semi合集-English.pdf - 第6467页
SEMI G77-0699 © SE MI 1999 8 Symbol Value Specified Datum Measure d From Feature Me asured To z 41 1 mm min i mu m horizonta l datum pla ne bottom of frame cas sette z 43 1 + 0 -1 m m horizo ntal datum pla ne bottom ra i…
SEMI G77-0699 © SEMI 19997
Symbol Value Specified Datum Measured From Feature Measured To
y5 200 mm
maximum
facial datum plane rear outside edge of frame cassette
including rear cover
y9† 92.5 mm facial datum plane
front end of line segment along center of
rear cassette sensing pads
y10† 123.5 mm facial datum plane
rear end of line segment along center of
rear cassette sensing pads
y18† 40.2 mm facial datum plane
near end of line segment along center of
front cassette sensing pads
y19† 61.1 mm facial datum plane
far end of line segment along center of
front cassette sensing pads
y41‡ 30 ± 1 mm facial datum plane
left orientation notch on robotic handling
flange
y44‡ 53 mm
maximum
facial datum plane
encroachment of frame cassette
underneath robotic handling flange
y45‡ 65.3 ± 1 mm facial datum plane nearest point of front and rear position and
orientation notches on robotic handling
flange
y46‡ 71 ± 1 mm facial datum plane front and rear edge of robotic handling
flange
y47‡ 58 mm
minimum
facial datum plane end of robotic handling flange sides
z1 183 mm
maximum
13-frame cassette
303 mm
maximum
25-frame cassette
facial datum plane top of frame cassette
z2† 2 mm
maximum
horizontal datum plane bottom of frame cassette sensing pads
z3 23 mm
maximum
horizontal datum plane internal floor of frame cassette
z4 33 mm horizontal datum plane bottom nominal film frame seating plane
z5 10 mm each nominal film frame seating
plane
adjacent nominal film frame seating
planes
z65 mm
minimum
bottom of film frame support top of film frame support below
z7 10 mm
minimum
top surface of the top frame
support
internal ceiling of frame cassette
z8 15 mm
minimum
horizontal datum plane top of x56 and y1 dimension controlled
area
z9 215 mm horizontal datum plane bottom nominal film frame seating plane
of top stacked cassette (13 slot only)
z12 0 ± 0.5 mm
each nominal tape frame seating
plane
bottom of the tape frame
SEMI G77-0699 © SEMI 1999 8
Symbol Value Specified Datum Measured From Feature Measured To
z41 1 mm
minimum
horizontal datum plane bottom of frame cassette
z43 1 + 0 -1 mm horizontal datum plane bottom rails
z47‡ 210 ± 1 mm
13-frame frame cassette
330 ± 1 mm
25-frame frame cassette
horizontal datum plane bottom of robotic handling flange
z48‡ 15 mm
minimum
bottom of robotic handling flange encroachment of frame cassette top
underneath robotic handling flange
z49‡ 8 mm
maximum
bottom of robotic handling flange top of robotic handling flange
† These dimensions match those of SEMI E1.9 with the same symbol.
‡ These dimensions match those of SEMI E47.1 with the same symbol.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G78-0699 © SEMI 19991
SEMI G78-0699
TEST METHOD FOR COMPARING AUTOMATED WAFER PROBE
SYSTEMS UTILIZING PROCESS-SPECIFIC MEASUREMENTS
This test method was technically approved by the Global Automated Test Equipment Committee and is
the direct responsibility of the North American Automated Test Equipment Committee. Current edition
approved by the North American Regional Standards Committee on December 18, 1998. Initially
available at www.semi.org April 1999; to be published June 1999.
1 Purpose
1.1 To define the terms and provide a means of
comparative, or relative measurement for the automated
wafer prober functions: Accuracy, Repeatability and
Throughput.
2 Scope
2.1 This method may be used to evaluate the
performance of a single automated wafer prober, or as a
means to compare many probers. The probers that this
document addresses are defined as fully automated; that
is, having automatic material handling, alignment and
probing capabilities.
3 Limitations
3.1 This test and comparison meth od is not intended to
represent a statistically complete methodology for
measuring the performance of an automated wafer
prober. Its correct use is a practical means to compare
the stepping capabilities of wafer probers within a
specific end user’s environment.
3.2 The definitions of the terms “Repeatability” and
“Accuracy” as used in this document are not in
accordance with those of the National Conference of
Standards Laboratories (NCSL) nor are they intended to
be. They are to be used solely for the purpose of this
document and have no other intended uses.
3.3 It is difficult to characterize an d eliminate high
temperature contributions to positional error such as
probe needle ‘float’. Therefore, it is strongly
recommended that the same probe card be used to
evaluate all of the probers being considered.
3.4 It is recommended that the pro be card is verified to
be in the same condition (i.e. evaluated for positional
accuracy and overall functional condition) both before
and after the conclusion of each test.
3.5 Bump placement on a semiconductor device is
generally located ± 0.001" with respect to their nominal
location. Vertical probe cards used to probe bumps
have an inherent amount of needle drift. Therefore care
must be exercised in using vertical probe cards on
bump devices as a means of prober accuracy
measurement.
4 Referenced Documents
NOTE: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
4.1 SEMI Documents
SEMI E10 — Standard for Definition and Measurement
of Equipment Reliability, Availability and
Maintainability (RAM)
SEMI S2 — Safety Guidelines for Semiconductor
Manufacturing Equipment
5 Terminology
5.1 3
σ
limit — a statistically deriv ed measurement of
process variation. A process that allows a ± 3σ
deviation will allow 2.7 parts per thousand to be outside
the established bounds.
5.2 accuracy — the ability of an a utomatic wafer
prober to index its chuck, and attached wafer, from an
initial position to a subsequent position and make
contact with a static probe tip at a nominal location on
the wafer. In the context of this method, accuracy is
defined as average die offset.
5.2.1 Average die offset is the perpe ndicular distance
measured from the centerline of the die pad to a parallel
line that statistically represents the scrub mark data
point distribution center (see Figure 1). Each data point
shown in this figure represents only the center value of
accumulated scrub marks produced by operation of this
method.
5.2.2 It should be noted that accuracy established by
this method is characteristic of the system, which in
total represents both the automated prober as well as its
probe card. Finally, this method establishes two
accuracy values, a value for pads along the X and Y
axes of the die. These axis directions are arbitrary.
5.2.3 It should be noted that if fully automated prober
set-up modes are not used for probe-needle-to-pad
alignment during testing, the possibility of operator
error should be considered as a variable when
evaluating system accuracy.
5.3 automatic wafer prober — device that
automatically and repeatedly aligns the die bonding