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SEMI G36-88 © SEMI 198 6, 1988 2 8. Molding press to b e used. 9. Electrical power available for heating. 10. A pplicable leadfra me draw ing, including all dimens ions. 5 Dimensions 5.1 Dra w ing must show dimension s f…

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SEMI G36-88 © SEMI 1986, 19881
SEMI G36-88
SPECIFICATION FOR DIMENSIONS AND TOLERANCES USED TO
MANUFACTURE PLASTIC MOLDED HIGH DENSITY TAB QUAD
SEMICONDUCTOR PACKAGE TOOLING
1 Preface
This document is for the ordering of tooling required to
mold and form plastic high density TAB quad
semiconductor packages. It is to be used by packaging
engineers, mold manufacturers, and end-of-line
toolmakers as the basis for defining the limits of
manufacturing tolerances.
2 Applicable Documents
2.1 ANSI Specification
1
Y14.5 — Dimensioning and Tolerancing
2.2 JEDEC Specification
2
Pub No.95 — JEDEC Registered and Standard Outline
and Standard Outline for Semiconductor Devices
2.3 Military Specification
3
MIL-STD-100 — Engineering Drawing Practices
3 Selected Definitions — Pr oduct Criteria
Tolerance Limits
mismatch and offset — defined with respect to package
only. All statements will be equally applicable in two
(2) axes. All mismatch and offset measurements are
made after molding and prior to trimming.
cavity to frame offset — will be measured prior to any
trimming operation. Offset will be defined as the
difference in bottom cavity position with respect to a
leadframe datum. The offset measurement will exclude
leadframe tolerances (see Figure 2).
top to bottom cavity mismatch — characterized by the
fact that the top and bottom cavities in the mold are not
aligned properly, causing a mismatch condition. The
measurement shall be stated as the difference in the top
cavity position relative to the bottom cavity position
(see Figure 1).
package warpage — any non-linear dimensional
change from the mold cavity characteristic, usually
caused by incorrect package design or molding
practices (see Figure 3).
1 ANSI, 1430 Broadway, New York, NY 10018
2 JEDEC, 2001 Eye Street N.W., Washington, D.C. 20006
3 Military Standards, Naval Publications and Form Center, 5801
Tabor Avenue, Philadelphia, PA 19120
parting line protrusions — those plastic excesses which
remain as a normal characteristic after normal molding,
deflashing, trimming, and singulation (see Figure 4).
top, bottom protrusions — those plastic excesses
(includes ejector pin crowns) which remain as a normal
characteristic extending from the smooth surface of the
molded package.
variations in lead location — defined with respect to a
90° angle from the top or bottom of the smooth surface
of the molded package as viewed on the end or side
projections (see Figure 4).
lead shoulder intrusions and protrusions — any
variations in straightness along the defined shoulder
essentially caused by dambar removal (see Figure 4).
lead position overlay (footprint) — (See Figure 5.)
shoulder bend location — measured from the outermost
point of the shoulder bend radius (see Figure 6).
lead co-planarity — defined as the vertical lead
position with respect to a reference plane measured
after forming. The reference plane is defined by the
three lowest leads from the bottom of the package (see
Figure 6).
4 Ordering Information
4.1 Purchase orders for tooling for plastic molded high
density TAB semiconductor packages furnished to this
specification shall include the following items:
1. A package tooling outline drawing showing all
required dimensions listed in Section 5. Package
surface finish to be included.
2. A list of any tolerance limits which differ from
those in Section 6.
3. The type of tooling steel required.
4. The type of leadframe material and temper to be
used.
5. The type of plastic to be molded (if proprietary, a
statement of its shrinkage characteristics) and
molding temperature.
6. Sampling plan shall be determined between vendor
and purchaser.
7. The number of spare parts or expendable parts
desired.
SEMI G36-88 © SEMI 1986, 1988 2
8. Molding press to be used.
9. Electrical power available for heating.
10. Applicable leadframe drawing, including all
dimensions.
5 Dimensions
5.1 Drawing must show dimensions for the following
items, if applicable:
1. Package length
2. Package width
3. Top cavity thickness
4. Bottom cavity thickness
5. Frame thickness
6. Top ejector pin locations from datum lines
7. Bottom ejector pin locations from datum lines
8. Ejector pin sizes (top and bottom)
9. Ejector depth (top and bottom, draft angle top and
bottom side)
10.Pin 1 ID location from package center
11.Pin 1 ID shape and size
12.All applicable package radii
13.Draft angles (top and bottom)
14. Package parting line location
15.Shoulder bend location
6 Product Criteria
6.1 Dimensional tolerance limits for high density TAB
products (see Section 3).
6.1.1 Recognizing that every manufacturing process is
subject to variation, the following list details the
acceptable limit of this variation:
28-328 LEAD
OVERLAP/OFFSET
Cavity Overlap (See Figure 1) 0.002" (maximum)
Cavity Mismatch (See Figure 1 0.002" (maximum)
CAVITY TO FRAME OFFSET
(See Figure 2)
(not including leadframe tolerances)
0.002" (maximum)
PACKAGE WARPAGE
Warp factor (See Figure 3) 2.5 to a max. of
0.003"
PROTRUSIONS & INTRUSIONS
(See Figure 4) Parting line 0.005" (maximum)
Gating 0.005" (maximum)
Top or bottom ejector pin 0.002" (maximum)
VARIATIONS IN LEAD POSITION
(See Figure 4) 0.003" (maximum)
LEAD COPLANARITY
(See Figure 6) 0.002" (maximum)
DAMBAR TRIMMING
INTRUSIONS/PROTRUSIONS
Intrustions (See Figure 6) 0.002" (maximum)
Protrusions (See Figure 4) (shall not
decrease gap more than 20%)
0.003" (maximum)
7 Packaging
Tooling must be packed in containers designed and
constructed to prevent damage and/or contamination.
SEMI G36-88 © SEMI 1986, 19883
Figure 1
Top to Bottom Cavity Mismatch
Figure 2
Cavity to Frame Offset
Figure 3
Package Warpage