semi合集-English.pdf - 第7175页

SEMI S23-0705 © SEMI 2005 8  The use rate data that is measured at vari ous times.  The one or several sets of c onversion factors used t o estimate equivalent e nergy consumption.  Th e target date by which the impro…

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SEMI S23-0705 © SEMI 2005 7
#2
Source for N
2
: ISMT (presented by Walter Worth at 10th International Semiconductor Environment, Safety and Health Conference).
#3
The Heat Load conversion factor expresses the amount of energy required to remove (i.e. refrigerate) 1 kWh of radiant energy from the
equipment environment.
#4
The units for gas pressure of “kg/cm
2
” are technically incorrect (because kg is a unit of mass, not force), but they are customary in some
regions. The “kg” may be understood as “kilograms force”. One kilogram force is equal to 9.81 Newtons. Therefore, 1 kg
f
/cm
2
is equal to
9.81N/cm
2
= 98.1E + 3 Pa.
11 Target Setting and Improvement
11.1 Using the use rate data and the equivalent energy conversion outcomes from baseline process recipes as a
measure of success, the equipment supplier should set target energy conservation, and utilities and materials use rate
levels for the equipment and develop timelines for achieving them. The equipment supplier should also present a
clear justification for each target.
11.2 The equipment supplier should discuss energy conservation improvement plans and utilities and materials use
rate improvement plans with the users before implementing them so that the cost-benefit balance and its related
assumptions can be more fully understood by all both parties.
11.3 Energy consumption reduction, and utilities and materials use rate reduction should be achieved through
various means such as equipment design changes or recipe changes.
11.4 A more energy efficient method for the production of a particular utility or material can also significantly
change the equipment’s energy impact. The equipment supplier may wish to recommend to the users that utilities or
materials be provided in a particular manner or from a particular source to achieve the best energy impact.
11.5 Equipment suppliers can also work with end users to understand the impact of their utility needs on the
operating efficiency of end user utilities. Examples of these include decreasing the Room Heat Burden by means of
increased cooling water heat transfer, decreased exhaust pressure drops, decreased cooling water heat exchanger
pressure drops, etc. All of these changes, while not necessarily decreasing the utility use rate, may have a significant
environmental impact.
11.6 There is a certain expense of time and materials for making a change to equipment. However, there may also
be a benefit in reducing utility and material use rate. It is recommended that the cost/benefit balance be carefully
analyzed before undertaking an equipment change.
11.7 The following are a few ideas for reducing equipment energy consumption that may be feasible. There are
certainly many more.
Use the highest available voltage for the region of operation as the primary feed voltage (e.g., 300V Japan,
380V China, 480V USA and Taiwan, 240V or 400V Europe).
Use warmer cooling water.
Increase cooling water heat exchanger mean temperature difference.
Decrease exhaust and cooling water pressure drops.
Reduce bulk gas minimum supply pressures.
Use less pure processing chemicals.
Use clean dry air for pneumatic controls instead of nitrogen.
Use control systems to activate exhaust only when needed.
11.8 The equipment suppliers should prepare an improvement roadmap which should focus on the use rate of one or
several specific utilities or materials, or they should focus on the related equivalent energy impact, or both.
11.9 The following data should be considered to be included in an improvement roadmap.
The type of equipment (model, options, configuration).
The utilities and materials that are targeted for improvement.
The baseline recipe(s) that will be used to demonstrate progress.
SEMI S23-0705 © SEMI 2005 8
The use rate data that is measured at various times.
The one or several sets of conversion factors used to estimate equivalent energy consumption.
The target date by which the improvement (by specific utility/material or overall) will be achieved.
Information describing why a target seems achievable and, generally speaking, how it will be achieved.
A cost/benefit analysis on the equipment upgrade.
12 Monitoring and Reporting
12.1 Monitoring
12.1.1 The equipment supplier should review the improvement status periodically and update the roadmap to
monitor the conservation progress. A period of once every two years is recommended.
12.1.2 If the review indicates that targets have not (or will not) be achieved, it is useful to document the reasons as
part of the roadmap data and to re-adjust the target dates and achievement strategy based on the most recent
information.
12.2 Reporting
12.2.1 The equipment supplier should report to the users energy data, utilities and material use rate data and related
improvement roadmaps for the equipment.
12.2.2 The reports should contain the roadmap data addressed in ¶11.9 at a minimum.
12.2.3 The equipment suppliers should also consider including data that the users would like to have included in the
report.
NOTE 16: The equipment supplier should be careful not to include in the reports any information that is identified as
confidential to any party involved unless appropriate non-disclosure agreements are in place. Specific recipes, desired effects to
the substrate, methods of achieving energy conservation and forecasted results are examples of information that may be, or may
contain parts that are, confidential.
13 Related Documents
13.1 ISMT Documents
2
ISMT Utilities Consumption Characterization Protocols for Semiconductor Tools, TT #00043939A-ENG
ISMT Environmental, Safety and Health (ESH) Metrics for Semiconductor Manufacturing Equipment (SME),
TT #02034261A-TR
13.2 SEAJ Documents
3
SEAJ-E-002E Guideline for Energy Quantification on Semiconductor Manufacturing Equipment and Utilities
SEAJ-EP-003E Guideline for conducting an LCA of Semiconductor Manufacturing Equipment – Energy Saving
Perspective
SEAJ-E-001E Power Measurement Protocol for Semiconductor Equipment
2 International SEMATECH, 2706 Montopolis Drive, Austin, TX, website http://www.sematech.org
3 Semiconductor Equipment Association of Japan, 7-10 Shinjuku 1-chome Shinjuku-ku, Tokyo, 160-0022, Japan, Phone 81.3.3353.7589, Fax
81.3.3353.7970, website http://www.seaj.or.jp
SEMI S23-0705 © SEMI 2005 9
RELATED INFORMATION 1
ADDITIONAL USE RATE MEASUREMENT AND CONVERSION
FACTOR INFORMATION
NOTICE: This related information is not an official part of SEMI S23 and was derived from the Japanese
Environmental, Health, & Safety committee. This related information was approved for publication by full letter
ballot on May 20, 2005.
NOTE: This RI is a summary of SEAJ document “SEAJ-E-002E Guideline for Energy Quantification on
Semiconductor Manufacturing Equipment and Utilities” and was approved to be published as related information of
this document as written.
R1-1 Other Use rate Measurements and Data
R1-1.1 Equipment recipes describe how the various controls of the equipment should be set in order to achieve a
desired effect on the substrate or other material being treated by the equipment. Because equipment control elements
are different from equipment to equipment, the parameters of a recipe will also be different even if the desired effect
on the substrate or other material is the same.
R1-1.2 Within this guide, “baseline recipe” should be understood as the collection of recipe parameters intended to
produce a specific desired effect. Therefore, the desired effect can be the same from equipment to equipment even
though the parameters of the recipes may be different.
R1-1.3 For processing measurements, the average value of each parameter over the course of the processing cycle
should be noted. If the equipment processes substrates, a 10 substrate average should be recorded. If the equipment
processes a material other than substrates (e.g. a vacuum pump), the average over a 30 minute processing period
should be recorded.
R1-1.4 For idle measurements, the average value of each parameter over a period of 30 minutes should be recorded
R1-1.5 A supplier may need to measure additional metrics for other purposes (e.g. to support other metrics-
gathering requirements and criteria relevant to supplier-user agreements). Adding those metrics to the energy
conservation utility and material use rate measurement effort may be beneficial.
R1-1.6 Semiconductor manufacturing equipment typically processes wafers or other substrates. It is useful to
characterize utility and material use rate during processing in terms of per-wafer amounts needed to achieve the
desired effect of the recipe.
R1-1.7 By providing an equipment throughput metric (i.e., substrates per hour) with supporting throughput
calculation information, the per hour processing metrics can be converted, approximately, into “per wafer” metrics.
With further calculations based on the useful area of the wafers processed, the utilities and materials used per cm
2
during processing can be estimated.
R1-1.8 The data described in Table R1-1 should be recorded in addition to the use rate data of Table 1 in the main
body of this guide. The goal is to record enough information to document the measurement event thoroughly so that
it can be reproduced at a later time, perhaps, for example, to analyze the effect of equipment changes.
R1-1.9 Some of the data (e.g. wafer size) in Table R1-1 may not be applicable to the equipment under
consideration.
Table R1-1 Recommended Additional Data to Record for the Measurement Event
Data Title Description
Date When the measurements were taken.
Equipment Under Test (EUT) The equipment from which the measurements taken. Provide
information such as general description, model number, and serial
number.
EUT Configuration The configuration of the equipment during the measurements, such as
sub-systems that were or were not used and optional hardware that was
installed.