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SEMI E1.5-91 © SEMI 1984, 2003 1 SEMI E1.5-91 (Reapproved 1102) E STANDARD FOR 150 mm PLASTIC AND METAL WAFER CARRIERS, GENERAL USAGE This standard was technicall y approved by the Global Physical In terfaces and Carrier…

SEMI E1.4-0697 © SEMI 1984, 2002 3
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in
p
art is forbidden without express written
consent of SEMI.

SEMI E1.5-91 © SEMI 1984, 2003 1
SEMI E1.5-91 (Reapproved 1102)
E
STANDARD FOR 150 mm PLASTIC AND METAL WAFER CARRIERS,
GENERAL USAGE
This standard was technically approved by the Global Physical Interfaces and Carriers Committee and is the
direct responsibility of the North American Physical Interfaces and Carriers Committee. Current edition
approved by the North American Physical Interfaces and Carriers Committee on July 21, 2002. Initially
available at www.semi.org October 2002; to be published November 2002. Orignally published in 1984;
previously published February 1999.
E
This document was editorially modified in January 2003 to correct editorial errors that were introduced
into the document in earlier editions. Changes were made to the table header and the last two rows of the
table.
Figure 6
Reference
Overall Dimensions
A1 143.4 mm + 0.64 mm/– 0.5 mm
(5.645 inch + 0.025 inch/– 0.020 inch)
A2 177.80 mm (7.000 inch) maximum
A3 171.40 mm (6.750 inch) maximum
B1 25
B2 4.76 mm ± 0.25 mm (0.1875 inch ± 0.010 inch)
B3 114.30 mm ± 0.025 mm
(4.500 inch ± 0.010 inch)
C1 (C3) + 0.50 mm (0.020 inch) minimum
C2 9.53 mm (0.375 inch) minimum /
12.70 mm (0.500 inch) maximum
C3 1.52 mm ± 0.13 mm (0.060 inch ± 0.005 inch)
for plastic
2.03 mm + 0.00 mm/– 0.50 mm (0.080 inch +
0.000 inch/– 0.020 inch) for metal
C4 153.5 mm ± 1.0 mm (6.043 inch ± 0.040 inch)
C5 156.0 mm ± 0.5 mm (6.142 inch ± 0.020 inch)
C6 134.52 mm ± 0.25 mm (5.296 inch ± 0.010 inch)
C7 3.56 mm + 0.13 mm/– 0.38 mm (0.140 inch +
0.005 inch/– 0.015 inch) diameter by
4.32 mm ± 0.50 mm (0.170 inch ± 0.020 inch)
high
C8 3.96 mm + 0.50 mm/– 0.00 mm (0.156 inch +
0.020 inch/– 0.000 inch) diameter by
5.0 mm (0.197 inch) minimum depth
Figure 6
Reference
Overall Dimensions
C9 10.11 mm ± 0.25 mm (0.398 inch ± 0.010 inch)
D1 14.54 mm ± 0.25 mm (0.572 inch ± 0.010 inch)
D2 4.57 mm (0.18 inch) minimum
D3 1.57 mm ± 0.5 mm (0.062 inch ± 0.020 inch)
D4a 79.76 mm ± 0.50 mm (3.140 inch ± 0.020 inch)
This specification is applicable only to full-depth
wafer carriers, i.e., the wafer sits below the top o
f
the carrier.
D4b On center within ± 3.18 mm (± 0.125 inch)
This specification describes the center point of
the wafer in relationship to the centerline of the
crossbar (for a 150 mm nominal wafer).
D5a 25.40 mm + 0.0 mm/– 0.5 mm
(1.000 inch + 0.000 inch/– 0.020 inch)
D5b 6.35 mm + 0.00 mm/– 0.38 mm
(0.250 inch + 0.000 inch/– 0.020 inch)
D5c 4.45 mm ± 0.75 mm (0.175 inch ± 0.030 inch)
D6 76.2 mm (3.000 inch) minimum
Wafer Tilt 0.64 mm (0.025 inch) maximum
Usage Note: Because of the range of wafer carrier designs and wafer
carrier feature tolerances allowed by this standard, and because of the
range of wafer shapes and tolerances allowed by the wafer
dimensional standards, not every possible SEMI Standards wafer
carrier is compatible with every possible SEMI Standard wafer.
Please verify the compatibility of your specific wafer and carrier with
the respective vendors.

SEMI E1.5-91 © SEMI 1984, 2003 2
Figure 6
150 mm Plastic & Metal Wafer Carrier General Usage
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.