Standards

ANSI EOS/ESD S3.1: Ionization. Test methods and

procedures for evaluating and selecting air-ionization

equipment and systems are provided in this standard,

which establishes measurement techniques to determine

ion balance and charge-neutralization time for ionizers.

ESD STM4.2: Worksurfaces — Charge Dissipation

Characteristics. This standard test method prescribes a

procedure for measuring the electrostatic-charge-

dissipation characteristics or work surfaces used for

ESD control.

1 ESD Association, 7900 Turin Rd., Bldg. 3, Suite 2, Rome, NY

13440-2069, website: www.esda.org

ESD STM5.1: ESD Sensitivity Testing — Human Body

Model. This standard test methods defines procedures

for testing, evaluating, and classifying the ESD

sensitivity of components to the defined Human Body

Model (HBM).

ESD S5.2: ESD Sensitivity Testing — Machine Model.

This standard established a test procedure for

evaluating the ESD sensitivity of components to a

defined Machine Model, and outlines a system whereby

the sensitivity of such components may be classified.

ESD STM5.3.1: ESD Sensitivity Testing — Charged

Device Model. This standard is a test method for

evaluating active and passive components’ ESD

sensitivity to a defined Charged Device Model.

ANSI/ESD S20.20: ESD Control Program. This

standard specifies the requirements that must be

satisfied in designing, establishing, implementing, and

maintaining ESD control programs for ESD-sensitive

SEMI E43-0301 © SEMI 1995, 20019

items susceptible to discharges equal to or greater than

100 V HBM.

ESD SP10.1 — Automated Handling Equipment. This

document covers test methods for evaluating the ESD

ground integrity of automated handling equipment as

well as charge generation, and charge accumulation on

devices in automated handling equipment.

12.2 ESD Association Advisory Documents

ESD ADV1.0 — Glossary of Terms. Definitions and

explanations of various terms used in Association

Standards and documents are covered in this advisory.

It also includes other terms commonly used in the ESD

industry.

ESD ADV2.0 — ESD Handbook. The ESD Handbook is

a complete guide to static control in the work place.

Nineteen chapters cover ESD basics, control

procedures, auditing, symbols, device testing, and

standards.

ESD ADV11.2 — Triboelectric Charge Accumulation

Testing. The complex phenomenon of triboelectric

charging is discussed in this Advisory. It covers the

theory and effects of tribocharging. It reviews

procedures and problems associated with various test

methods that are often used to evaluate

triboelectrification characteristics.

12.3 Other Related Documents

12.3.1 Military Standards

MIL-STD-1686C: ESD Control Program for Protection

of Electrical and Electronic Parts, Assemblies and

Equipment (Excluding Electrically Initiated Devices).

This military standard establishes requirements for ESD

control programs. It applies to U.S. military agencies,

contractors, subcontractors, suppliers, and vendors. It

requires the establishment, implementation, and

documentation of ESD control programs for static-

sensitive devices but does not mandate or preclude the

use of any specific ESD control materials, products, or

procedures.

MIL-HDBK-263B: ESD Control Handbook for

Protection of Electrical and Electronic Parts,

Assemblies and Equipment (excluding Electrically

Initiated Explosive Devices). This reference provides

guidance, but not mandatory requirements, for the

establishment and implementation of an ESD control

program in accordance with the requirements of MIL-

STD-1686.

2 Naval Publication and Forms Center, 5801 Tabor Avenue,

Philadelphia PA 19120 U.S.A

12.3.2 JEDEC Standards

JESD625A: Requirements for Handling ESD-Sensitive

Devices. This voluntary standard establishes minimum

requirements for ESD control methods and materials

designed to protect electronic devices having Human

Body Model (HBM) sensitivities of 200 V or greater. It

is intended for use by semiconductor distributors,

semiconductor processing and testing facilities, and

semiconductor end users.

12.3.3 EIA Standards

EIA 541 – Packaging Material Standards for ESD

Sensitive Items — This standard presents requirements

and tests methods for selecting packaging materials to

be used with ESD sensitive devices.

EIA 583 – Packaging Material Standards for Moisture

Sensitive Items — This standard contains information

regarding packaging materials used for the protection of

ESD sensitive items when moisture levels are also

important.

EN100015: Protection of Electrostatic Sensitive. This

European Norm covers ESD handling practices for

electronic devices.

12.3.4 IEC Standards

IEC 61000-4-2 – Transient Immunity Standard. This

IEC document provides requirements and test methods

for ESD transient immunity.

IEC 61340-5-1:1998, Electrostatics, Part 5-1:

Protection of Electronic Devices from Electrostatic

Phenomena-General Requirements. This IEC

(International Electrotechnical Commission) document

provides guidance for establishing a static control

program.

IEC 61340-5-2:1999, Protection of Electronic Devices

from Electrostatic Phenomena-Users Guide. This IEC

handbook supplement the information contained in Part

5-1 above.

3 Joint Electron Device Engineering Council, 2500 Wilson Blvd.,

Arlington, VA 22201, website: www.jedec.org

4 EIA Engineering Department, Standards Sales Office, 2001 Eye

Street, NW, Washington, D.C. 20006, website: www.eia.org

5 International Electrotechnical Commission, 3, rue de Varembé,

Case postale 131, CH-1211 Genève 20, Switzerland, website:

www.iec.ch

APPENDIX 1

MEASUREMENT SELECTION MATRIX

NOTE: This appendix offers information related to selecting the appropriate measurement methods from those contained in this

document. It was approved as an official part of SEMI E43 by full letter ballot procedure.

A1-1 The matrix contained in Table A1-1 is intended to assist in the selection of an appropriate measurement

method for static charge. Users should note that a variety of measurement methods is available for any given

situation. Consult manufacturers of the equipment for additional information concerning its proper use and

applicability.

Table A1-1 Measurement Method Recommendations

Object Electrostatic

Fieldmeter

Charged Plate

Monitor

Electrostatic

Voltmeter

Electrometer Coulombmeter Oscilloscope EMI

Detector

Small

object/device

charge

XX X

Surface charge X X

Ionization system

charge

neutralization

XXX

ESD event

detection

XXX

Human body

voltage

XXX

Product cart

charge level

XXX

Chair charge level X X X

Charge decay X X X X

Product material

handling

XXX

Ionizer Offset

Voltage (Balance)

Wafer charge X X X

Process

equipment –

Charge and ESD

generation

XXX X

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacture's instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

By publications of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights are entirely their own responsibility.