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SEMI E6-0303 © SEMI 1982, 2003 2 5 Terminology NOTE 1: A complete list of equipment installa tion terminology can be found in SEMI E70. 5.1 Definitions 5.1.1 idle — the condition where the equipment is energized and read…
SEMI E6-0303 © SEMI 1982, 2003 1
SEMI E6-0303
GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION
DOCUMENTATION
This guide was technically approved by the Global Facilites Committee and is the direct responsibility of the
North American Facilities Committee. Current edition approved by the North American Regional Standards
Committee on November 22, 2002. Initially available at www.semi.org January 2003; to be published March
2003. Originally published in 1982; previously published December 1996.
NOTICE: This document was balloted as a complete
rewrite of SEMI E6 in 2002.
1 Purpose
1.1 Within the semiconductor industry, the diversity
and complexity of equipment creates difficult
challenges for facilities design and equipment
installation. This guide should benefit equipment
suppliers and semiconductor manufacturers by
communicating, in a standardized way, the information
necessary to prepare the facility and to efficiently install
semiconductor equipment.
2 Scope
2.1 This standard applies to the facilities interface of
all semiconductor production equipment and supplier-
provided support equipment.
2.2 The recommended equipment installation
documentation should cover all installation
requirements from receiving until hookup is complete.
2.3 The series of data sheets included should address
all site facilities necessary to support semiconductor
equipment processing.
2.4 The data sheets provide a consistent format for
both the equipment supplier and equipment purchaser
to use in compiling and interpreting equipment
installation data.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 SEMI E6 applies to the facility interface of
semiconductor equipment only. Other equipment
interfaces, such as the physical interfaces for material
handling (see SEMI E106 and related standards) and
software interfaces (see SEMI Information and Control
Standards) are defined by other SEMI Standards.
3.2 This guide is not intended to address the internal
connections of the equipment that are typically
completed by the equipment supplier. This document
includes only information related to the utility
connections on the equipment or support equipment
that are the responsibility of the semiconductor
manufacturer’s equipment installation team.
3.3 This guide is not intended to address the
documentation provided for equipment start-up,
qualification, or commissioning.
4 Referenced Standards
4.1 SEMI Standards
SEMI E30 — Generic Model for Communications and
Control of Manufacturing Equipment (GEM)
SEMI E52 — Practice for Referencing Gases Used in
Digital Mass Flow Controllers
SEMI E63 — Mechanical Specification for 300 mm
Box Opener/Loader to Tool Standard (BOLTS-M)
Interface
SEMI E70 — Guide for Tool Accommodation Process
SEMI E72 — Specification and Guide for 300 mm
Equipment Footprint, Height, and Weight
SEMI E73 — Specification for Vacuum Pump
Interfaces - Dry Pumps
SEMI E74 — Specification for Vacuum Pump
Interfaces - Turbomolecular Pumps
SEMI E76 — Guide for 300 mm Process Equipment
Points of Connection to Facility Services
SEMI E106 — Provisional Overview Guide to SEMI
Standards for Physical Interfaces and Carriers for 300
mm Wafers
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
SEMI E6-0303 © SEMI 1982, 2003 2
5 Terminology
NOTE 1: A complete list of equipment installation
terminology can be found in SEMI E70.
5.1 Definitions
5.1.1 idle — the condition where the equipment is
energized and readied for processing (all systems ready
and temperatures controlled) but is not actually
performing any active function such as material
movement or processing.
5.1.1.1 idle average flow — the average flow rate
when the equipment is in idle condition. Idle average
flow should be measured at the equipment point of
connection.
5.1.2 maximum pressure — the highest supply pressure
that can be used for the equipment to operate correctly.
Maximum pressure should be measured at the
equipment point of connection and may be driven by
process requirements or component limits.
5.1.3 maximum pressure fluctuation — the maximum
supply pressure change during the processing cycle for
the equipment to operate correctly.
5.1.4 minimum pressure — the minimum supply
pressure that must be maintained or exceeded for the
equipment to operate correctly. Minimum pressure
should be measured at the equipment point of
connection.
5.1.5 processing cycle — a sequence wherein all of the
material contained in a processing unit is processed.
This is often used as a measure of action or time [SEMI
E30]. (See Figure 1.)
5.1.5.1 process average flow — the average flow rate
over the processing cycle. Process average flow should
be measured at the equipment point of connection.
6 Ordering and Use
6.1 Semiconductor manufacturers may use this
standard when procuring semiconductor equipment to
specify type and format of facility interface information
to be provided by equipment supplier.
6.2 Orders for semiconductor equipment in accordance
with this standard should include the standard number
and date of issue. The request should also include
documentation due date, the data transmission method,
file format for data, file format for drawings, and any
additional information to be included that is not covered
in SEMI E6.
6.3 Roles and Responsibilities — The equipment
supplier submits information requested in SEMI E6.
Unless otherwise specified, equipment suppliers should
submit the utilities and installation information prior to
the equipment ship date. The semiconductor
manufacturer’s equipment engineers, facilities
engineers, and installation managers use equipment
information provided to prepare the facility and
efficiently install the tool.
7 Installation Documentation
Recommendations
7.1 Consider every step from receiving until hookup is
complete. All requirements should be indicated. The
following is a list of recommended equipment
installation documentation to be provided by the
equipment supplier.
7.1.1 Administrative Interface Information — The
administrative interface information should include an
installation contacts sheet naming all relevant supplier
and purchaser contacts for commercial and technical
questions. Also included should be installation roles
and responsibilities for the supplier and purchaser. (See
Related Information 1 at the end of this document.)
7.1.2 Shipping and Receiving Information —
Documentation should include information such as
container inventory, storage, and unpacking
instructions. Suppliers should include information about
the size, weight, type and number of containers in
which this equipment is shipped. Include detailed lists
of all supplied components and parts. How the
containers are to be received, handled and stored should
be documented. Any special staging, inspection, and
uncrating instructions should be provided. If containers
cannot be unloaded by hand the necessary equipment
should be listed. (See Related Information 2.)
7.1.3 Move-in, Placement, and Assembly Instructions
— Documentation should include information such as
moving, positioning, wall mounting, leveling,
alignment, floor loading, floor mounting, pedestal
mounting, and seismic restraint of equipment. Detailed
instructions should be provided for all assembly and
hookup steps required to make the equipment
functional. List any necessary parts, resources and
special equipment to be provided by the purchaser. (See
Related Information 3.)
7.1.4 Installation ESH Information — Document any
concerns relating to environmental, safety, and health
aspects of installation of the equipment (see related
SEMI Safety Guidelines).
7.1.5 Data Sheets and Drawings — Recommended
data sheets are defined in the following sections of this
document. Equipment suppliers should reference and
provide all necessary equipment drawings and
schematics with these data sheets. (See Sections 9
through 19.)
SEMI E6-0303 © SEMI 1982, 2003 3
NOTE 2: Additional documentation covering items such as
testing, training, sign-off, qualification, and commissioning
should also be provided as necessary to complete the tool
accommodation process making the equipment process
capable.
NOTE 3: See SEMI E76 for 300 mm equipment point of
connection documentation recommendations, point of
connection location recommendations, as well as
recommendations for providing pre-facilitation templates and
jigs.
8 Data Sheets Overview
8.1 The following table shows the data sheets included
in SEMI E6.
Data Sheet
Number
Data Sheet Title
100 Equipment Identification
200 Environmental Conditions
300 Physical Characteristics
400 Electrical Power
500 Water
600 Bulk Chemicals
700 Drains
800 Gases
900 Vacuum
1000 Exhaust
8.2 Equipment suppliers should provide data for all
necessary facilities even if not specifically covered in
the data sheets included in this standard. (See Section
19, Other Data Sheets)
8.3 Data Sheet Format
8.3.1 The data sheets in this document are designed to
facilitate use of electronic communication and database
storage of the facility interface information.
8.3.2 The format shown also provides a
recommendation for printed output of the information.
8.3.3 The data sheets shown define data relationships
that can be used for spreadsheet or database storage of
the information.
• A number, 100–1000, identifies each datasheet.
• A letter, starting with A, identifies each column of
the data sheet.
• A number, starting with 1, identifies each row of
the data sheet.
• Data item names are in the first row of each data
sheet.
• Units of measure for the data are in the second row
of each data sheet. (In many cases a simple data
definition such as text or number is provided in this
row.)
• Specific equipment data starts in row 3 of each data
sheet. One row per equipment component in data
sheets 200 and 300. One row per connection in
data sheets 400 through 1000.
8.4 Data Entry
8.4.1 As defined above, data entry involves the first
three rows. Row 1 identifies data item. Enter the unit of
measure for data in row 2. For example: mm. Specific
equipment data will be entered starting in row 3.
8.4.1.1 Preferred units of measure are listed in row 2 of
each data sheet. If data entered is in units different from
the units specified in row 2 change the units specified in
row 2 to match the data. If two units of measure are
shown in row 2 select the unit of measure that matches
the entered data.
8.4.1.2 Data values should be entered in the units of
measure used to design the equipment.
8.4.1.3 Data values should be entered as numbers only.
For example: 12.0 or 300 (Do NOT enter 300 mm).
8.4.1.4 Not every data item will have a value because
all data items do not apply to all equipment. The
equipment supplier should insert n/a (not applicable)
for any item that does not apply to that particular
equipment component or connection. Do NOT use the
n/a designation in place of missing data or data that is
not available. If data is applicable to the equipment and
not available leave the cell blank. If necessary, include
reason for blank cells in comments cell.
8.4.2 The unique Equipment Component identifier is
the first column, A, of each data sheet 200–1000.
8.4.2.1 The data sheets are designed to document all
facilities connections including connections made to
support equipment; therefore a unique equipment
component name should be used to locate each
connection. Included equipment components should be
the mainframe unit plus any other support equipment
provided by the equipment supplier, including but not
limited to vacuum pumps, process chambers, load lock
pumps, water heaters, gas boxes, gas panels, chillers,
radio frequency generators, and electrical power
distribution panels.
8.4.3 The unique Connection Number is the second
column, B, of each data sheet 400–1000.