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SEMI G42-0996 © SEMI 1986, 2004 10 Figure 7 Thermal Test Board — Pin Grid Array Package Unit: mm 1. Material: Epoxy Glass 1.5 mm thickn ess, FR-4 (Green). 2. Gold Plated Fingers: 0.8 µ m M in, 18 pad on Each side 3. Fabr…

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SEMI G42-0996 © SEMI 1986, 2004 9
Figure 6
Thermal Test Board — 0.65 mm Pitch Quad Flat Package
Unit: mm
1. Material — Epoxy Glass 1.52–1.65 mm thickness, FR-4 (Green). Copper Clad. 28.3 g (1 Oz.) 1/1
2. Gold-Plated Fingers — 0.8 µm Min. Thickness, 18 on Each Side
3. Fabricate — IPC-D-320, Class III
4. Tolerance — ± 0.1 mm (Unless noted)
5. Fingers on Component Side of Board — Designed as A thru R, Fingers on Solder Side of Board — Designated
as 1 thru 18 (with 18 at Right When Viewing Face of Board)
6. All Holes Plated Thru
7. Mates with Dale Connector Part Number EB 7D-A18GFX or Equivalent
SEMI G42-0996 © SEMI 1986, 2004 10
Figure 7
Thermal Test Board — Pin Grid Array Package
Unit: mm
1. Material: Epoxy Glass 1.5 mm thickness, FR-4 (Green).
2. Gold Plated Fingers: 0.8 µm Min, 18 pad on Each side
3. Fabricate: IPC-D-320 Glass III
4. Tolerance: + 0.1 mm (Unless noted)
SEMI G42-0996 © SEMI 1986, 2004 11
Figure 8
Thermal Test Board — Ball Grid Array Package
Unit: mm
1. Material: Epoxy Glass 1.5 mm thickness, FR-4 (Green).
2. Gold Plated Fingers: 0.8 µm Min. 18 pad on Each side
3. Fabricate: IPC-D-320 Class III
4. Tolerance: ± 0.1 mm (Unless noted)